Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Total RAM Bits | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology PIC18LF55K42-I/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-UFQFN Exposed Pad | PIC18LF55K42 | 48-UQFN (6x6) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 61 | 44 | PIC | 8-Bit | 64MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 32KB (16K x 16) | FLASH | 256 x 8 | 2K x 8 | 1.8V ~ 3.6V | A/D 43x12b; D/A 1x5b | Internal | |||||||
NXP USA Inc. LPC54606J256ET100E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC546xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-TFBGA | LPC54606 | 100-TFBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 16K x 8 | 136K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | |||||||
NXP USA Inc. LPC54616J512ET100E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC546xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-TFBGA | LPC54616 | 100-TFBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 200K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | |||||||
NXP USA Inc. LPC54606J256BD100E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC546xx | Tray | Discontinued at Digi-Key | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | LPC54606 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 16K x 8 | 136K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | |||||||
NXP USA Inc. LPC54616J256ET180E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC546xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 180-TFBGA | LPC54616 | 180-TFBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935340232551 | 3A991A2 | 8542.31.0001 | 189 | 145 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 16K x 8 | 136K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | ||||||
NXP USA Inc. LPC54618J512ET180E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC546xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 180-TFBGA | LPC54618 | 180-TFBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935340235551 | 5A002A1 | 8542.31.0001 | 189 | 145 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 200K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | ||||||
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MaxLinear, Inc. S6100PHI-3 | MaxLinear, Inc. |
Min: 1 Mult: 1 |
/image/MaxLinear, Inc. | * | Bulk | Obsolete | 3 (168 Hours) | OBSOLETE | 0000.00.0000 | 1 | |||||||||||||||||||||||||||
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MaxLinear, Inc. S7110PB-HC2 | MaxLinear, Inc. |
Min: 1 Mult: 1 |
/image/MaxLinear, Inc. | * | Bulk | Obsolete | 3 (168 Hours) | OBSOLETE | 0000.00.0000 | 90 | |||||||||||||||||||||||||||
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MaxLinear, Inc. XR9240CB-F | MaxLinear, Inc. |
Min: 1 Mult: 1 |
/image/MaxLinear, Inc. | * | Bulk | Obsolete | download | Not Applicable | OBSOLETE | 0000.00.0000 | 1 | ||||||||||||||||||||||||||
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AMD XCKU15P-1FFVA1156E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Kintex® UltraScale+™ | Tray | Active | 0°C ~ 100°C (TJ) | Surface Mount | 1156-BBGA, FCBGA | XCKU15 | Not Verified | 0.825V ~ 0.876V | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 3A991D | 8542.39.0001 | 1 | 82329600 | 516 | 65340 | 1143450 | ||||||||||||||
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AMD XCKU15P-1FFVA1156I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Kintex® UltraScale+™ | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 1156-BBGA, FCBGA | XCKU15 | Not Verified | 0.825V ~ 0.876V | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 3A991D | 8542.39.0001 | 1 | 82329600 | 516 | 65340 | 1143450 | ||||||||||||||
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AMD XCKU15P-2FFVA1156E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Kintex® UltraScale+™ | Tray | Active | 0°C ~ 100°C (TJ) | Surface Mount | 1156-BBGA, FCBGA | XCKU15 | Not Verified | 0.825V ~ 0.876V | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 3A991D | 8542.39.0001 | 1 | 82329600 | 516 | 65340 | 1143450 | ||||||||||||||
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AMD XCKU15P-1FFVE1760I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Kintex® UltraScale+™ | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 1760-BBGA, FCBGA | XCKU15 | Not Verified | 0.825V ~ 0.876V | 1760-FCBGA (42.5x42.5) | download | ROHS3 Compliant | 4 (72 Hours) | 3A001A7B | 8542.39.0001 | 1 | 82329600 | 668 | 65340 | 1143450 | ||||||||||||||
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AMD XCKU15P-1FFVA1760I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Kintex® UltraScale+™ | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 1760-BBGA, FCBGA | XCKU15 | Not Verified | 0.825V ~ 0.876V | 1760-FCBGA (42.5x42.5) | download | ROHS3 Compliant | 4 (72 Hours) | 3A001A7B | 8542.39.0001 | 1 | 82329600 | 512 | 65340 | 1143450 | ||||||||||||||
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AMD XCKU15P-2FFVA1156I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Kintex® UltraScale+™ | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 1156-BBGA, FCBGA | XCKU15 | Not Verified | 0.825V ~ 0.876V | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 3A991D | 8542.39.0001 | 1 | 82329600 | 516 | 65340 | 1143450 | ||||||||||||||
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AMD XCKU15P-2FFVE1760E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Kintex® UltraScale+™ | Tray | Active | 0°C ~ 100°C (TJ) | Surface Mount | 1760-BBGA, FCBGA | XCKU15 | Not Verified | 0.825V ~ 0.876V | 1760-FCBGA (42.5x42.5) | download | ROHS3 Compliant | 4 (72 Hours) | 3A001A7B | 8542.39.0001 | 1 | 82329600 | 668 | 65340 | 1143450 | ||||||||||||||
Microchip Technology PIC18F27K42T-I/ML | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-VQFN Exposed Pad | PIC18F27 | 28-QFN (6x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,600 | 25 | PIC | 8-Bit | 64MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | 128KB (64K x 16) | FLASH | 1K x 8 | 8K x 8 | 2.3V ~ 5.5V | A/D 24x12b; D/A 1x5b | Internal | |||||||
Microchip Technology PIC18F27K42T-I/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | PIC18F27 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,600 | 25 | PIC | 8-Bit | 64MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | 128KB (64K x 16) | FLASH | 1K x 8 | 8K x 8 | 2.3V ~ 5.5V | A/D 24x12b; D/A 1x5b | Internal | |||||||
Microchip Technology PIC18F27K42T-I/SS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | PIC18F27 | 28-SSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,100 | 25 | PIC | 8-Bit | 64MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | 128KB (64K x 16) | FLASH | 1K x 8 | 8K x 8 | 2.3V ~ 5.5V | A/D 24x12b; D/A 1x5b | Internal | |||||||
Microchip Technology PIC18F47K42T-I/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 40-UFQFN Exposed Pad | PIC18F47 | 40-UQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,300 | 36 | PIC | 8-Bit | 64MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | 128KB (64K x 16) | FLASH | 1K x 8 | 8K x 8 | 2.3V ~ 5.5V | A/D 35x12b; D/A 1x5b | Internal | |||||||
Microchip Technology PIC18F47K42-I/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-TQFP | PIC18F47 | 44-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 36 | PIC | 8-Bit | 64MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | 128KB (64K x 16) | FLASH | 1K x 8 | 8K x 8 | 2.3V ~ 5.5V | A/D 35x12b; D/A 1x5b | Internal | |||||||
Microchip Technology PIC18F27K42-I/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 18K | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | PIC18F27 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 27 | 25 | PIC | 8-Bit | 64MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | 128KB (64K x 16) | FLASH | 1K x 8 | 8K x 8 | 2.3V ~ 5.5V | A/D 24x12b; D/A 1x5b | Internal | |||||||
Microchip Technology ATSAML22G17A-UUT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM L22G | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 49-UFBGA, WLCSP | ATSAML22 | 49-WLCSP (2.84x2.84) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 5,000 | 36 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 32MHz | I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.62V ~ 3.63V | A/D 10x12b | Internal | |||||||
NXP USA Inc. S912ZVML64F1VKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935354451557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||
NXP USA Inc. S912ZVML32F2MKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935354764557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||
NXP USA Inc. S912ZVMC64F2WKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935354762557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||
NXP USA Inc. S912ZVMC64F2MKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935354759557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||
NXP USA Inc. S912ZVMC12F2VKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935354758557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, SCI, SPI | DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||
NXP USA Inc. S912ZVMC12F1VKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935354448557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, SCI, SPI | DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||
Intel 10CL006ZE144I8G | Intel |
Min: 1 Mult: 1 |
/image/Intel | Cyclone® 10 LP | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 144-LQFP Exposed Pad | Not Verified | 1.0V | 144-EQFP (20x20) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 60 | 276480 | 88 | 392 | 6272 |
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