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Memory(66694)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Technology | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Clock Frequency | Memory Type | Memory Size | Access Time | Memory Format | Memory Organization | Memory Interface | Write Cycle Time - Word, Page |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
ISSI, Integrated Silicon Solution Inc IS43DR32160C-3DBL | ISSI, Integrated Silicon Solution Inc |
Min: 1 Mult: 1 |
/image/ISSI, Integrated Silicon Solution Inc | - | Bulk | Active | 0°C ~ 70°C (TA) | Surface Mount | 126-TFBGA | IS43DR32160 | SDRAM - DDR2 | 1.7V ~ 1.9V | 126-TWBGA (10.5x13.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2156-IS43DR32160C-3DBL | EAR99 | 8542.32.0028 | 1 | 333 MHz | Volatile | 512Mbit | 450 ps | DRAM | 16M x 32 | SSTL_18 | 15ns |
| Alliance Memory, Inc. AS4C256M8D3LC-12BCNTR | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
/image/Alliance Memory, Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | 0°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | AS4C256 | SDRAM - DDR3L | 1.283V ~ 1.45V | 78-FBGA (7.5x10.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1450-AS4C256M8D3LC-12BCNTR | EAR99 | 8542.32.0036 | 2,500 | 800 MHz | Volatile | 2Gbit | 20 ns | DRAM | 256M x 8 | Parallel | 15ns | |
| Alliance Memory, Inc. AS4C256M8D3LC-12BINTR | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
/image/Alliance Memory, Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | AS4C256 | SDRAM - DDR3L | 1.283V ~ 1.45V | 78-FBGA (7.5x10.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1450-AS4C256M8D3LC-12BINTR | EAR99 | 8542.32.0036 | 2,500 | 800 MHz | Volatile | 2Gbit | 20 ns | DRAM | 256M x 8 | Parallel | 15ns | |
| Alliance Memory, Inc. AS4C128M16D3LC-12BCNTR | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
/image/Alliance Memory, Inc. | - | Tape & Reel (TR) | Active | 0°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | AS4C128 | SDRAM - DDR3L | 1.283V ~ 1.45V | 96-FBGA (7.5x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1450-AS4C128M16D3LC-12BCNTR | EAR99 | 8542.32.0036 | 1,500 | 800 MHz | Volatile | 2Gbit | 20 ns | DRAM | 128M x 16 | Parallel | 15ns | |
| Alliance Memory, Inc. AS4C256M8D3LC-12BCN | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
/image/Alliance Memory, Inc. | Automotive, AEC-Q100 | Tray | Active | 0°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | AS4C256 | SDRAM - DDR3L | 1.283V ~ 1.45V | 78-FBGA (7.5x10.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1450-AS4C256M8D3LC-12BCN | EAR99 | 8542.32.0036 | 210 | 800 MHz | Volatile | 2Gbit | 20 ns | DRAM | 256M x 8 | Parallel | 15ns | |
| Alliance Memory, Inc. AS4C128M16D3C-93BCNTR | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
/image/Alliance Memory, Inc. | - | Tape & Reel (TR) | Active | 0°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | AS4C128 | SDRAM - DDR3 | 1.425V ~ 1.575V | 96-FBGA (7.5x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1450-AS4C128M16D3C-93BCNTR | EAR99 | 8542.32.0036 | 2,500 | 1.066 GHz | Volatile | 2Gbit | 20 ns | DRAM | 128M x 16 | Parallel | 15ns | |
| Alliance Memory, Inc. AS4C512M16D3LA-10BCNTR | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
/image/Alliance Memory, Inc. | - | Tape & Reel (TR) | Active | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | AS4C512 | SDRAM - DDR3L | 1.283V ~ 1.45V | 96-FBGA (13.5x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1450-AS4C512M16D3LA-10BCNTR | EAR99 | 8542.32.0036 | 2,000 | 933 MHz | Volatile | 8Gbit | 20 ns | DRAM | 512M x 16 | Parallel | 15ns | |
| Microchip Technology AT24HC04B-TP25-B | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100 | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | AT24HC04 | EEPROM | 2.5V ~ 5.5V | 8-TSSOP | 150-AT24HC04B-TP25-B | OBSOLETE | 1 | 400 kHz | Non-Volatile | 4Kbit | 900 ns | EEPROM | 512 x 8 | I²C | 5ms | ||||||
|
Kaga FEI America, Inc. MB85RS128APNF-G-JNERE1 | Kaga FEI America, Inc. |
Min: 1 Mult: 1 |
/image/Kaga FEI America, Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | MB85RS128 | FRAM (Ferroelectric RAM) | 3V ~ 3.6V | 8-SOP | download | ROHS3 Compliant | 3 (168 Hours) | 865-MB85RS128APNF-G-JNERE1TR | EAR99 | 8542.32.0071 | 1,500 | 25 MHz | Non-Volatile | 128Kbit | FRAM | 16K x 8 | SPI | - | ||
| GigaDevice Semiconductor (HK) Limited GD25Q80EWIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | GD25Q80 | FLASH - NOR | 2.7V ~ 3.6V | 8-WSON (5x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.32.0071 | 3,000 | 133 MHz | Non-Volatile | 8Mbit | 7 ns | FLASH | 1M x 8 | SPI - Quad I/O | 70µs, 2ms | ||
|
GigaDevice Semiconductor (HK) Limited GD25Q256EYIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | GD25Q256 | FLASH - NOR | 2.7V ~ 3.6V | 8-WSON (6x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1970-GD25Q256EYIGRTR | 3A991B1A | 8542.32.0071 | 3,000 | 133 MHz | Non-Volatile | 256Mbit | 7 ns | FLASH | 32M x 8 | SPI - Quad I/O | 50µs, 2.4ms |
| GigaDevice Semiconductor (HK) Limited GD25Q64ETIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | GD25Q64 | FLASH - NOR | 2.7V ~ 3.6V | 8-SOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1970-GD25Q64ETIGRTR | 3A991B1A | 8542.32.0071 | 3,000 | 133 MHz | Non-Volatile | 64Mbit | 7 ns | FLASH | 8M x 8 | SPI - Quad I/O | 70µs, 2.4ms | |
|
GigaDevice Semiconductor (HK) Limited GD25Q128EWIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | GD25Q128 | FLASH - NOR | 2.7V ~ 3.6V | 8-WSON (5x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 3,000 | 133 MHz | Non-Volatile | 128Mbit | 7 ns | FLASH | 16M x 8 | SPI - Quad I/O | 70µs, 2.4ms | |
|
GigaDevice Semiconductor (HK) Limited GD25Q32ETIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | GD25Q32 | FLASH - NOR | 2.7V ~ 3.6V | 8-SOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991B1A | 8542.32.0071 | 3,000 | 133 MHz | Non-Volatile | 32Mbit | 7 ns | FLASH | 4M x 8 | SPI - Quad I/O | 70µs, 2.4ms | |
|
GigaDevice Semiconductor (HK) Limited GD25Q16EWIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | GD25Q16 | FLASH - NOR | 2.7V ~ 3.6V | 8-WSON (5x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.32.0071 | 3,000 | 133 MHz | Non-Volatile | 16Mbit | 7 ns | FLASH | 2M x 8 | SPI - Quad I/O | 70µs, 2ms | |
| GigaDevice Semiconductor (HK) Limited GD25Q80ESIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | GD25Q80 | FLASH - NOR | 2.7V ~ 3.6V | 8-SOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.32.0071 | 2,000 | 133 MHz | Non-Volatile | 8Mbit | 7 ns | FLASH | 1M x 8 | SPI - Quad I/O | 70µs, 2ms | ||
| GigaDevice Semiconductor (HK) Limited GD25LQ128ESIGR | GigaDevice Semiconductor (HK) Limited |
Min: 1 Mult: 1 |
/image/GigaDevice Semiconductor (HK) Limited | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | GD25LQ128 | FLASH - NOR | 1.65V ~ 2V | 8-SOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1970-GD25LQ128ESIGRCT | 3A991B1A | 8542.32.0071 | 2,000 | 120 MHz | Non-Volatile | 128Mbit | 7 ns | FLASH | 16M x 8 | SPI - Quad I/O | 60µs, 2.4ms | |
|
Analog Devices Inc./Maxim Integrated DS2501P+T&R | Analog Devices Inc./Maxim Integrated |
Min: 1 Mult: 1 |
/image/Analog Devices Inc./Maxim Integrated | - | Bulk | Obsolete | ROHS3 Compliant | 175-DS2501P+T&R | OBSOLETE | 1 | |||||||||||||||||||
| Winbond Electronics W971GG8NB25I | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | - | Tray | Active | -40°C ~ 95°C (TC) | Surface Mount | 60-VFBGA | W971GG8 | SDRAM - DDR2 | 1.7V ~ 1.9V | 60-VFBGA (8x9.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W971GG8NB25I | EAR99 | 8542.32.0032 | 264 | 400 MHz | Volatile | 1Gbit | 400 ps | DRAM | 128M x 8 | SSTL_18 | 15ns | |
| Winbond Electronics W971GG6NB-18 | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | - | Tray | Active | 0°C ~ 85°C (TC) | Surface Mount | 84-TFBGA | W971GG6 | SDRAM - DDR2 | 1.7V ~ 1.9V | 84-TFBGA (8x12.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W971GG6NB-18 | EAR99 | 8542.32.0028 | 209 | 533 MHz | Volatile | 1Gbit | 350 ps | DRAM | 64M x 16 | SSTL_18 | 15ns | |
| Winbond Electronics W971GG8NB-25 | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | - | Tray | Active | 0°C ~ 85°C (TC) | Surface Mount | 60-VFBGA | W971GG8 | SDRAM - DDR2 | 1.7V ~ 1.9V | 60-VFBGA (8x9.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W971GG8NB-25 | EAR99 | 8542.32.0032 | 264 | 400 MHz | Volatile | 1Gbit | 400 ps | DRAM | 128M x 8 | SSTL_18 | 15ns | |
| Winbond Electronics W971GG8NB-25 TR | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | - | Tape & Reel (TR) | Active | 0°C ~ 85°C (TC) | Surface Mount | 60-VFBGA | W971GG8 | SDRAM - DDR2 | 1.7V ~ 1.9V | 60-VFBGA (8x9.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W971GG8NB-25TR | EAR99 | 8542.32.0032 | 2,500 | 400 MHz | Volatile | 1Gbit | 400 ps | DRAM | 128M x 8 | SSTL_18 | 15ns | |
| Winbond Electronics W631GG6NB15I | Winbond Electronics |
Min: 1 Mult: 1 |
/image/Winbond Electronics | - | Tray | Active | -40°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | W631GG6 | SDRAM - DDR3 | 1.4V ~ 1.6V | 96-VFBGA (7.5x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 256-W631GG6NB15I | EAR99 | 8542.32.0032 | 198 | 667 MHz | Volatile | 1Gbit | 20 ns | DRAM | 64M x 16 | SSTL_15 | 15ns | |
| Micron Technology Inc. FC32GASAQHD-AIT | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 153-VFBGA | MTFC32G | FLASH - NAND | 2.7V ~ 3.6V | 153-VFBGA (11.5x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,520 | 200 MHz | Non-Volatile | 256Gbit | FLASH | 32G x 8 | eMMC | - | ||||||
| Micron Technology Inc. FC128GAZAQJP-AIT | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 153-VFBGA | MTFC128 | FLASH - NAND | 2.7V ~ 3.6V | 153-VFBGA (11.5x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,520 | 200 MHz | Non-Volatile | 1Tbit | FLASH | 128G x 8 | MMC | - | ||||||
| Micron Technology Inc. FC32GAZAQHD-AAT TR | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 153-VFBGA | MTFC32G | FLASH - NAND | 2.7V ~ 3.6V | 153-VFBGA (11.5x13) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 557-MTFC32GAZAQHD-AATTR | 2,000 | 200 MHz | Non-Volatile | 256Gbit | FLASH | 32G x 8 | MMC | - | |||||
|
Delkin Devices, Inc. EM04APGCH-BA000-2 | Delkin Devices, Inc. |
Min: 1 Mult: 1 |
/image/Delkin Devices, Inc. | - | Tray | Obsolete | -40°C ~ 85°C | Surface Mount | 153-VFBGA | EM04APG | FLASH - NAND | 2.7V ~ 3.6V | 153-FBGA (11.5x13) | RoHS Compliant | 3 (168 Hours) | 3247-EM04APGCH-BA000-2 | OBSOLETE | 1,520 | 200 MHz | Non-Volatile | 32Gbit | FLASH | 4G x 8 | eMMC | - | ||||
|
Delkin Devices, Inc. EM04APYD3-AC000-2 | Delkin Devices, Inc. |
Min: 1 Mult: 1 |
/image/Delkin Devices, Inc. | - | Tray | Obsolete | -40°C ~ 85°C | Surface Mount | 153-VFBGA | EM04APY | FLASH - NAND (MLC) | 2.7V ~ 3.6V | 153-FBGA (11.5x13) | RoHS Compliant | 3 (168 Hours) | 3247-EM04APYD3-AC000-2 | OBSOLETE | 1,520 | 200 MHz | Non-Volatile | 32Gbit | FLASH | 4G x 8 | eMMC | - | ||||
|
Delkin Devices, Inc. EM04APGD4-AC000-2 | Delkin Devices, Inc. |
Min: 1 Mult: 1 |
/image/Delkin Devices, Inc. | - | Tray | Obsolete | -40°C ~ 85°C | Surface Mount | 153-VFBGA | EM04APG | FLASH - NAND (pSLC) | 2.7V ~ 3.6V | 153-FBGA (11.5x13) | RoHS Compliant | 3 (168 Hours) | 3247-EM04APGD4-AC000-2 | OBSOLETE | 1,520 | 200 MHz | Non-Volatile | 32Gbit | FLASH | 4G x 8 | eMMC | - | ||||
|
Delkin Devices, Inc. EM08APGD3-AC224-2 | Delkin Devices, Inc. |
Min: 1 Mult: 1 |
/image/Delkin Devices, Inc. | - | Tray | Obsolete | Surface Mount | 153-VFBGA | 153-FBGA (11.5x13) | RoHS Compliant | 3 (168 Hours) | 3247-EM08APGD3-AC224-2 | OBSOLETE | 1,520 |
