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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Base Product Number | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Total RAM Bits | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Flash Size | Primary Attributes | Controller Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MKE13Z128VLH7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE1xZ | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKE13Z128 | 64-LQFP (10x10) | download | ROHS3 Compliant | REACH Unaffected | 568-MKE13Z128VLH7 | 800 | 58 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 72MHz | FlexIO, I²C, SPI, UART/USART | DMA, LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 32K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A 1x8b | Internal | |||||||||||||||
| NXP USA Inc. MKE17Z256VLL7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE1xZ | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MKE17Z256 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-MKE17Z256VLL7 | 3A991A2 | 8542.31.0001 | 450 | 89 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 72MHz | FlexIO, I²C, SPI, UART/USART | DMA, LVD, PWM, WDT | 256KB (256K x 8) | FLASH | - | 48K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A 1x8b | Internal | ||||||||||||
| NXP USA Inc. MKE12Z256VLH7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE1xZ | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKE12Z256 | 64-LQFP (10x10) | download | ROHS3 Compliant | REACH Unaffected | 568-MKE12Z256VLH7 | 800 | 58 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 72MHz | FlexIO, I²C, SPI, UART/USART | DMA, LVD, PWM, WDT | 256KB (256K x 8) | FLASH | - | 48K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A 1x8b | Internal | |||||||||||||||
 |
NXP USA Inc. MKE12Z256VLL7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE1xZ | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MKE12Z256 | 100-LQFP (14x14) | download | ROHS3 Compliant | REACH Unaffected | 568-MKE12Z256VLL7 | 450 | 89 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 72MHz | FlexIO, I²C, SPI, UART/USART | DMA, LVD, PWM, WDT | 256KB (256K x 8) | FLASH | - | 48K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A 1x8b | Internal | ||||||||||||||
|
NXP USA Inc. MKE17Z128VLL7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE1xZ | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MKE17Z128 | 100-LQFP (14x14) | download | ROHS3 Compliant | REACH Unaffected | 568-MKE17Z128VLL7 | 450 | 89 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 72MHz | FlexIO, I²C, SPI, UART/USART | DMA, LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 32K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A 1x8b | Internal | ||||||||||||||
|
Silicon Labs CF342P1090BGM | Silicon Labs |
Min: 1 Mult: 1 |
/image/Silicon Labs | - | Tray | Active | CF342 | ROHS3 Compliant | 1 (Unlimited) | EAR99 | 8542.39.0001 | 73 | |||||||||||||||||||||||||||||||
|
Silicon Labs CF380P1104AGQ | Silicon Labs |
Min: 1 Mult: 1 |
/image/Silicon Labs | - | Tray | Active | CF380 | 3 (168 Hours) | EAR99 | 8542.39.0001 | 73 | ||||||||||||||||||||||||||||||||
|
Analog Devices Inc./Maxim Integrated MAXQ1062EUD+T | Analog Devices Inc./Maxim Integrated |
Min: 1 Mult: 1 |
/image/Analog Devices Inc./Maxim Integrated | - | Tape & Reel (TR) | Obsolete | -40°C ~ 109°C | Security | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | Not Verified | - | 14-TSSOP | download | ROHS3 Compliant | REACH Unaffected | OBSOLETE | 2,500 | MAXQ | EEPROM (8kB) | - | I²C, SPI | MAXQ™ | ||||||||||||||||||||
|
Analog Devices Inc./Maxim Integrated MAXQ1062ETP+ | Analog Devices Inc./Maxim Integrated |
Min: 1 Mult: 1 |
/image/Analog Devices Inc./Maxim Integrated | - | Tray | Obsolete | -40°C ~ 109°C | Security | Surface Mount | 20-WFQFN Exposed Pad | Not Verified | - | 20-TQFN (4x4) | download | ROHS3 Compliant | REACH Unaffected | OBSOLETE | 490 | MAXQ | EEPROM (8kB) | - | I²C, SPI | MAXQ™ | ||||||||||||||||||||
|
STMicroelectronics STM8AF6226UDX | STMicroelectronics |
Min: 1 Mult: 1 |
/image/STMicroelectronics | Automotive, AEC-Q100, STM8A | Tape & Reel (TR) | Not For New Designs | -40°C ~ 150°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | STM8 | 32-VFQFPN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 497-STM8AF6226UDXTR | 3,000 | 28 | STM8A | 8-Bit | 16MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 8KB (8K x 8) | FLASH | 640 x 8 | 1K x 8 | 3V ~ 5.5V | A/D 7x10b SAR | Internal | |||||||||||||
| Microchip Technology AT89C51RC2T-RLRUL | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | 89C | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | AT89C51 | 44-VQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-AT89C51RC2T-RLRULTR | 3A991A2 | 8542.31.0001 | 2,000 | 32 | 80C51 | 8-Bit | 40MHz | SPI, UART/USART | POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 1.25K x 8 | 2.7V ~ 5.5V | - | External | |||||||||||||
| Microchip Technology AT89C51RD2T-RLTUM | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | 89C | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | AT89C51 | 44-VQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-AT89C51RD2T-RLTUM | 3A991A2 | 8542.31.0001 | 160 | 34 | 80C51 | 8-Bit | 60MHz | SPI, UART/USART | POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | - | External | |||||||||||||
| Microchip Technology AT89C51CC03UAT-RLTUM | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | AT89C CAN | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | AT89C51 | 44-VQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-AT89C51CC03UAT-RLTUM | 3A991A2 | 8542.31.0001 | 160 | 36 | 80C51 | 8-Bit | 40MHz | CANbus, SPI, UART/USART | POR, PWM, WDT | 64KB (64K x 8) | FLASH | 2K x 8 | 2.25K x 8 | 3V ~ 5.5V | A/D 8x10b | External | |||||||||||||
| Microchip Technology AT89C51ED2T-RLTUM | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | 89C | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | AT89C51 | 44-VQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-AT89C51ED2T-RLTUM | 3A991A2 | 8542.31.0001 | 160 | 34 | 80C51 | 8-Bit | 60MHz | SPI, UART/USART | POR, PWM, WDT | 64KB (64K x 8) | FLASH | 2K x 8 | 2K x 8 | 2.7V ~ 5.5V | - | External | |||||||||||||
| Microchip Technology AT80C51RD2T-RLTUM | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | 80C | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | AT80C51RD2 | 44-VQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-AT80C51RD2T-RLTUM | 3A991A2 | 8542.31.0001 | 160 | 32 | 80C51 | 8-Bit | 40MHz | UART/USART | POR, PWM, WDT | - | ROMless | - | 1K x 8 | 2.7V ~ 5.5V | - | Internal | |||||||||||||
| Microchip Technology AT80C51RD2T-RLRUM | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | 89C | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | AT80C51RD2 | 44-VQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-AT80C51RD2T-RLRUMTR | 3A991A2 | 8542.31.0001 | 2,000 | 32 | 80C51 | 8-Bit | 40MHz | UART/USART | POR, PWM, WDT | - | ROMless | - | 1K x 8 | 2.7V ~ 5.5V | - | Internal | |||||||||||||
| Microchip Technology AT89C51RC2T-RLTUL | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | 89C | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | AT89C51 | 44-VQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-AT89C51RC2T-RLTUL | 3A991A2 | 8542.31.0001 | 160 | 32 | 80C51 | 8-Bit | 40MHz | SPI, UART/USART | POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 1.25K x 8 | 2.7V ~ 5.5V | - | External | |||||||||||||
|
onsemi LC823170PRB-4H | onsemi |
Min: 1 Mult: 1 |
/image/onsemi | - | Tray | Obsolete | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 488-LC823170PRB-4H | OBSOLETE | 1 | |||||||||||||||||||||||||||||||
| Renesas Electronics America Inc R5F524TAAGFF#31 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RX24T | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | R5F524 | 80-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 60 | RXv2 | 32-Bit Single-Core | 80MHz | I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 8K x 8 | 16K x 8 | 2.7V ~ 5.5V | A/D 17x12b; D/A 1x8b | Internal | |||||||||||||
|
AMD XC5VLX110-1FFG676I4165 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Virtex®-5 LX | Tray | Obsolete | -40°C ~ 100°C (TJ) | Surface Mount | 676-BBGA, FCBGA | Not Verified | 0.95V ~ 1.05V | 676-FCBGA (27x27) | download | 4 (72 Hours) | 122-XC5VLX110-1FFG676I4165 | OBSOLETE | 1 | 4718592 | 440 | 8640 | 110592 | ||||||||||||||||||||||
| AMD XAZU11EG-1FFVF1517Q | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 125°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XAZU11EG-1FFVF1517Q | 1 | MPU, FPGA | 464 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | |||||||||||||||||||||
| AMD XCVC1802-1MSIVSVD1760 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1802-1MSIVSVD1760 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 692 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.5M Logic Cells | |||||||||||||||||||
| AMD XCVM1802-1LLIVSVA2197 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1802-1LLIVSVA2197 | 1 | MPU, FPGA | 770 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 1.9M Logic Cells | |||||||||||||||||||||
| AMD XCZU2EG-2UBVA530E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU2EG-2UBVA530E | 1 | MPU, FPGA | 82 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.333GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||
| AMD XCVC1802-2MLEVIVA1596 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1802-2MLEVIVA1596 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.5M Logic Cells | |||||||||||||||||||
| AMD XCVM1802-1LSEVSVA2197 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1802-1LSEVSVA2197 | 1 | MPU, FPGA | 770 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 1.9M Logic Cells | |||||||||||||||||||||
| AMD XCZU3CG-1UBVA530E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | 0°C ~ 100°C (TJ) | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU3CG-1UBVA530E | 1 | MPU, FPGA | 82 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | |||||||||||||||||||||
| AMD XCZU49DR-1FSVF1760I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU49DR-1FSVF1760I | 1 | MCU, FPGA | 622 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | |||||||||||||||||||||
| AMD XCZU43DR-L1FSVG1517I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU43DR-L1FSVG1517I | 1 | MCU, FPGA | 561 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | |||||||||||||||||||||
| AMD XCVU23P-2FSVJ1760I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Virtex® UltraScale+™ | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 1760-BBGA, FCBGA | Not Verified | 0.825V ~ 0.876V | 1760-FCBGA (42.5x42.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVU23P-2FSVJ1760I | 3A001A7B | 8542.39.0001 | 1 | 77909197 | 644 | 128700 | 2252250 |
