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Samsung Announces Launch of First GAA Process Advanced Packaging in 2025

Samsung Announces Launch of First GAA Process Advanced Packaging in 2025

On July 6th, Samsung Electronics announced its plans to introduce the first Gate-All-Around (GAA) process advanced packaging technology in 2025. This breakthrough technology will further enhance Samsung's competitiveness in the semiconductor industry and pave the way......

Chinese Market Emerges as Key Driver in Global SiC Industry Growth

Chinese Market Emerges as Key Driver in Global SiC Industry Growth

With the rapid growth of new energy and intelligent demands in recent years, the demand for SiC (Silicon Carbide) materials has experienced explosive growth......

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