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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. SPC5674FF3MVZ2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 324-BBGA | SPC5674 | 324-PBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 60 | 22 | e200z7 | 32-Bit Single-Core | 200MHz | CANbus, SCI, SPI | DMA, POR, PWM | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08V ~ 5.25V | A/D 48x12b | External | |||||||||||||
| Microchip Technology ATXMEGA32C3-AU | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | AVR® XMEGA® C3 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-TQFP | ATXMEGA32 | 64-TQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 90 | 50 | AVR | 8/16-Bit | 32MHz | I²C, IrDA, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 32KB (16K x 16) | FLASH | 2K x 8 | 4K x 8 | 1.6V ~ 3.6V | A/D 16x12b | Internal | |||||||||||||
| Microchip Technology ATXMEGA32C3-MH | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | AVR® XMEGA® C3 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | ATXMEGA32 | 64-QFN (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 260 | 50 | AVR | 8/16-Bit | 32MHz | I²C, IrDA, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 32KB (16K x 16) | FLASH | 2K x 8 | 4K x 8 | 1.6V ~ 3.6V | A/D 16x12b | Internal | |||||||||||||
| Microchip Technology ATXMEGA32D3-AU | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | AVR® XMEGA® D3 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-TQFP | ATXMEGA32 | 64-TQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 50 | AVR | 8/16-Bit | 32MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 32KB (16K x 16) | FLASH | 1K x 8 | 4K x 8 | 1.6V ~ 3.6V | A/D 16x12b | Internal | |||||||||||||
| Microchip Technology ATXMEGA32D3-AUR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | AVR® XMEGA® D3 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-TQFP | ATXMEGA32 | 64-TQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,000 | 50 | AVR | 8/16-Bit | 32MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 32KB (16K x 16) | FLASH | 1K x 8 | 4K x 8 | 1.6V ~ 3.6V | A/D 16x12b | Internal | |||||||||||||
| Microchip Technology ATXMEGA32D3-MHR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | AVR® XMEGA® D3 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | ATXMEGA32 | 64-QFN (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 4,000 | 50 | AVR | 8/16-Bit | 32MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 32KB (16K x 16) | FLASH | 1K x 8 | 4K x 8 | 1.6V ~ 3.6V | A/D 16x12b | Internal | |||||||||||||
| Microchip Technology ATTINY24A-MM8R | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | AVR® ATtiny | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | ATTINY24 | 20-VQFN (3x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 6,000 | 12 | AVR | 8-Bit | 20MHz | USI | Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT | 2KB (1K x 16) | FLASH | 128 x 8 | 128 x 8 | 1.8V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||
| NXP USA Inc. MC9S08QE32CLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316984528 | 3A991A2 | 8542.31.0001 | 2,000 | 26 | S08 | 8-Bit | 50MHz | I²C, LINbus, SCI, SPI | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 10x12b | Internal | ||||||||||||
| NXP USA Inc. MK60FN1M0VMD12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK60FN1M0 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,000 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 58x16b; D/A 2x12b | Internal | |||||||||||||
| NXP USA Inc. S9S12P32J0VFTR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | S9S12 | 48-QFN-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 34 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 4K x 8 | 2K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | ||||||||||||||
| NXP USA Inc. S9S12P96J0VFTR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | S9S12 | 48-QFN-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310186528 | 3A991A2 | 8542.31.0001 | 2,000 | 34 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 4K x 8 | 6K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | |||||||||||||
| NXP USA Inc. S9S12XS128J1CAER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | S9S12 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,500 | 44 | HCS12X | 16-Bit | 40MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 8K x 8 | 1.72V ~ 5.5V | A/D 8x12b | External | |||||||||||||
| NXP USA Inc. MC56F84550VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MC56F84 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 39 | 56800EX | 32-Bit Single-Core | 80MHz | CANbus, I²C, LINbus, SCI, SPI | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 2K x 8 | 16K x 8 | 3V ~ 3.6V | A/D 10x12b; D/A 1x12b | Internal | ||||||||||||||
| NXP USA Inc. MCIMX6D6AVT10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314739557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX6D7CVT08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319926557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX6L2DVN10AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SL | Tray | Obsolete | 0°C ~ 95°C (TJ) | Surface Mount | 432-TFBGA | MCIMX6 | 432-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 320 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | |||||||||||||
| NXP USA Inc. MCIMX6L3EVN10AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SL | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 432-TFBGA | MCIMX6 | 432-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 320 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | |||||||||||||
| NXP USA Inc. MCIMX6L8DVN10AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SL | Tray | Not For New Designs | 0°C ~ 95°C (TJ) | Surface Mount | 432-TFBGA | MCIMX6 | 432-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311127557 | 5A992C | 8542.31.0001 | 160 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX6Q4AVT10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320155557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 1.0GHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX6Q6AVT10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316342557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 1.0GHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX6Q7CVT08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311044557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 800MHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
| Microchip Technology DSPIC33EP512GP502-E/SP | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP | Tube | Active | -40°C ~ 125°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | DSPIC33EP512GP502 | 28-SPDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 15 | 21 | dsPIC | 16-Bit | 60 MIPs | CANbus, I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 512KB (170K x 24) | FLASH | - | 24K x 16 | 3V ~ 3.6V | A/D 6x10b/12b | Internal | |||||||||||||
| Microchip Technology DSPIC33EP512GP502-I/MM | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | dsPIC™ 33EP | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-VQFN Exposed Pad | DSPIC33EP512GP502 | 28-QFN-S (6x6) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 61 | 21 | dsPIC | 16-Bit | 70 MIPs | CANbus, I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 512KB (170K x 24) | FLASH | - | 24K x 16 | 3V ~ 3.6V | A/D 6x10b/12b | Internal | |||||||||||||
| Microchip Technology DSPIC33EP512GP504-E/TL | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 44-VFTLA Exposed Pad | DSPIC33EP512GP504 | 44-VTLA (6x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 61 | 35 | dsPIC | 16-Bit | 60 MIPs | CANbus, I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 512KB (170K x 24) | FLASH | - | 24K x 16 | 3V ~ 3.6V | A/D 9x10b/12b | Internal | |||||||||||||
| Microchip Technology DSPIC33EP512GP504-H/ML | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP | Tube | Active | -40°C ~ 150°C (TA) | Surface Mount | 44-VQFN Exposed Pad | DSPIC33EP512GP504 | 44-QFN (8x8) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A001A2A | 8542.31.0001 | 45 | 35 | dsPIC | 16-Bit | 60 MIPs | CANbus, I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 512KB (170K x 24) | FLASH | - | 24K x 16 | 3V ~ 3.6V | A/D 9x10b/12b | Internal | |||||||||||||
| Microchip Technology DSPIC33EP512MC202-E/MM | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-VQFN Exposed Pad | DSPIC33EP512MC202 | 28-QFN-S (6x6) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 61 | 21 | dsPIC | 16-Bit | 60 MIPs | I²C, IrDA, LINbus, QEI, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | 512KB (170K x 24) | FLASH | - | 24K x 16 | 3V ~ 3.6V | A/D 6x10b/12b | Internal | |||||||||||||
| Microchip Technology DSPIC33EP512MC202-H/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP | Tube | Active | -40°C ~ 150°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | DSPIC33EP512MC202 | 28-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A001A2A | 8542.31.0001 | 27 | 21 | dsPIC | 16-Bit | 60 MIPs | I²C, IrDA, LINbus, QEI, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | 512KB (170K x 24) | FLASH | - | 24K x 16 | 3V ~ 3.6V | A/D 6x10b/12b | Internal | |||||||||||||
| Microchip Technology DSPIC33EP512MC202-H/SP | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP | Tube | Active | -40°C ~ 150°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | DSPIC33EP512MC202 | 28-SPDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A001A2A | 8542.31.0001 | 15 | 21 | dsPIC | 16-Bit | 60 MIPs | I²C, IrDA, LINbus, QEI, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | 512KB (170K x 24) | FLASH | - | 24K x 16 | 3V ~ 3.6V | A/D 6x10b/12b | Internal | |||||||||||||
| Microchip Technology DSPIC33EP512MC202-I/SP | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | dsPIC™ 33EP | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | DSPIC33EP512MC202 | 28-SPDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 15 | 21 | dsPIC | 16-Bit | 70 MIPs | I²C, IrDA, LINbus, QEI, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | 512KB (170K x 24) | FLASH | - | 24K x 16 | 3V ~ 3.6V | A/D 6x10b/12b | Internal | |||||||||||||
| Microchip Technology DSPIC33EP512MC204-E/ML | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 44-VQFN Exposed Pad | DSPIC33EP512MC204 | 44-QFN (8x8) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 45 | 35 | dsPIC | 16-Bit | 60 MIPs | I²C, IrDA, LINbus, QEI, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | 512KB (170K x 24) | FLASH | - | 24K x 16 | 3V ~ 3.6V | A/D 9x10b/12b | Internal |
