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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Total RAM Bits | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Flash Size | Primary Attributes | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. S912ZVML12F1WKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318052528 | OBSOLETE | 0000.00.0000 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | LINbus, SCI, SPI | DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||||||||||||||||
| NXP USA Inc. S912ZVML32F1MKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323865557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||||||||||||||||
| NXP USA Inc. S912ZVML64F1MKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312248528 | OBSOLETE | 0000.00.0000 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||||||||||||||||
| NXP USA Inc. S912ZVML64F1WKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320389528 | OBSOLETE | 0000.00.0000 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||||||||||||||||
| NXP USA Inc. S912ZVML64F2VKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313143557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||||||||||||||||
| NXP USA Inc. S912ZVML64F2WKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320695557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||||||||||||||||
| NXP USA Inc. MC8640HJ1067NE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Tray | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 994-BCBGA, FCCBGA | MC8640HJ1067 | 994-FCCBGA (33x33) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935343658557 | OBSOLETE | 0000.00.0000 | 24 | PowerPC e600 | 1.067GHz | 1 Core, 32-Bit | - | DDR, DDR2 | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | - | DUART, HSSI, I²C, RapidIO | |||||||||||||||||||||
| NXP USA Inc. MC8640THJ1067NE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 994-BCBGA, FCCBGA | MC8640THJ1067 | 994-FCCBGA (33x33) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935343661557 | OBSOLETE | 0000.00.0000 | 24 | PowerPC e600 | 1.067GHz | 1 Core, 32-Bit | - | DDR, DDR2 | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | - | DUART, HSSI, I²C, RapidIO | |||||||||||||||||||||
| NXP USA Inc. MC8640VJ1250HE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Tray | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 994-BCBGA, FCCBGA | MC8640VJ1250 | 994-FCCBGA (33x33) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315503557 | OBSOLETE | 0000.00.0000 | 24 | PowerPC e600 | 1.25GHz | 1 Core, 32-Bit | - | DDR, DDR2 | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | - | DUART, HSSI, I²C, RapidIO | |||||||||||||||||||||
 |
Nuvoton Technology Corporation W83667HG-AC TR | Nuvoton Technology Corporation |
Min: 1 Mult: 1 |
/image/Nuvoton Technology Corporation | * | Tape & Reel (TR) | Obsolete | Not Verified | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | |||||||||||||||||||||||||||||||||||||||
|
Nuvoton Technology Corporation W83667HG-B TR | Nuvoton Technology Corporation |
Min: 1 Mult: 1 |
/image/Nuvoton Technology Corporation | * | Tape & Reel (TR) | Obsolete | W83667 | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 500 | |||||||||||||||||||||||||||||||||||||||
| Renesas Electronics America Inc R5F10PMJLFB#V5 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RL78/F14 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | R5F10 | 80-LFQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 68 | RL78 | 16-Bit | 32MHz | CANbus, CSI, I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 8K x 8 | 20K x 8 | 2.7V ~ 5.5V | A/D 25x10b SAR; D/A 1x8b | Internal | |||||||||||||||||||||
| Microchip Technology PIC18F24K42T-I/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K, Functional Safety (FuSa) | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-UFQFN Exposed Pad | PIC18F24 | 28-UQFN (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,300 | 25 | PIC | 8-Bit | 64MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | 16KB (8K x 16) | FLASH | 256 x 8 | 1K x 8 | 2.3V ~ 5.5V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||||||||||
| Microchip Technology PIC18F24K42T-I/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K, Functional Safety (FuSa) | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | PIC18F24 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,600 | 25 | PIC | 8-Bit | 64MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | 16KB (8K x 16) | FLASH | 256 x 8 | 1K x 8 | 2.3V ~ 5.5V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||||||||||
| Microchip Technology PIC18F25K42T-I/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K, Functional Safety (FuSa) | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-UFQFN Exposed Pad | PIC18F25 | 28-UQFN (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,300 | 25 | PIC | 8-Bit | 64MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | 32KB (16K x 16) | FLASH | 256 x 8 | 2K x 8 | 2.3V ~ 5.5V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||||||||||
| Microchip Technology PIC18F25K42T-I/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K, Functional Safety (FuSa) | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | PIC18F25 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,600 | 25 | PIC | 8-Bit | 64MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | 32KB (16K x 16) | FLASH | 256 x 8 | 2K x 8 | 2.3V ~ 5.5V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||||||||||
| Microchip Technology PIC18LF24K42T-I/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-UFQFN Exposed Pad | PIC18LF24 | 28-UQFN (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,300 | 25 | PIC | 8-Bit | 64MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | 16KB (8K x 16) | FLASH | 256 x 8 | 1K x 8 | 1.8V ~ 3.6V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||||||||||
| Microchip Technology PIC18LF25K42T-I/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-UFQFN Exposed Pad | PIC18LF25 | 28-UQFN (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,300 | 25 | PIC | 8-Bit | 64MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | 32KB (16K x 16) | FLASH | 256 x 8 | 2K x 8 | 1.8V ~ 3.6V | A/D 24x12b; D/A 1x5b | Internal | |||||||||||||||||||||
| AMD XCZU9CG-2FFVB1156E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | 0°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU9 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 328 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||||
| AMD XCZU9EG-2FFVC900E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU9 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 204 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||||
| AMD XCZU9EG-3FFVB1156E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU9 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 328 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 600MHz, 1.5GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||||
| AMD XCZU9EG-3FFVC900E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU9 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 204 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 600MHz, 1.5GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||||
| AMD XCKU5P-L1FFVB676I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Kintex® UltraScale+™ | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 676-BBGA, FCBGA | XCKU5 | Not Verified | 0.698V ~ 0.876V | 676-FCBGA (27x27) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | 41984000 | 280 | 27120 | 474600 | ||||||||||||||||||||||||||||
| AMD XCVU3P-2FFVC1517E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Virtex® UltraScale+™ | Tray | Active | 0°C ~ 100°C (TJ) | Surface Mount | 1517-BBGA, FCBGA | XCVU3 | Not Verified | 0.825V ~ 0.876V | 1517-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 3A001A7B | 8542.39.0001 | 1 | 130355200 | 520 | 49260 | 862050 | ||||||||||||||||||||||||||||
| AMD XCZU9EG-1FFVB1156I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU9 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 328 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||||
| AMD XCZU9CG-1FFVC900E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | 0°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU9 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 122-2034 | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 204 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | |||||||||||||||||||||||||
| AMD XCKU5P-1FFVA676E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Kintex® UltraScale+™ | Tray | Active | 0°C ~ 100°C (TJ) | Surface Mount | 676-BBGA, FCBGA | XCKU5 | Not Verified | 0.825V ~ 0.876V | 676-FCBGA (27x27) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | 41984000 | 256 | 27120 | 474600 | ||||||||||||||||||||||||||||
| AMD XCKU5P-1FFVB676I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Kintex® UltraScale+™ | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 676-BBGA, FCBGA | XCKU5 | Not Verified | 0.825V ~ 0.876V | 676-FCBGA (27x27) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | 41984000 | 280 | 27120 | 474600 | ||||||||||||||||||||||||||||
| AMD XCZU6EG-1FFVB1156E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU6 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 328 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ||||||||||||||||||||||||||
| AMD XCZU9EG-2FFVC900I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU9 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 204 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
