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System On Chip (SoC)(4272)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| AMD XCZU2EG-2UBVA530I | AMD |
Min: 1 Mult: 1 |
/image/AMD | - | Tray | Active | -40°C ~ 100°C (TJ) | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | download | ROHS3 Compliant | 3 (168 Hours) | 122-XCZU2EG-2UBVA530I | 1 | MPU, FPGA | 82 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||
| AMD XCZU2CG-1UBVA530I | AMD |
Min: 1 Mult: 1 |
/image/AMD | - | Tray | Active | -40°C ~ 100°C (TJ) | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU2CG-1UBVA530I | 1 | MPU, FPGA | 82 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||
| AMD XCZU3EG-2UBVA530I | AMD |
Min: 1 Mult: 1 |
/image/AMD | - | Tray | Active | -40°C ~ 100°C (TJ) | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | download | ROHS3 Compliant | 3 (168 Hours) | 122-XCZU3EG-2UBVA530I | 1 | MPU, FPGA | 82 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ||||
| Microchip Technology MPFS025T-FCVG484E | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | 0°C ~ 100°C | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | REACH Unaffected | 150-MPFS025T-FCVG484E | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||
| Microchip Technology MPFS025T-1FCVG484E | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | 0°C ~ 100°C | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | REACH Unaffected | 150-MPFS025T-1FCVG484E | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||
 |
Microchip Technology MPFS025TS-FCSG325I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 100°C | 325-TFBGA | 325-BGA (11x11) | REACH Unaffected | 150-MPFS025TS-FCSG325I | 1 | MPU, FPGA | MCU - 102, FPGA - 80 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | |||||
|
Microchip Technology MPFS025TLS-FCSG325I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 100°C | 325-TFBGA | 325-BGA (11x11) | REACH Unaffected | 150-MPFS025TLS-FCSG325I | 1 | MPU, FPGA | MCU - 102, FPGA - 80 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | |||||
|
Microchip Technology MPFS025TLS-FCVG484I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 100°C | 484-BFBGA | 484-FBGA (19x19) | REACH Unaffected | 150-MPFS025TLS-FCVG484I | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | |||||
|
Texas Instruments DRA829VMTGBALFRQ1 | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | 827-BFBGA, FCBGA | 827-FCBGA (24x24) | download | Not applicable | 3 (168 Hours) | 296-DRA829VMTGBALFRQ1TR | 5A992C | 8542.31.0001 | 250 | DSP, MCU, MPU | 226 | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | 2GHz, 1GHz, 1.35GHz, 1GHz | I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB | DMA, PWM, WDT | 1.5MB | - | - | |
|
onsemi NCN5140STXG | onsemi |
Min: 1 Mult: 1 |
/image/onsemi | - | Tape & Reel (TR) | Last Time Buy | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | PG-VQFN-64-8 | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 488-NCN5140STXGTR | 3A991A2 | 8542.31.0001 | 3,000 | MCU | 24 | ARM® Cortex®-M0+ | - | SPI, UART/USART | - | - | - | - |
|
onsemi NCN5140SG | onsemi |
Min: 1 Mult: 1 |
/image/onsemi | - | Tray | Last Time Buy | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | PG-VQFN-64-8 | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 488-NCN5140SG | 3A991A2 | 8542.31.0001 | 2,000 | MCU | 24 | ARM® Cortex®-M0+ | - | SPI, UART/USART | - | - | - | - |
| Microchip Technology MPFS095T-1FCVG484T2 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | REACH Unaffected | 150-MPFS095T-1FCVG484T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6KB | 128KB | FPGA - 93K Logic Modules | ||||||
| Microchip Technology MPFS095T-FCVG784T2 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | REACH Unaffected | 150-MPFS095T-FCVG784T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6KB | 128KB | FPGA - 93K Logic Modules | ||||||
| Microchip Technology MPFS250T-1FCVG484T2 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-MPFS250T-1FCVG484T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128KB | FPGA - 254K Logic Modules | ||||
|
Microchip Technology MPFS095T-FCSG325T2 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 325-TFBGA | 325-BGA (11x11) | REACH Unaffected | 150-MPFS095T-FCSG325T2 | 1 | MPU, FPGA | MCU - 102, FPGA - 80 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6KB | 128KB | FPGA - 93K Logic Modules | |||||
| Microchip Technology MPFS160T-FCVG484T2 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | REACH Unaffected | 150-MPFS160T-FCVG484T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 1.4125MB | 128KB | FPGA - 161K Logic Modules | ||||||
|
Microchip Technology MPFS025T-1FCSG325T2 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 325-TFBGA | 325-BGA (11x11) | REACH Unaffected | 150-MPFS025T-1FCSG325T2 | 1 | MPU, FPGA | MCU - 102, FPGA - 80 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | |||||
| Microchip Technology MPFS025T-1FCVG484T2 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | REACH Unaffected | 150-MPFS025T-1FCVG484T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||
|
Microchip Technology MPFS095T-1FCSG325T2 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 325-TFBGA | 325-BGA (11x11) | REACH Unaffected | 150-MPFS095T-1FCSG325T2 | 1 | MPU, FPGA | MCU - 102, FPGA - 80 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6KB | 128KB | FPGA - 93K Logic Modules | |||||
| Microchip Technology MPFS250T-FCSG536T2 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 536-LFBGA | 536-BGA (16x16) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-MPFS250T-FCSG536T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 168 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128KB | FPGA - 254K Logic Modules | ||||
| Microchip Technology MPFS025T-FCVG484T2 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | REACH Unaffected | 150-MPFS025T-FCVG484T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||
|
Microchip Technology M2S025T-FCSG158I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 100°C (TJ) | 158-BGA, FCBGA | 158-FCBGA | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-M2S025T-FCSG158I | 260 | MCU, FPGA | - | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 25K Logic Modules | |||
| AMD XCVM1302-2MSIVFVC1596 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1596-BFBGA | 1596-BGA (37.5x37.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-2MSIVFVC1596 | 1 | MPU, FPGA | 532 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | ||||
| AMD XCVE1752-2LSEVSVA2197 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVE1752-2LSEVSVA2197 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ AI Core FPGA, 1M Logic Cells | ||
| AMD XCVM1402-1MSEVSVD1760 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-1MSEVSVD1760 | 1 | MPU, FPGA | 726 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells | ||||
| AMD XCVM1302-1MSIVFVC1596 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1596-BFBGA | 1596-BGA (37.5x37.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-1MSIVFVC1596 | 1 | MPU, FPGA | 532 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | ||||
| AMD XCZU55DR-2FSVE1156I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ RFSoC DR | Tray | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU55DR-2FSVE1156I | 1 | MPU, FPGA | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe, WDT | - | - | Zynq® UltraScale+™ RFSoC | ||||
| AMD XCVM1302-2LSENSVF1369 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-2LSENSVF1369 | 1 | MPU, FPGA | 316 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | ||||
| AMD XCZU1CG-L2UBVA494E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | 0°C ~ 100°C (TJ) | 494-WFBGA, FCBGA | 494-FCBGA (14x14) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU1CG-L2UBVA494E | 1 | MPU, FPGA | 82 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.333GHz | - | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | ||||
| AMD XCVM1402-1LLINSVF1369 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-1LLINSVF1369 | 1 | MPU, FPGA | 424 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells |
