Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Silicon Labs EFM32TG210F32-QFN32 | Silicon Labs |
Min: 1 Mult: 1 |
/image/Silicon Labs | Tiny Gecko | Tape & Reel (TR) | Discontinued at Digi-Key | -40°C ~ 85°C (TA) | Surface Mount | 32-VQFN Exposed Pad | EFM32TG210 | 32-QFN (6x6) | download | 3 (168 Hours) | 5A992C | 8542.31.0001 | 1,000 | 24 | ARM® Cortex®-M3 | 32-Bit Single-Core | 32MHz | EBI/EMI, I²C, IrDA, SmartCard, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 4K x 8 | 1.85V ~ 3.8V | A/D 4x12b; D/A 1x12b | Internal | ||||
Silicon Labs EFM32TG230F16-QFN64 | Silicon Labs |
Min: 1 Mult: 1 |
/image/Silicon Labs | Tiny Gecko | Tape & Reel (TR) | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | EFM32TG230 | 64-QFN (9x9) | download | 3 (168 Hours) | 5A992C | 8542.31.0001 | 1,000 | 56 | ARM® Cortex®-M3 | 32-Bit Single-Core | 32MHz | EBI/EMI, I²C, IrDA, SmartCard, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 4K x 8 | 1.85V ~ 3.8V | A/D 8x12b; D/A 2x12b | Internal | ||||
NXP USA Inc. MC9S08JE128CLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | MC9S08 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310258557 | 3A991A2 | 8542.31.0001 | 800 | 33 | S08 | 8-Bit | 48MHz | I²C, SCI, SPI, USB | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 12K x 8 | 1.8V ~ 3.6V | A/D 6x12b | Internal | |
NXP USA Inc. MC9S08JE128VLK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MC9S08 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 960 | 46 | S08 | 8-Bit | 48MHz | I²C, SCI, SPI, USB | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 12K x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | ||
NXP USA Inc. MC9S08JE64CLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | MC9S08 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310259557 | 3A991A2 | 8542.31.0001 | 800 | 33 | S08 | 8-Bit | 48MHz | I²C, SCI, SPI, USB | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 12K x 8 | 1.8V ~ 3.6V | A/D 6x12b | Internal | |
NXP USA Inc. MC9S08MM128VMB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 81-LBGA | MC9S08 | 81-MAPBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,200 | 47 | S08 | 8-Bit | 48MHz | I²C, SCI, SPI, USB | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 12K x 8 | 1.8V ~ 3.6V | A/D 8x16b; D/A 1x12b | Internal | ||
NXP USA Inc. MC9S08MM64VLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MC9S08 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325511557 | 3A991A2 | 8542.31.0001 | 800 | 33 | S08 | 8-Bit | 48MHz | I²C, SCI, SPI, USB | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 12K x 8 | 1.8V ~ 3.6V | A/D 6x16b; D/A 1x12b | Internal | |
NXP USA Inc. MC9S08QE8CFM | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | MC9S08 | 32-QFN (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 26 | S08 | 8-Bit | 20MHz | I²C, LINbus, SCI, SPI | LVD, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 10x12b | Internal | ||
NXP USA Inc. MC9S08SH8CWJR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MC9S08 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,000 | 17 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | ||
NXP USA Inc. MCF51MM256CMB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51MM | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 81-LBGA | MCF51 | 81-MAPBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,200 | 48 | Coldfire V1 | 32-Bit Single-Core | 50MHz | CANbus, EBI/EMI, I²C, SCI, SPI, USB OTG | LVD, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.8V ~ 3.6V | A/D 8x16b; D/A 1x12b | External | ||
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NXP USA Inc. MCF51MM256CML | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51MM | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 104-LFBGA | MCF51 | 104-MAPBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 720 | 69 | Coldfire V1 | 32-Bit Single-Core | 50MHz | CANbus, EBI/EMI, I²C, SCI, SPI, USB OTG | LVD, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.8V ~ 3.6V | A/D 8x16b; D/A 1x12b | External | |
NXP USA Inc. MCF51MM256VLL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51MM | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MCF51 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 450 | 65 | Coldfire V1 | 32-Bit Single-Core | 50MHz | CANbus, EBI/EMI, I²C, SCI, SPI, USB OTG | LVD, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.8V ~ 3.6V | A/D 8x16b; D/A 1x12b | External | ||
NXP USA Inc. MCF53017CMJ240J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5301x | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 256-LBGA | MCF53017 | 256-MAPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 450 | 83 | Coldfire V3 | 32-Bit Single-Core | 240MHz | EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG | DMA, PWM, WDT | - | ROMless | - | 128K x 8 | 1.08V ~ 3.6V | - | Internal | ||
NXP USA Inc. MCF54416CMJ250 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5441x | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 256-LBGA | MCF54416 | 256-MAPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310465557 | 3A991A2 | 8542.31.0001 | 450 | 87 | Coldfire V4 | 32-Bit Single-Core | 250MHz | 1-Wire®, CANbus, EBI/EMI, Ethernet, I²C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG | DMA, PWM, WDT | - | ROMless | - | 64K x 8 | 1.14V ~ 1.32V | A/D 8x12b; D/A 2x12b | Internal | |
NXP USA Inc. MPC5554MZP80 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC55xx Qorivva | Tray | Not For New Designs | -40°C ~ 125°C (TA) | Surface Mount | 416-BBGA | MPC5554 | 416-PBGA (27x27) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 935322744557 | 3A991A2 | 8542.31.0001 | 200 | 256 | e200z6 | 32-Bit Single-Core | 82MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM, WDT | 2MB (2M x 8) | FLASH | - | 64K x 8 | 1.35V ~ 1.65V | A/D 40x12b | External | |
NXP USA Inc. PK10X128VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | PK10 | 144-MAPBGA (13x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 1 | 104 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 37x16b; D/A 2x12b | Internal | |||
NXP USA Inc. PK30N512VLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K30 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | PK30 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 1 | 102 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LCD, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 31x16b; D/A 2x12b | Internal | |||
NXP USA Inc. PK30N512VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K30 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | PK30 | 144-MAPBGA (13x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 1 | 102 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LCD, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 31x16b; D/A 2x12b | Internal | |||
NXP USA Inc. PK40N512VLK100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K40 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | PK40 | 80-FQFP (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 52 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LCD, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 20x16b; D/A 1x12b | Internal | |||
NXP USA Inc. PK60N512VLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Bulk | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | PK60 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 27x16b; D/A 2x12b | Internal | |||
NXP USA Inc. PK10N512VLK100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | PK10 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 1 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 27x16b; D/A 1x12b | Internal | ||
NXP USA Inc. PK20N512VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | PK20 | 144-MAPBGA (13x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 1 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 33x16b; D/A 2x12b | Internal | |||
NXP USA Inc. PK20X128VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | PK20 | 144-MAPBGA (13x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 1 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 33x16b; D/A 2x12b | Internal | |||
NXP USA Inc. PK30X128VLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K30 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | PK30 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 1 | 102 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LCD, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 31x16b; D/A 2x12b | Internal | |||
NXP USA Inc. PK30X256VLQ100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K30 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | PK30 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 1 | 102 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LCD, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 64K x 8 | 1.71V ~ 3.6V | A/D 31x16b; D/A 2x12b | Internal | |||
NXP USA Inc. PK40X256VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K40 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | PK40 | 144-MAPBGA (13x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 98 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LCD, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 64K x 8 | 1.71V ~ 3.6V | A/D 27x16b; D/A 2x12b | Internal | |||
NXP USA Inc. PK60N256VMD100 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | PK60 | 144-MAPBGA (13x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 27x16b; D/A 2x12b | Internal | |||
NXP USA Inc. MCF51JE256CMB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51JE | Box | Active | -40°C ~ 85°C (TA) | Surface Mount | 81-LBGA | MCF51 | 81-MAPBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314178557 | 3A991A2 | 8542.31.0001 | 1,200 | 48 | Coldfire V1 | 32-Bit Single-Core | 50MHz | EBI/EMI, I²C, SCI, SPI, USB OTG | LVD, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.8V ~ 3.6V | A/D 12x12b; D/A 1x12b | External | |
NXP USA Inc. MCF51JE256VMB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51JE | Box | Active | -40°C ~ 105°C (TA) | Surface Mount | 81-LBGA | MCF51 | 81-MAPBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310204557 | 3A991A2 | 8542.31.0001 | 1,200 | 48 | Coldfire V1 | 32-Bit Single-Core | 50MHz | EBI/EMI, I²C, SCI, SPI, USB OTG | LVD, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.8V ~ 3.6V | A/D 12x12b; D/A 1x12b | External | |
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NXP USA Inc. MCF51JE256VML | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51JE | Box | Active | -40°C ~ 105°C (TA) | Surface Mount | 104-LFBGA | MCF51 | 104-MAPBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322979557 | 3A991A2 | 8542.31.0001 | 1,200 | 69 | Coldfire V1 | 32-Bit Single-Core | 50MHz | EBI/EMI, I²C, SCI, SPI, USB OTG | LVD, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.8V ~ 3.6V | A/D 12x12b; D/A 1x12b | External |
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