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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Total RAM Bits | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Flash Size | Primary Attributes | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Microchip Technology M2S060-VF400 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 400-LFBGA | M2S060 | 400-VFBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 207 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | ||||||||||||||||||||||||||
| Microchip Technology M2S090-1FCS325I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 325-TFBGA, FCBGA | M2S090 | 325-FCBGA (11x13.5) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | 180 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 90K Logic Modules | ||||||||||||||||||||||||||
| Microchip Technology M2S090-FCSG325 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 325-TFBGA, FCBGA | M2S090 | 325-FCBGA (11x13.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | 180 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 90K Logic Modules | ||||||||||||||||||||||||||
| Microchip Technology M2S090-FG484I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | M2S090 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 90K Logic Modules | ||||||||||||||||||||||||||
| Microchip Technology M2S090-FG676I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 676-BGA | M2S090 | 676-FBGA (27x27) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 40 | MCU, FPGA | 425 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 90K Logic Modules | ||||||||||||||||||||||||||
| Microchip Technology M2S090-FGG484I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | M2S090 | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 90K Logic Modules | ||||||||||||||||||||||||||
| Microchip Technology M2S090-FGG676I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 676-BGA | M2S090 | 676-FBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 40 | MCU, FPGA | 425 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 90K Logic Modules | ||||||||||||||||||||||||||
| NXP USA Inc. MPC8536AVJAULA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC85xx | Tray | Obsolete | 0°C ~ 90°C (TA) | Surface Mount | 783-BBGA, FCBGA | MPC8536 | 783-FCPBGA (29x29) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 36 | PowerPC e500 | 1.333GHz | 1 Core, 32-Bit | - | DDR2, DDR3 | No | - | 10/100/1000Mbps (2) | SATA 3Gbps (2) | USB 2.0 (3) | 1.8V, 2.5V, 3.3V | - | DUART, I²C, MMC/SD, PCI, SPI | |||||||||||||||||||||
| NXP USA Inc. MPC8536AVJAVLA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC85xx | Tray | Obsolete | 0°C ~ 90°C (TA) | Surface Mount | 783-BBGA, FCBGA | MPC8536 | 783-FCPBGA (29x29) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312967557 | 3A991A2 | 8542.31.0001 | 36 | PowerPC e500 | 1.5GHz | 1 Core, 32-Bit | - | DDR2, DDR3 | No | - | 10/100/1000Mbps (2) | SATA 3Gbps (2) | USB 2.0 (3) | 1.8V, 2.5V, 3.3V | - | DUART, I²C, MMC/SD, PCI, SPI | ||||||||||||||||||||
| NXP USA Inc. MPC8536EAVJAULA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC85xx | Tray | Obsolete | 0°C ~ 90°C (TA) | Surface Mount | 783-BBGA, FCBGA | MPC8536 | 783-FCPBGA (29x29) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323746557 | 5A002A1 FRE | 8542.31.0001 | 36 | PowerPC e500 | 1.333GHz | 1 Core, 32-Bit | Security; SEC | DDR2, DDR3 | No | - | 10/100/1000Mbps (2) | SATA 3Gbps (2) | USB 2.0 (3) | 1.8V, 2.5V, 3.3V | Cryptography | DUART, I²C, MMC/SD, PCI, SPI | ||||||||||||||||||||
| Microchip Technology PIC16F1615-E/ML | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F, Functional Safety (FuSa) | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 16-VQFN Exposed Pad | PIC16F1615 | 16-QFN (4x4) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 91 | 12 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | - | 1K x 8 | 2.3V ~ 5.5V | A/D 8x10b; D/A 1x8b | Internal | |||||||||||||||||||||
| Microchip Technology PIC16F1615-I/ML | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F, Functional Safety (FuSa) | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-VQFN Exposed Pad | PIC16F1615 | 16-QFN (4x4) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 91 | 12 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | - | 1K x 8 | 2.3V ~ 5.5V | A/D 8x10b; D/A 1x8b | Internal | |||||||||||||||||||||
| Microchip Technology PIC16LF1615-E/P | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Through Hole | 14-DIP (0.300", 7.62mm) | PIC16LF1615 | 14-PDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 30 | 12 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | - | 1K x 8 | 1.8V ~ 3.6V | A/D 8x10b; D/A 1x8b | Internal | |||||||||||||||||||||
| Microchip Technology PIC16LF1615-I/ML | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-VQFN Exposed Pad | PIC16LF1615 | 16-QFN (4x4) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 91 | 12 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | - | 1K x 8 | 1.8V ~ 3.6V | A/D 8x10b; D/A 1x8b | Internal | |||||||||||||||||||||
| Microchip Technology PIC32MX130F256B-50I/SP | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 32MX | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | PIC32MX130 | 28-SPDIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991A2 | 8542.31.0001 | 15 | 21 | MIPS32® M4K™ | 32-Bit Single-Core | 50MHz | I²C, IrDA, LINbus, PMP, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 16K x 8 | 2.3V ~ 3.6V | A/D 10x10b | Internal | |||||||||||||||||||||
| Microchip Technology ATSAMD09C13A-SSUT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM D09C | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | ATSAMD09 | 14-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,000 | 12 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, WDT | 8KB (8K x 8) | FLASH | - | 4K x 8 | 1.62V ~ 3.63V | A/D 5x12b | Internal | |||||||||||||||||||||
| Lattice Semiconductor Corporation LFE5U-85F-6BG554C | Lattice Semiconductor Corporation |
Min: 1 Mult: 1 |
/image/Lattice Semiconductor Corporation | ECP5 | Tray | Active | 0°C ~ 85°C (TJ) | Surface Mount | 554-FBGA | LFE5U-85 | Not Verified | 1.045V ~ 1.155V | 554-CABGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 220-2072 | 3A991D | 8542.39.0001 | 60 | 3833856 | 259 | 21000 | 84000 | |||||||||||||||||||||||||||
| Lattice Semiconductor Corporation LFE5U-85F-6BG756C | Lattice Semiconductor Corporation |
Min: 1 Mult: 1 |
/image/Lattice Semiconductor Corporation | ECP5 | Tray | Active | 0°C ~ 85°C (TJ) | Surface Mount | 756-FBGA | LFE5U-85 | Not Verified | 1.045V ~ 1.155V | 756-CABGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 220-2073 | 3A991D | 8542.39.0001 | 40 | 3833856 | 365 | 21000 | 84000 | |||||||||||||||||||||||||||
| Lattice Semiconductor Corporation LFE5UM-85F-8BG554C | Lattice Semiconductor Corporation |
Min: 1 Mult: 1 |
/image/Lattice Semiconductor Corporation | ECP5 | Tray | Active | 0°C ~ 85°C (TJ) | Surface Mount | 554-FBGA | LFE5UM-85 | Not Verified | 1.045V ~ 1.155V | 554-CABGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 220-2087 | 3A991D | 8542.39.0001 | 60 | 3833856 | 259 | 21000 | 84000 | |||||||||||||||||||||||||||
 |
XMOS XU224-1024-FB324-I40 | XMOS |
Min: 1 Mult: 1 |
/image/XMOS | XU | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 324-FBGA | XU224 | 324-FBGA (15x15) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 168 | 208 | XCore | 32-Bit 24-Core | 4000MIPS | USB | - | - | ROMless | - | 1M x 8 | 0.95V ~ 3.6V | - | External | ||||||||||||||||||||
|
XMOS XU224-512-FB324-C40 | XMOS |
Min: 1 Mult: 1 |
/image/XMOS | XU | Tray | Active | 0°C ~ 70°C (TA) | Surface Mount | 324-FBGA | XU224 | 324-FBGA (15x15) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 168 | 208 | XCore | 32-Bit 24-Core | 4000MIPS | USB | - | - | ROMless | - | 512K x 8 | 0.95V ~ 3.6V | - | External | ||||||||||||||||||||
|
XMOS XU232-512-FB324-I40 | XMOS |
Min: 1 Mult: 1 |
/image/XMOS | XU | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 324-FBGA | XU232 | 324-FBGA (15x15) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 168 | 208 | XCore | 32-Bit 32-Core | 4000MIPS | USB | - | - | ROMless | - | 512K x 8 | 0.95V ~ 3.6V | - | External | ||||||||||||||||||||
|
XMOS XUF224-1024-FB324-C40 | XMOS |
Min: 1 Mult: 1 |
/image/XMOS | XUF | Tray | Active | 0°C ~ 70°C (TA) | Surface Mount | 324-FBGA | XUF224 | 324-FBGA (15x15) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 168 | 208 | XCore | 32-Bit 24-Core | 4000MIPS | USB | - | 2MB (2M x 8) | FLASH | - | 1M x 8 | 0.95V ~ 3.6V | - | External | ||||||||||||||||||||
|
XMOS XUF224-1024-FB324-I40 | XMOS |
Min: 1 Mult: 1 |
/image/XMOS | XUF | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 324-FBGA | XUF224 | 324-FBGA (15x15) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 168 | 208 | XCore | 32-Bit 24-Core | 4000MIPS | USB | - | 2MB (2M x 8) | FLASH | - | 1M x 8 | 0.95V ~ 3.6V | - | External | ||||||||||||||||||||
|
XMOS XUF232-512-FB324-I40 | XMOS |
Min: 1 Mult: 1 |
/image/XMOS | XUF | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 324-FBGA | XUF232 | 324-FBGA (15x15) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 168 | 208 | XCore | 32-Bit 32-Core | 4000MIPS | USB | - | 2MB (2M x 8) | FLASH | - | 512K x 8 | 0.95V ~ 3.6V | - | External | ||||||||||||||||||||
| Microchip Technology PIC32MX130F256BT-50I/ML | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 32MX | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-VQFN Exposed Pad | PIC32MX130 | 28-QFN (6x6) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,600 | 21 | MIPS32® M4K™ | 32-Bit Single-Core | 50MHz | I²C, IrDA, LINbus, PMP, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 16K x 8 | 2.3V ~ 3.6V | A/D 10x10b | Internal | |||||||||||||||||||||
| Microchip Technology PIC32MX230F256BT-50I/ML | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 32MX | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-VQFN Exposed Pad | PIC32MX230 | 28-QFN (6x6) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,600 | 19 | MIPS32® M4K™ | 32-Bit Single-Core | 50MHz | I²C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 16K x 8 | 2.3V ~ 3.6V | A/D 9x10b | Internal | |||||||||||||||||||||
| Lattice Semiconductor Corporation LFE5U-85F-6BG554I | Lattice Semiconductor Corporation |
Min: 1 Mult: 1 |
/image/Lattice Semiconductor Corporation | ECP5 | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 554-FBGA | LFE5U-85 | Not Verified | 1.045V ~ 1.155V | 554-CABGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | 3833856 | 259 | 21000 | 84000 | ||||||||||||||||||||||||||||
| Lattice Semiconductor Corporation LFE5U-85F-8BG756C | Lattice Semiconductor Corporation |
Min: 1 Mult: 1 |
/image/Lattice Semiconductor Corporation | ECP5 | Tray | Active | 0°C ~ 85°C (TJ) | Surface Mount | 756-FBGA | LFE5U-85 | Not Verified | 1.045V ~ 1.155V | 756-CABGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 40 | 3833856 | 365 | 21000 | 84000 | ||||||||||||||||||||||||||||
| Lattice Semiconductor Corporation LFE5UM-85F-6BG381I | Lattice Semiconductor Corporation |
Min: 1 Mult: 1 |
/image/Lattice Semiconductor Corporation | ECP5 | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 381-FBGA | LFE5UM-85 | Not Verified | 1.045V ~ 1.155V | 381-CABGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | 3833856 | 205 | 21000 | 84000 |
