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System On Chip (SoC)(4272)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| AMD XCZU1CG-L1SBVA484I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ | Tray | Active | -40°C ~ 100°C (TJ) | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU1CG-L1SBVA484I | 1 | MPU, FPGA | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | - | DMA, WDT | 256KB | - | - | |||
| AMD XCZU1EG-2SFVC784I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU1EG-2SFVC784I | 1 | MPU, FPGA | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.333GHz | - | DMA, WDT | 256KB | - | - | |||
 |
Microchip Technology MPFS025TL-FCVG484E | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | 0°C ~ 100°C | 484-BFBGA | 484-FBGA (19x19) | REACH Unaffected | 150-MPFS025TL-FCVG484E | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||
|
Microchip Technology MPFS025TL-FCSG325E | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | 0°C ~ 100°C | 325-TFBGA | 325-BGA (11x11) | REACH Unaffected | 150-MPFS025TL-FCSG325E | 1 | MPU, FPGA | MCU - 102, FPGA - 80 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||
|
Microchip Technology MPFS025T-FCSG325I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 100°C | 325-TFBGA | 325-BGA (11x11) | REACH Unaffected | 150-MPFS025T-FCSG325I | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||
|
Microchip Technology MPFS025TS-1FCSG325I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 100°C | 325-TFBGA | 325-BGA (11x11) | REACH Unaffected | 150-MPFS025TS-1FCSG325I | 1 | MPU, FPGA | MCU - 102, FPGA - 80 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||
|
Microchip Technology MPFS025TS-1FCVG484I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 100°C | 484-BFBGA | 484-FBGA (19x19) | REACH Unaffected | 150-MPFS025TS-1FCVG484I | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||
|
Microchip Technology MPFS025TL-FCSG325I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 100°C | 325-TFBGA | 325-BGA (11x11) | REACH Unaffected | 150-MPFS025TL-FCSG325I | 1 | MPU, FPGA | MCU - 102, FPGA - 80 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||
|
Microchip Technology MPFS025T-1FCSG325E | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | 0°C ~ 100°C | 325-TFBGA | 325-BGA (11x11) | REACH Unaffected | 150-MPFS025T-1FCSG325E | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||
| Microchip Technology MPFS250T-1FCVG784T2 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-MPFS250T-1FCVG784T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 372 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128KB | FPGA - 254K Logic Modules | |||
| Microchip Technology MPFS250T-FCVG484T2 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-MPFS250T-FCVG484T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128KB | FPGA - 254K Logic Modules | |||
| Microchip Technology MPFS095T-1FCVG784T2 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | REACH Unaffected | 150-MPFS095T-1FCVG784T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6KB | 128KB | FPGA - 93K Logic Modules | |||||
| Microchip Technology MPFS095T-FCSG536T2 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 536-LFBGA | 536-BGA (16x16) | REACH Unaffected | 150-MPFS095T-FCSG536T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 168 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6KB | 128KB | FPGA - 93K Logic Modules | |||||
| Microchip Technology MPFS095T-FCVG484T2 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | REACH Unaffected | 150-MPFS095T-FCVG484T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6KB | 128KB | FPGA - 93K Logic Modules | |||||
|
Renesas Electronics America Inc R8A77610DA01BGV#U9 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | - | Bulk | Obsolete | - | 449-FBGA | 449-FBGA (21x21) | REACH Unaffected | 559-R8A77610DA01BGV#U9 | OBSOLETE | 1 | MPU | - | SH-4A | 400MHz | CANbus, I²C, USB | DDR | 16KB | - | - | |||
| AMD XCVC1702-1LLIVSVA1596 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | 1596-BFBGA | 1596-BGA (37.5x37.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1702-1LLIVSVA1596 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ AI Core FPGA, 1M Logic Cells | |||
| AMD XCVC1502-2LLEVSVA1596 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 1596-BFBGA | 1596-BGA (37.5x37.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1502-2LLEVSVA1596 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ AI Core FPGA, 800k Logic Cells | |||
| AMD XCVC1702-2LLEVSVA1596 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 1596-BFBGA | 1596-BGA (37.5x37.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1702-2LLEVSVA1596 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ AI Core FPGA, 1M Logic Cells | |||
| AMD XCVC1502-2LSEVSVA2197 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1502-2LSEVSVA2197 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ AI Core FPGA, 800k Logic Cells | |||
|
Microchip Technology M2S060T-VFG784I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 784-FBGA | 784-VFBGA (23x23) | ROHS3 Compliant | 3 (168 Hours) | 150-M2S060T-VFG784I | 60 | MCU, FPGA | 395 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | |||
|
Microchip Technology M2S060TS-VFG784I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 784-FBGA | 784-VFBGA (23x23) | ROHS3 Compliant | 3 (168 Hours) | 150-M2S060TS-VFG784I | 60 | MCU, FPGA | 395 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | |||
|
Microchip Technology M2S060T-VFG784 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 784-FBGA | 784-VFBGA (23x23) | ROHS3 Compliant | 3 (168 Hours) | 150-M2S060T-VFG784 | 60 | MCU, FPGA | 395 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | |||
|
Microchip Technology M2S060T-1VFG784I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 784-FBGA | 784-VFBGA (23x23) | ROHS3 Compliant | 3 (168 Hours) | 150-M2S060T-1VFG784I | 60 | MCU, FPGA | 395 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | |||
|
MaxLinear, Inc. URX850B1BE | MaxLinear, Inc. |
Min: 1 Mult: 1 |
/image/MaxLinear, Inc. | AnyWAN™ | Bulk | Active | - | 837-BGA, FCBGA | 837-FCBGA (24x26) | download | 1016-URX850B1BE | 1 | MPU | 9 | Intel® Atom™ | 2GHz | MMC, PCIe, USB | SATA, SGMII, USXGMII, XFI | - | - | - | ||||
|
AMD XCVC1702-2MLIVSVA2197 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ AI Core | Tray | Active | -40°C ~ 110°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | 4 (72 Hours) | 122-XCVC1702-2MLIVSVA2197 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1M Logic Cells | ||||
|
AMD XCVM1502-1LSINFVB1369 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 110°C (TJ) | 1369-BFBGA, FCBGA | 1369-FCBGA (35x35) | 4 (72 Hours) | 122-XCVM1502-1LSINFVB1369 | 1 | MPU, FPGA | 478 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 1M Logic Cells | ||||
|
AMD XCVM1502-2MSEVSVA2197 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | 0°C ~ 110°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | 4 (72 Hours) | 122-XCVM1502-2MSEVSVA2197 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 1M Logic Cells | ||||
|
AMD XCVP1102-2LSEVSVA2785 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal® Premium | Tray | Active | 2785-BFBGA, FCBGA | 2785-FCBGA (50x50) | 4 (72 Hours) | 122-XCVP1102-2LSEVSVA2785 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | ||||||
|
AMD XCVP1402-1LSEVSVA2785 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal® Premium | Tray | Active | 0°C ~ 100°C (TJ) | 2785-BFBGA, FCBGA | 2785-FCBGA (50x50) | 4 (72 Hours) | 122-XCVP1402-1LSEVSVA2785 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | |||||
|
AMD XCVP1402-2LSEVSVA2785 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal® Premium | Tray | Active | 2785-BFBGA, FCBGA | 2785-FCBGA (50x50) | 4 (72 Hours) | 122-XCVP1402-2LSEVSVA2785 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - |
