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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MCIMX534AVV8C2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX53 | Tray | Obsolete | -40°C ~ 125°C (TJ) | Surface Mount | 529-FBGA | MCIMX534 | 529-FBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312069557 | 5A992C | 8542.31.0001 | 84 | ARM® Cortex®-A8 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR2, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2), USB 2.0 + PHY (2) | 1.3V, 1.8V, 2.775V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 1-Wire, AC'97, CAN, I²C, I²S, MMC/SD, SAI, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX534AVV8C2R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX53 | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TJ) | Surface Mount | 529-FBGA | MCIMX534 | 529-FBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312069518 | 5A992C | 8542.31.0001 | 750 | ARM® Cortex®-A8 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR2, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2), USB 2.0 + PHY (2) | 1.3V, 1.8V, 2.775V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 1-Wire, AC'97, CAN, I²C, I²S, MMC/SD, SAI, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX536AVV8C2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX53 | Tray | Obsolete | -40°C ~ 125°C (TJ) | Surface Mount | 529-FBGA | MCIMX536 | 529-FBGA (19x19) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311377557 | 5A992C | 8542.31.0001 | 420 | ARM® Cortex®-A8 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR2, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2), USB 2.0 + PHY (2) | 1.3V, 1.8V, 2.775V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 1-Wire, AC'97, CAN, I²C, I²S, MMC/SD, SAI, SPI, SSI, UART | |||||||||||||
| NXP USA Inc. MCIMX536AVV8C2R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX53 | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TJ) | Surface Mount | 529-FBGA | MCIMX536 | 529-FBGA (19x19) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311377518 | 5A992C | 8542.31.0001 | 750 | ARM® Cortex®-A8 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR2, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2), USB 2.0 + PHY (2) | 1.3V, 1.8V, 2.775V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 1-Wire, AC'97, CAN, I²C, I²S, MMC/SD, SAI, SPI, SSI, UART | |||||||||||||
| NXP USA Inc. MCIMX537CVV8C2R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX53 | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 529-FBGA | MCIMX537 | 529-FBGA (19x19) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318276518 | 5A992C | 8542.31.0001 | 750 | ARM® Cortex®-A8 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR2, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2), USB 2.0 + PHY (2) | 1.3V, 1.8V, 2.775V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 1-Wire, AC'97, CAN, I²C, I²S, MMC/SD, SAI, SPI, SSI, UART | |||||||||||||
 |
NXP USA Inc. MCIMX6D7CZK08AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 569-LFBGA | MCIMX6 | 569-MAPBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315782557 | 5A992C | 8542.31.0001 | 189 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||
|
NXP USA Inc. MCIMX6D7CZK08AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 569-LFBGA | MCIMX6 | 569-MAPBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935354328557 | 5A992C | 8542.31.0001 | 189 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||
|
NXP USA Inc. MCIMX6DP4AVT8AAR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DP | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322521518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 852MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | |||||||||||
| NXP USA Inc. MCIMX6G0DVM05ABR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6UL | Tape & Reel (TR) | Active | 0°C ~ 95°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935346149518 | 5A992C | 8542.31.0001 | 1,000 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3, DDR3L | No | LVDS | 10/100Mbps (1) | - | USB 2.0 + PHY (1) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | EBI/EMI, I²C, I²S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | |||||||||||||
| NXP USA Inc. MCIMX6G1CVM05ABR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6UL | Tape & Reel (TR) | Active | -40°C ~ 105°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935346153518 | 5A992C | 8542.31.0001 | 1,000 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3, DDR3L | No | LVDS | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | ||||||||||||
| NXP USA Inc. MCIMX6L8DVN10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SL | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 432-TFBGA | MCIMX6 | 432-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935352982557 | 5A992C | 8542.31.0001 | 160 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX6Q5EYM12AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tray | Not For New Designs | -20°C ~ 105°C (TJ) | Surface Mount | 624-LFBGA, FCBGA | MCIMX6 | 624-FCPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319908557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 1.2GHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
|
NXP USA Inc. MCIMX6QP6AVT1AAR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6QP | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318871518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | |||||||||||
| NXP USA Inc. MCIMX6S1AVM10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||
| NXP USA Inc. MCIMX6S7CVM08AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935354192557 | OBSOLETE | 0000.00.0000 | 60 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||
| NXP USA Inc. MCIMX6X3EVK10ABR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SX | Tape & Reel (TR) | Active | -20°C ~ 105°C (TJ) | Surface Mount | 400-LFBGA | MCIMX6 | 400-MAPBGA (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315799518 | 5A992C | 8542.31.0001 | 1,000 | ARM® Cortex®-A9, ARM® Cortex®-M4 | 227MHz, 1GHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD, LVDS | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | AC'97, CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | |||||||||||||
| NXP USA Inc. MCIMX6Y0DVM05AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (1) | - | USB 2.0 OTG + PHY (1) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | I²C, SPI, UART | ||||||||||||||
| NXP USA Inc. MCIMX6Y1DVK05AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 272-LFBGA | MCIMX6 | 272-MAPBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 260 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (1) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | CAN, I²C, SPI, UART | |||||||||||||
| NXP USA Inc. MCIMX6Y7DVK05AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 272-LFBGA | MCIMX6 | 272-MAPBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 260 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | CAN, I²C, SPI, UART | |||||||||||||
| NXP USA Inc. MCIMX7S3DVK08SD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX7S | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 488-TFBGA | MCIMX7 | 488-TFBGA (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935351918557 | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7, ARM® Cortex®-M4 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LPDDR3, DDR3, DDR3L | No | Keypad, LCD, MIPI | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | 1.8V, 3.3V | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | AC'97, eCSPI, I²C, I²S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | |||||||||||||
| NXP USA Inc. MCIMX7S5EVM08SD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX7S | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 541-LFBGA | MCIMX7 | 541-MAPBGA (19x19) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 84 | ARM® Cortex®-A7, ARM® Cortex®-M4 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LPDDR3, DDR3, DDR3L | No | Keypad, LCD, MIPI | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | 1.8V, 3.3V | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | AC'97, CAN, eCSPI, I²C, I²S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | ||||||||||||||
|
NXP USA Inc. MCW68332A | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Not For New Designs | MCW68332 | ROHS3 Compliant | REACH Unaffected | 935319459025 | 0000.00.0000 | 13 | |||||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1052CVL5A | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1050 | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1052 | 196-LFBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 240 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 528MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | - | External Program Memory | - | 512K x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | |||||||||||||
| NXP USA Inc. MK02FN64VFM10R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K02 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MK02FN64 | 32-HVQFN (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323608528 | 3A991A2 | 8542.31.0001 | 5,000 | 26 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | I²C, SPI, UART/USART | DMA, LVD, POR, PWM | 64KB (64K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 12x16b; D/A 1x12b | Internal | |||||||||||||
| NXP USA Inc. MK10DN512VLK10R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK10DN512 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,000 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 31x16b; D/A 1x12b | Internal | |||||||||||||
| NXP USA Inc. MK10DX128VLH7R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK10DX128 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324888528 | 3A991A2 | 8542.31.0001 | 1,500 | 44 | ARM® Cortex®-M4 | 32-Bit Single-Core | 72MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 26x16b; D/A 1x12b | Internal | |||||||||||||
| NXP USA Inc. MK22FX512AVLH12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK22FX512 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,500 | 40 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 22x16b; D/A 1x12b | Internal | ||||||||||||||
| NXP USA Inc. MK22FX512VLQ12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK22FX512 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312994528 | 3A991A2 | 8542.31.0001 | 500 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | |||||||||||||
| NXP USA Inc. MK60DN512VMC10R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK60DN512 | 121-MAPBGA (8x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313053518 | 3A991A2 | 8542.31.0001 | 2,000 | 86 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 38x16b; D/A 2x12b | Internal | |||||||||||||
| NXP USA Inc. MK63FN1M0VLQ12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK63FN1M0 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321973528 | 5A002A1 | 8542.31.0001 | 500 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal |
