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Switches
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Memory(66694)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Technology | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Clock Frequency | Memory Type | Memory Size | Access Time | Memory Format | Memory Organization | Memory Interface | Write Cycle Time - Word, Page |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
Micron Technology Inc. 62F1G64D4EK-023 WT ES:C TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Tape & Reel (TR) | Active | 557-MT62F1G64D4EK-023WTES:CTR | 2,000 | ||||||||||||||||||||
|
Micron Technology Inc. FC256GARATEK-WT | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Box | Active | -25°C ~ 85°C | Surface Mount | 153-VFBGA | FLASH - NAND (SLC) | - | 153-VFBGA (11.5x13) | 557-MTFC256GARATEK-WT | 1 | Non-Volatile | 2Tbit | FLASH | 256G x 8 | UFS 3.1 | - | ||||||||
|
Micron Technology Inc. 30AZZZDDB0TPWL-031 W.19R TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Tape & Reel (TR) | Active | 557-MT30AZZZDDB0TPWL-031W.19RTR | 2,000 | ||||||||||||||||||||
|
Micron Technology Inc. 40A1G16TD-062E AAT:F | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | Automotive, AEC-Q100 | Box | Active | -40°C ~ 105°C (TC) | - | - | SDRAM - DDR4 | 1.14V ~ 1.26V | - | 557-MT40A1G16TD-062EAAT:F | 1 | 1.6 GHz | Volatile | 16Gbit | 19 ns | DRAM | 1G x 16 | POD | 15ns | ||||||
|
Micron Technology Inc. 62F1G32D2DS-023 FAAT:B | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | Automotive, AEC-Q100 | Box | Active | - | Surface Mount | 200-WFBGA | SDRAM - Mobile LPDDR5 | 1.05V | 200-WFBGA (10x14.5) | 557-MT62F1G32D2DS-023FAAT:B | 1 | 4.266 GHz | Volatile | 32Gbit | DRAM | 1G x 32 | Parallel | - | |||||||
|
Micron Technology Inc. 62F1G64D4EK-023 FAAT:C | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | Automotive, AEC-Q100 | Box | Active | -40°C ~ 105°C | Surface Mount | 441-TFBGA | SDRAM - Mobile LPDDR5 | 1.05V | 441-TFBGA (14x14) | 557-MT62F1G64D4EK-023FAAT:C | 1 | 2.133 GHz | Volatile | 64Gbit | DRAM | 1G x 64 | Parallel | - | |||||||
|
Micron Technology Inc. 53E4G32D8GS-046 WT ES:C | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Box | Active | -25°C ~ 85°C | - | - | SDRAM - Mobile LPDDR4 | - | - | 557-MT53E4G32D8GS-046WTES:C | 1 | 2.133 GHz | Volatile | 128Gbit | DRAM | 4G x 32 | Parallel | - | |||||||
|
Infineon Technologies S26HS512TGABHI003 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | Semper™ | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 24-VBGA | FLASH - NOR (SLC) | 1.7V ~ 2V | 24-FBGA (8x8) | download | ROHS3 Compliant | 2,500 | 200 MHz | Non-Volatile | 512Mbit | 5.45 ns | FLASH | 64M x 8 | HyperBus | 1.7ms | |||||
|
Infineon Technologies S25HL01GTDPBHB033 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | Semper™ | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 24-VBGA | FLASH - NOR (SLC) | 2.7V ~ 3.6V | 24-FBGA (8x8) | download | ROHS3 Compliant | 2,500 | 133 MHz | Non-Volatile | 1Gbit | FLASH | 128M x 8 | SPI - Quad I/O, QPI | - | ||||||
|
Infineon Technologies S29GL128S11FHVV23 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | Automotive, AEC-Q100, GL-S | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LBGA | FLASH - NOR (SLC) | 2.7V ~ 3.6V | 64-FBGA (13x11) | download | RoHS non-compliant | 1,600 | Non-Volatile | 128Mbit | 110 ns | FLASH | 16M x 8 | CFI | 60ns | ||||||
|
Infineon Technologies S26HS512TGABHB013 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | Semper™ | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 24-VBGA | FLASH - NOR (SLC) | 1.7V ~ 2V | 24-FBGA (8x8) | download | ROHS3 Compliant | 2,500 | 200 MHz | Non-Volatile | 512Mbit | 5.45 ns | FLASH | 64M x 8 | HyperBus | 1.7ms | |||||
| ISSI, Integrated Silicon Solution Inc IS46LD32640C-18BLA1 | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Tray | Active | -40°C ~ 85°C (TC) | Surface Mount | 134-TFBGA | SDRAM - Mobile LPDDR2-S4 | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 134-TFBGA (10x11.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS46LD32640C-18BLA1 | 1 | 533 MHz | Volatile | 2Gbit | 5.5 ns | DRAM | 64M x 32 | HSUL_12 | 15ns | |||
| ISSI, Integrated Silicon Solution Inc IS43LD32640C-18BLI-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TC) | Surface Mount | 134-TFBGA | SDRAM - Mobile LPDDR2-S4 | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 134-TFBGA (10x11.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS43LD32640C-18BLI-TR | 2,000 | 533 MHz | Volatile | 2Gbit | 5.5 ns | DRAM | 64M x 32 | HSUL_12 | 15ns | |||
| ISSI, Integrated Silicon Solution Inc IS46LD32640C-18BLA2-TR | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TC) | Surface Mount | 134-TFBGA | SDRAM - Mobile LPDDR2-S4 | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 134-TFBGA (10x11.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 706-IS46LD32640C-18BLA2-TR | 1 | 533 MHz | Volatile | 2Gbit | 5.5 ns | DRAM | 64M x 32 | HSUL_12 | 15ns | |||
|
onsemi CAT25512VE-G | onsemi |
Min: 1 Mult: 1 |
/image/onsemi | - | Bulk | Obsolete | 488-CAT25512VE-G | OBSOLETE | 1 | |||||||||||||||||||
|
Micron Technology Inc. 53E768M64D4HJ-046 AIT:A TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Obsolete | -40°C ~ 95°C (TC) | Surface Mount | 556-TFBGA | SDRAM - Mobile LPDDR4 | 1.06V ~ 1.17V | 556-WFBGA (12.4x12.4) | ROHS3 Compliant | 557-MT53E768M64D4HJ-046AIT:ATR | OBSOLETE | 1 | 2.133 GHz | Volatile | 48Gbit | 3.5 ns | DRAM | 768M x 64 | Parallel | 18ns | ||||
| Micron Technology Inc. 53E768M32D4DE-046 WT:E | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Bulk | Active | -25°C ~ 85°C | Surface Mount | 200-TFBGA | SDRAM - Mobile LPDDR4 | 1.06V ~ 1.17V | 200-TFBGA (10x14.5) | 557-MT53E768M32D4DE-046WT:E | 1 | 2.133 GHz | Volatile | 24Gbit | 3.5 ns | DRAM | 768M x 32 | Parallel | 18ns | |||||||
|
Micron Technology Inc. 53E1G32D4NQ-046 WT:F TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Tape & Reel (TR) | Obsolete | -30°C ~ 85°C | Surface Mount | 200-VFBGA | SDRAM - Mobile LPDDR4 | 1.06V ~ 1.17V | 200-VFBGA (10x14.5) | ROHS3 Compliant | 557-MT53E1G32D4NQ-046WT:FTR | OBSOLETE | 1 | 2.133 GHz | Volatile | 32Gbit | DRAM | 1G x 32 | - | ||||||
| Micron Technology Inc. 53E384M32D2FW-046 WT:E | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | - | Bulk | Active | -25°C ~ 85°C | Surface Mount | 200-TFBGA | SDRAM - Mobile LPDDR4 | 1.06V ~ 1.17V | 200-TFBGA (10x14.5) | ROHS3 Compliant | 557-MT53E384M32D2FW-046WT:E | 1 | 2.133 GHz | Volatile | 12Gbit | 3.5 ns | DRAM | 384M x 32 | Parallel | 18ns | ||||||
| Micron Technology Inc. 53E768M64D4HJ-046 AIT:C | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 95°C (TC) | Surface Mount | 556-TFBGA | SDRAM - Mobile LPDDR4 | 1.06V ~ 1.17V | 556-WFBGA (12.4x12.4) | ROHS3 Compliant | 557-MT53E768M64D4HJ-046AIT:C | 1 | 2.133 GHz | Volatile | 48Gbit | 3.5 ns | DRAM | 768M x 64 | Parallel | 18ns | ||||||
| Micron Technology Inc. 53E1536M32D4DE-046 AAT:C | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 105°C (TC) | Surface Mount | 200-TFBGA | SDRAM - Mobile LPDDR4 | 1.06V ~ 1.17V | 200-TFBGA (10x14.5) | ROHS3 Compliant | 557-MT53E1536M32D4DE-046AAT:C | 1 | 2.133 GHz | Volatile | 48Gbit | 3.5 ns | DRAM | 1.5G x 32 | Parallel | 18ns | ||||||
| Micron Technology Inc. 53E1536M32D4DE-046 AAT:C TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TC) | Surface Mount | 200-TFBGA | SDRAM - Mobile LPDDR4 | 1.06V ~ 1.17V | 200-TFBGA (10x14.5) | ROHS3 Compliant | 557-MT53E1536M32D4DE-046AAT:CTR | 2,000 | 2.133 GHz | Volatile | 48Gbit | 3.5 ns | DRAM | 1.5G x 32 | Parallel | 18ns | ||||||
|
onsemi N24C32UDTG | onsemi |
Min: 1 Mult: 1 |
/image/onsemi | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-VFSOP (0.091", 2.30mm Width) | EEPROM | 1.7V ~ 5.5V | US8 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 488-N24C32UDTGTR | EAR99 | 8542.32.0051 | 3,000 | 1 MHz | Non-Volatile | 32Kbit | 400 ns | EEPROM | 4K x 8 | I²C | 4ms |
|
Rohm Semiconductor BU34E02NUX-3TR | Rohm Semiconductor |
Min: 1 Mult: 1 |
/image/Rohm Semiconductor | - | Tape & Reel (TR) | Obsolete | ROHS3 Compliant | REACH Unaffected | 846-BU34E02NUX-3TR | 4,000 | ||||||||||||||||||
|
Microchip Technology 24CS256T-E/Q4B | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | EEPROM | 1.7V ~ 5.5V | 8-UDFN (2x3) | download | 150-24CS256T-E/Q4BTR | 5,000 | 1 MHz | Non-Volatile | 256Kbit | 400 ns | EEPROM | 32K x 8 | I²C | 5ms | |||||
| Infineon Technologies CY15B104QN-50SXAT | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | Automotive, AEC-Q100, Excelon™-Auto, F-RAM™ | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | FRAM (Ferroelectric RAM) | 1.8V ~ 3.6V | 8-SOIC | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 2,000 | 50 MHz | Non-Volatile | 4Mbit | 8 ns | FRAM | 512K x 8 | SPI | - | |||||
|
Infineon Technologies CY15V108QN-50BKXIT | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | Excelon™-LP,F-RAM™ | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | FRAM (Ferroelectric RAM) | 1.71V ~ 1.89V | 24-FBGA (6x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 2,000 | 50 MHz | Non-Volatile | 8Mbit | 8 ns | FRAM | 1M x 8 | SPI | - | ||||
|
Infineon Technologies CY15B256J-SXET | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | F-RAM™ | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | FRAM (Ferroelectric RAM) | 2V ~ 3.6V | 8-SOIC | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 2,500 | 3.4 MHz | Non-Volatile | 256Kbit | 130 ns | FRAM | 32K x 8 | I²C | - | ||||
|
Infineon Technologies CY15B116QN-40BKXIT | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | Excelon™-LP,F-RAM™ | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | FRAM (Ferroelectric RAM) | 1.8V ~ 3.6V | 24-FBGA (6x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 2,000 | 40 MHz | Non-Volatile | 16Mbit | 9 ns | FRAM | 2M x 8 | SPI | - | ||||
|
Infineon Technologies CY15V116QSN-108BKXIT | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | Excelon™-Ultra, F-RAM™ | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | FRAM (Ferroelectric RAM) | 1.71V ~ 1.89V | 24-FBGA (6x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 2,000 | 108 MHz | Non-Volatile | 16Mbit | 6.7 ns | FRAM | 2M x 8 | SPI - Quad I/O, QPI | - |
