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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Size / Dimension | Mounting Type | Package / Case | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Flash Size | Module/Board Type | Co-Processor | Connector Type | Controller Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
Renesas Electronics America Inc R7FA6M5BG2CBM#BC0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RA6M5 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LFBGA | 144-LFBGA (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R7FA6M5BG2CBM#BC0 | 2,080 | 109 | ARM® Cortex®-M33 | 32-Bit | 200MHz | 1.5MB (1.5M x 8) | FLASH | 8K x 8 | 512K x 8 | 2.7V ~ 3.6V | A/D 25x12b SAR; D/A 2x12b | Internal | ||||||||||||||
|
Renesas Electronics America Inc R5F565NCHGFC#V0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RX65N | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP | 176-LFQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R5F565NCHGFC#V0 | 40 | 136 | RXv2 | 32-Bit | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB | DMA, LVD, POR, PWM, WDT | 1.5MB (1.5M x 8) | FLASH | 32K x 8 | 640K x 8 | 2.7V ~ 3.6V | A/D 29x12b; D/A 2x12b | External | ||||||||||||
|
Renesas Electronics America Inc R7FA4M3AE2CBQ#BC0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RA4M3 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LFBGA | 64-LFBGA (6x6) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R7FA4M3AE2CBQ#BC0 | 3,016 | 45 | ARM® Cortex®-M33 | 32-Bit | 100MHz | 768KB (768K x 8) | FLASH | 8K x 8 | 128K x 8 | 2.7V ~ 3.6V | A/D 11x12b SAR; D/A 2x12b | Internal | ||||||||||||||
|
Renesas Electronics America Inc R7F100GAF3CSP#BA0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RL78/G23 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 30-LSSOP (0.240", 6.10mm Width) | 30-LSSOP | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R7F100GAF3CSP#BA0 | 1,680 | 25 | RL78 | 16-Bit | 32MHz | CSI, I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 8K x 8 | 12K x 8 | 1.8V ~ 5.5V | A/D 8x8/10b/12b; D/A 2x8b | Internal | ||||||||||||
|
Infineon Technologies CYPD4126-24LQXIT | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | EZ-PD™ CCG4 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | USB Type C | Surface Mount | 24-UFQFN Exposed Pad | 2.7V ~ 5.5V | 24-QFN (4x4) | ROHS3 Compliant | REACH Unaffected | 2,500 | 11 | ARM® Cortex®-M0 | FLASH (128kB) | 8K x 8 | - | ||||||||||||||||||||
|
Infineon Technologies S6J334DHEESE20000 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | Traveo™ T1G | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP Exposed Pad | 144-TEQFP (20x20) | ROHS3 Compliant | REACH Unaffected | 60 | 116 | ARM® Cortex®-R5F | 32-Bit | 240MHz | CANbus, CSIO, I²C, LINbus, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | FLASH | 112K x 8 | 544K x 8 | 3V ~ 3.6V | Internal | ||||||||||||||||
|
Infineon Technologies S6J334DHFESE20000 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | Traveo™ T1G | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP Exposed Pad | 144-TEQFP (20x20) | ROHS3 Compliant | REACH Unaffected | 60 | 116 | ARM® Cortex®-R5F | 32-Bit | 240MHz | CANbus, CSIO, I²C, LINbus, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | FLASH | 112K x 8 | 544K x 8 | 3V ~ 3.6V | Internal | ||||||||||||||||
|
Infineon Technologies S6J332DJEESE20000 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | Traveo™ T1G | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP Exposed Pad | 176-TEQFP (24x24) | ROHS3 Compliant | REACH Unaffected | 40 | 150 | ARM® Cortex®-R5F | 32-Bit | 240MHz | CANbus, CSIO, I²C, LINbus, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | FLASH | 112K x 8 | 544K x 8 | 3V ~ 3.6V | A/D 48x12b | Internal | |||||||||||||||
|
Infineon Technologies CY9AF156NPMC-G-JNK1E2 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | FM3 MB9A150R | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-LQFP (14x14) | ROHS3 Compliant | REACH Unaffected | 90 | 83 | ARM® Cortex®-M3 | 32-Bit | 40MHz | CSIO, EBI/EMI, I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 544KB (544K x 8) | FLASH | - | 64K x 8 | 1.65V ~ 3.6V | A/D 24x12b | Internal | ||||||||||||||
|
AMD XCVP1102-1LLIVSVA2785 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal® Premium | Tray | Active | -40°C ~ 110°C (TJ) | 2785-BFBGA, FCBGA | 2785-FCBGA (50x50) | 4 (72 Hours) | 122-XCVP1102-1LLIVSVA2785 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | ||||||||||||||||||||
|
AMD XCVP1402-1LSEVSVA3340 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal® Premium | Tray | Active | 0°C ~ 100°C (TJ) | 4 (72 Hours) | 122-XCVP1402-1LSEVSVA3340 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | ||||||||||||||||||||||
|
AMD XCVP1402-1LSIVSVA2785 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal® Premium | Tray | Active | -40°C ~ 110°C (TJ) | 2785-BFBGA, FCBGA | 2785-FCBGA (50x50) | 4 (72 Hours) | 122-XCVP1402-1LSIVSVA2785 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | ||||||||||||||||||||
|
AMD XCVP1102-2LLEVSVA2785 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal® Premium | Tray | Active | 2785-BFBGA, FCBGA | 2785-FCBGA (50x50) | 4 (72 Hours) | 122-XCVP1102-2LLEVSVA2785 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | |||||||||||||||||||||
|
AMD XCVP1402-1LLIVSVA2785 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal® Premium | Tray | Active | -40°C ~ 110°C (TJ) | 2785-BFBGA, FCBGA | 2785-FCBGA (50x50) | 4 (72 Hours) | 122-XCVP1402-1LLIVSVA2785 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | ||||||||||||||||||||
|
Analog Devices Inc./Maxim Integrated MAX32570-MNJ+ | Analog Devices Inc./Maxim Integrated |
Min: 1 Mult: 1 |
/image/Analog Devices Inc./Maxim Integrated | DeepCover® | Tray | Active | -40°C ~ 105°C | Surface Mount | 121-LFBGA | 121-CTBGA (8x8) | 8542.31.0001 | 1 | ARM® Cortex®-M4F | 32-Bit | 150MHz | 1MB (512K x 16) | FLASH | - | - | Internal | ||||||||||||||||||||
| MYIR Tech Limited MYC-CZU5EV-V2-4E4D-1200-I | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | MYC-CZU3EG | Book | Active | -40°C ~ 85°C | 2.362" L x 2.047" W (60.00mm x 52.00mm) | download | 3309-MYC-CZU5EV-V2-4E4D-1200-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | 4GB | MCU, Ethernet Core | Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I | Pin(s) | |||||||||||||||||||||||
| MYIR Tech Limited MYC-C3358-V4-512N512D-100-C | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | MYC-AM335X | Book | Active | 0°C ~ 70°C | 2.756" L x 1.969" W (70.00mm x 50.00mm) | download | 3309-MYC-C3358-V4-512N512D-100-C | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A8 | 1GHz | 512MB | MPU Core | - | Pin(s) | ||||||||||||||||||||||
|
MYIR Tech Limited MYC-J3352-V2-256N256D-80-I | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | MCC-AM335X-J | Book | Active | -40°C ~ 85°C | 2.661" L x 1.772" W (67.60mm x 45.00mm) | download | 3309-MYC-J3352-V2-256N256D-80-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A8 | 1GHz | 256MB | MCU, Ethernet Core | - | Pin(s) | |||||||||||||||||||||
| MYIR Tech Limited MYC-C4377-V2-4E512D-100-I | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | MYC-C437X | Book | Active | -40°C ~ 85°C | 2.362" L x 1.772" W (60.00mm x 45.00mm) | download | 3309-MYC-C4377-V2-4E512D-100-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A9 | 1GHz | 512MB | MCU, Ethernet Core | - | Pin(s) | ||||||||||||||||||||||
| MYIR Tech Limited MYC-C3352-V4-512N512D-80-I | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | MYC-AM335X | Book | Active | -40°C ~ 85°C | 2.756" L x 1.969" W (70.00mm x 50.00mm) | download | 3309-MYC-C3352-V4-512N512D-80-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A8 | 1GHz | 512MB | MPU Core | - | Pin(s) | ||||||||||||||||||||||
| MYIR Tech Limited MYC-C7Z010-V2-4E1D-667-I | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | MYC-C7Z010 | Book | Active | -40°C ~ 85°C | 2.953" L x 2.165" W (75.00mm x 55.00mm) | download | 3309-MYC-C7Z010-V2-4E1D-667-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A9 | 1GB | FPGA | Pin(s) | ||||||||||||||||||||||||
| MYIR Tech Limited MYC-C3352-V4-256N256D-80-I | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | MYC-AM335X | Book | Active | -40°C ~ 85°C | 2.756" L x 1.969" W (70.00mm x 50.00mm) | download | 3309-MYC-C3352-V4-256N256D-80-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A8 | 1GHz | 512MB | MPU Core | - | Pin(s) | ||||||||||||||||||||||
| NXP USA Inc. S912ZVC96AMLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | ROHS3 Compliant | 568-S912ZVC96AMLFRTR | 2,000 | 28 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 2K x 8 | 8K x 8 | 5.5V ~ 18V | A/D 10x10b SAR | External, Internal | |||||||||||||||
| NXP USA Inc. S912ZVC64AVLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | ROHS3 Compliant | 568-S912ZVC64AVLF | 1,250 | 28 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 1K x 8 | 4K x 8 | 5.5V ~ 18V | A/D 10x10b SAR | External, Internal | |||||||||||||||
| NXP USA Inc. S912ZVC96AVLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | ROHS3 Compliant | 568-S912ZVC96AVLF | 1,250 | 28 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 2K x 8 | 8K x 8 | 5.5V ~ 18V | A/D 10x10b SAR | External, Internal | |||||||||||||||
| NXP USA Inc. S912ZVC64AMLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | ROHS3 Compliant | 568-S912ZVC64AMLFRTR | 2,000 | 28 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 1K x 8 | 4K x 8 | 5.5V ~ 18V | A/D 10x10b SAR | External, Internal | |||||||||||||||
| NXP USA Inc. S912ZVCA19AMKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | 64-LQFP (10x10) | ROHS3 Compliant | 568-S912ZVCA19AMKH | 800 | 42 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 192KB (192K x 8) | FLASH | 2K x 8 | 12K x 8 | 5.5V ~ 18V | A/D 16x12b SAR; D/A 1x8b | External, Internal | |||||||||||||||
| NXP USA Inc. S912ZVCA19AMLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | ROHS3 Compliant | 568-S912ZVCA19AMLFRTR | 2,000 | 28 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 192KB (192K x 8) | FLASH | 2K x 8 | 12K x 8 | 5.5V ~ 18V | A/D 10x12b SAR; D/A 1x8b | External, Internal | |||||||||||||||
|
NXP USA Inc. FS32R294LAK0MJDT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32R | Tray | Active | - | Surface Mount | 269-LFBGA | 269-LFBGA (14x14) | ROHS3 Compliant | 568-FS32R294LAK0MJDT | 760 | 32-Bit 5-Core | - | 3MB (3M x 8) | SRAM | - | 2.5M x 8 | - | - | Internal | ||||||||||||||||||
|
NXP USA Inc. FH32K144UIT0VLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | ROHS3 Compliant | 568-FH32K144UIT0VLHRTR | 1,500 |