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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Flash Size | Primary Attributes | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
Microchip Technology MPFS095TS-1FCVG784I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PolarFire® | Tray | Active | -40°C ~ 100°C | 784-BGA | 784-BGA | download | REACH Unaffected | 150-MPFS095TS-1FCVG784I | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6kB | 128kB | FPGA - 93K Logic Modules | ||||||||||||||||||||||||||||
|
Microchip Technology MPFS095T-1FCVG784I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PolarFire® | Tray | Active | -40°C ~ 100°C | 784-BGA | 784-BGA | download | REACH Unaffected | 150-MPFS095T-1FCVG784I | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6kB | 128kB | FPGA - 93K Logic Modules | ||||||||||||||||||||||||||||
| Microchip Technology PIC32CM5164LE00100-I/PF | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | Surface Mount | 100-TQFP | PIC32CM5164 | 100-TQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-PIC32CM5164LE00100-I/PF | 3A991A2 | 8542.31.0001 | 90 | ||||||||||||||||||||||||||||||||||
| Microchip Technology PIC18F26Q43-E/SP | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18F | Tube | Active | -40°C ~ 125°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | PIC18F26 | 28-SPDIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 150-PIC18F26Q43-E/SP | 3A991A2 | 8542.31.0001 | 15 | 25 | PIC | 8-Bit | 64MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 1K x 8 | 4K x 8 | 1.8V ~ 5.5V | A/D 24x12b; D/A 1x8b | Internal | |||||||||||||||||||
| Microchip Technology DSPIC33CK256MP606-E/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33CK, Functional Safety (FuSa) | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-TQFP | DSPIC33CK256MP606 | 64-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-DSPIC33CK256MP606-E/PT | 3A991A2 | 8542.31.0001 | 160 | 53 | dsPIC | 16-Bit | 100MIPs | CANbus, I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, Motor Control, POR, PWM, QEI, WDT | 256KB (256K x 8) | FLASH | - | 64K x 8 | 3V ~ 3.6V | A/D 20x12b SAR; D/A 6x12b | Internal | |||||||||||||||||||
| Microchip Technology MPFS095TS-1FCSG536I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PolarFire® | Tray | Active | -40°C ~ 100°C | 536-BGA | 536-LFBGA | download | REACH Unaffected | 150-MPFS095TS-1FCSG536I | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6kB | 128kB | FPGA - 93K Logic Modules | |||||||||||||||||||||||||||||
| Microchip Technology DSPIC33CK512MP306T-I/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-TQFP | DSPIC33CK512MP306 | 64-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,200 | 53 | dsPIC | 16-Bit | 100MIPs | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, Motor Control, POR, PWM, QEI, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 3V ~ 3.6V | A/D 20x12b SAR; D/A 6x12b | Internal | ||||||||||||||||||||
| Microchip Technology DSPIC33CK256MP605T-I/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | dsPIC™ 33CK, Functional Safety (FuSa) | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-TQFP | DSPIC33CK256MP605 | 48-TQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,600 | 39 | dsPIC | 16-Bit | 100MIPs | CANbus, I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, Motor Control, POR, PWM, QEI, WDT | 256KB (256K x 8) | FLASH | - | 64K x 8 | 3V ~ 3.6V | A/D 19x12b SAR; D/A 6x12b | Internal | ||||||||||||||||||||
| Microchip Technology MPFS095T-FCSG536I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PolarFire® | Tray | Active | -40°C ~ 100°C | 536-BGA | 536-LFBGA | download | REACH Unaffected | 150-MPFS095T-FCSG536I | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6kB | 128kB | FPGA - 93K Logic Modules | |||||||||||||||||||||||||||||
| Microchip Technology DSPIC33CK256MP605-E/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33CK, Functional Safety (FuSa) | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-TQFP | DSPIC33CK256MP605 | 48-TQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-DSPIC33CK256MP605-E/PT | 3A991A2 | 8542.31.0001 | 250 | 39 | dsPIC | 16-Bit | 100MIPs | CANbus, I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, Motor Control, POR, PWM, QEI, WDT | 256KB (256K x 8) | FLASH | - | 64K x 8 | 3V ~ 3.6V | A/D 19x12b SAR; D/A 6x12b | Internal | |||||||||||||||||||
| Microchip Technology DSPIC33CK256MP305-E/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33CK, Functional Safety (FuSa) | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-TQFP | DSPIC33CK256MP305 | 48-TQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-DSPIC33CK256MP305-E/PT | 3A991A2 | 8542.31.0001 | 250 | 39 | dsPIC | 16-Bit | 100MIPs | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, Motor Control, POR, PWM, QEI, WDT | 256KB (256K x 8) | FLASH | - | 64K x 8 | 3V ~ 3.6V | A/D 19x12b SAR; D/A 6x12b | Internal | |||||||||||||||||||
|
Analog Devices Inc./Maxim Integrated MAX32680GLR+ | Analog Devices Inc./Maxim Integrated |
Min: 1 Mult: 1 |
/image/Analog Devices Inc./Maxim Integrated | - | Tray | Active | -40°C ~ 85°C (TA) | 88-VFLGA Exposed Pad | 88-LGA (10x10) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 5A992C SC | 8542.31.0001 | 168 | MCU | 36 | ARM® Cortex®-M4F | 100MHz | Bluetooth, I²C, SPI, UART | DMA, I²S, PWM, WDT | 128kB | 512kB | - | |||||||||||||||||||||||||
|
Trenz Electronic GmbH 0820-04-2BE21FAJ | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BE21FAJ | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||||||||||||||||||||||||||||
|
Trenz Electronic GmbH 0820-04-4BI21KL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-4BI21KL | OBSOLETE | 1 | - | - | - | - | - | - | ||||||||||||||||||||||||||||||
|
Trenz Electronic GmbH 0820-04-2BE21-V1 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BE21-V1 | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||||||||||||||||||||||||||||
|
Trenz Electronic GmbH 0820-04-50121MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-50121MA | 1 | - | - | - | - | - | - | |||||||||||||||||||||||||||||||
| Texas Instruments AM6548BACDXEAF | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | Sitara™ | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 784-LFBGA, FCBGA | 784-FCBGA (23x23) | download | Not applicable | 1 (Unlimited) | 296-AM6548BACDXEAF | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A53, Arm® Cortex®-R5F | 1.1GHz, 400MHz | 4 Core, 32-Bit | GPU PowerVR SGX544-MP1 3D | DDR3, DDR4, LPDDR4 | Yes | LVDS, MIPI-CSI | 10/100/1000Mbps (2) | - | USB 2.0 (1), USB 3.1 (1) | 1.2V, 1.35V, 1.8V, 3.3V | 3DES, AES, DRBG, MD5, PKA, SHA | CAN, I²C, I²S, MMC/SD/SDIO, McASP, McSPI, QSPI, TDM, UART | |||||||||||||||||||||
| Texas Instruments AM6528BACDXEA | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | Sitara™ | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 784-LFBGA, FCBGA | 784-FCBGA (23x23) | download | Not applicable | 1 (Unlimited) | 296-AM6528BACDXEA | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A53, Arm® Cortex®-R5F | 1.1GHz, 400MHz | 2 Core, 32-Bit | GPU PowerVR SGX544-MP1 3D | DDR3, DDR4, LPDDR4 | Yes | LVDS, MIPI-CSI | 10/100/1000Mbps (2) | - | USB 2.0 (1), USB 3.1 (1) | 1.2V, 1.35V, 1.8V, 3.3V | 3DES, AES, DRBG, MD5, PKA, SHA | CAN, I²C, I²S, MMC/SD/SDIO, McASP, McSPI, QSPI, TDM, UART | |||||||||||||||||||||
|
Trenz Electronic GmbH 0823-01-S001 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0823 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0823-01-S001 | OBSOLETE | 1 | ARM Cortex-A53, ARM® Cortex®-R5 | - | - | - | MCU, FPGA | - | USB | |||||||||||||||||||||||||||||||
|
Trenz Electronic GmbH 0823-01-3PIU1MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0823 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0823-01-3PIU1MA | 1 | ARM Cortex-A53, ARM® Cortex®-R5 | - | 1GB | 128MB | MCU, FPGA | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | USB | ||||||||||||||||||||||||||||||||
|
Trenz Electronic GmbH 0823-01-3PIU1FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0823 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0823-01-3PIU1FA | OBSOLETE | 1 | ARM Cortex-A53, ARM® Cortex®-R5 | - | 1GB | 128MB | MCU, FPGA | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | USB | |||||||||||||||||||||||||||||||
|
Trenz Electronic GmbH 0782-02-82I33MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0782 | Bulk | Active | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | Not Applicable | 1686-TE0782-02-82I33MA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket | |||||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1015DAF5B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1010 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 100-LQFP | MIMXRT1015 | 100-LQFP (14x14) | ROHS3 Compliant | REACH Unaffected | 568-MIMXRT1015DAF5B | 1 | 57 | ARM® Cortex®-M7 | 32-Bit Single-Core | 500MHz | EBI/EMI, I²C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | External Program Memory | - | 128K x 8 | 3V ~ 3.6V | A/D 9x12b | External, Internal | |||||||||||||||||||||||
| NXP USA Inc. MIMXRT1021DAF5B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1020 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 100-LQFP | MIMXRT1021 | 100-LQFP (14x14) | ROHS3 Compliant | REACH Unaffected | 568-MIMXRT1021DAF5B | 1 | 57 | ARM® Cortex®-M7 | 32-Bit Single-Core | 500MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | External Program Memory | - | 256K x 8 | 3V ~ 3.6V | A/D 10x12b | External, Internal | |||||||||||||||||||||||
| NXP USA Inc. MIMXRT1015CAF4B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1010 | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 100-LQFP | MIMXRT1015 | 100-LQFP (14x14) | ROHS3 Compliant | REACH Unaffected | 568-MIMXRT1015CAF4B | 1 | 57 | ARM® Cortex®-M7 | 32-Bit Single-Core | 400MHz | EBI/EMI, I²C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | External Program Memory | - | 128K x 8 | 3V ~ 3.6V | A/D 9x12b | External, Internal | |||||||||||||||||||||||
| NXP USA Inc. MIMXRT1021DAG5B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1020 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 144-LQFP | MIMXRT1021 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-MIMXRT1021DAG5B | 1 | 96 | ARM® Cortex®-M7 | 32-Bit Single-Core | 500MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | External Program Memory | - | 256K x 8 | 3V ~ 3.6V | A/D 19x12b | External, Internal | ||||||||||||||||||||||
| iWave Systems IW-G35M-19EG-4E004G-E008G-BIE | iWave Systems |
Min: 1 Mult: 1 |
/image/iWave Systems | - | Bulk | Active | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 2503-IW-G35M-19EG-4E004G-E008G-BIE | 3A001A3 | 8473.30.1180 | 1 | |||||||||||||||||||||||||||||||||||||
| Silicon Labs EFM8BB52F16I-C-QFN20R | Silicon Labs |
Min: 1 Mult: 1 |
/image/Silicon Labs | Busy Bee | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 20-WFQFN Exposed Pad | EFM8BB52 | 20-QFN (3x3) | ROHS3 Compliant | 2 (1 Year) | 336-EFM8BB52F16I-C-QFN20RTR | 3A991A2 | 8542.31.0001 | 2,500 | 16 | CIP-51 8051 | 8-Bit | 50MHz | I²C, SMBus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1.25K x 8 | 1.8V ~ 5.5V | A/D 16x12b SAR; D/A 1x10b | Internal | |||||||||||||||||||||
| Silicon Labs EFM8BB51F8G-C-QFN20 | Silicon Labs |
Min: 1 Mult: 1 |
/image/Silicon Labs | Busy Bee | Strip | Discontinued at Digi-Key | -40°C ~ 85°C (TA) | Surface Mount | 20-WFQFN Exposed Pad | EFM8BB51 | 20-QFN (3x3) | download | ROHS3 Compliant | 2 (1 Year) | 336-EFM8BB51F8G-C-QFN20 | 3A991A2 | 8542.31.0001 | 200 | 16 | CIP-51 8051 | 8-Bit | 50MHz | I²C, SMBus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 1.25K x 8 | 1.8V ~ 5.5V | A/D 16x12b SAR | Internal | ||||||||||||||||||||
| Silicon Labs EFM8BB52F32G-C-TSSOP20R | Silicon Labs |
Min: 1 Mult: 1 |
/image/Silicon Labs | Busy Bee | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | EFM8BB52 | 20-TSSOP | ROHS3 Compliant | 2 (1 Year) | 336-EFM8BB52F32G-C-TSSOP20RTR | 3A991A2 | 8542.31.0001 | 2,000 | 16 | CIP-51 8051 | 8-Bit | 50MHz | I²C, SMBus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2.25K x 8 | 1.8V ~ 5.5V | A/D 16x12b SAR; D/A 1x10b | Internal |
