Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Mounting Type | Package / Case | Base Product Number | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | ECCN | HTSUS | Standard Package | Architecture | Total RAM Bits | Number of I/O | Number of Gates | Number of LABs/CLBs | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Flash Size | Primary Attributes | Programmable Type | Number of Macrocells | Module/Board Type | Co-Processor | Connector Type | Delay Time tpd(1) Max | Voltage Supply - Internal | Number of Logic Elements/Blocks |
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Trenz Electronic GmbH 0741-03-160-2CF | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0741 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0741 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 160T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | |||||||||||||||||||||||||||
Trenz Electronic GmbH 0741-03-160-2C1 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0741 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0741 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 160T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | |||||||||||||||||||||||||||
Trenz Electronic GmbH 0741-03-410-2CF | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0741 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0741 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 410T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | |||||||||||||||||||||||||||
NXP USA Inc. LPC54606J256ET180E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC546xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 180-TFBGA | LPC54606 | 180-TFBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 189 | 145 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 16K x 8 | 136K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | |||||||||||||||||||
NXP USA Inc. LPC54607J512ET180E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC546xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 180-TFBGA | LPC54607 | 180-TFBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 189 | 145 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 200K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | |||||||||||||||||||
NXP USA Inc. LPC54608J512ET180E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC546xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 180-TFBGA | LPC54608 | 180-TFBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 189 | 145 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 200K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | |||||||||||||||||||
Silicon Labs C8051F388-B-GQR | Silicon Labs |
Min: 1 Mult: 1 |
/image/Silicon Labs | C8051F38x | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-TQFP | C8051F388 | 48-TQFP (7x7) | download | RoHS Compliant | 3 (168 Hours) | EAR99 | 8542.31.0001 | 500 | 40 | 8051 | 8-Bit | 48 MIPS | EBI/EMI, I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT | 64KB (64K x 8) | FLASH | - | 4.25K x 8 | 2.7V ~ 5.25V | A/D 32x10b | Internal | ||||||||||||||||||||
Silicon Labs C8051F389-B-GQR | Silicon Labs |
Min: 1 Mult: 1 |
/image/Silicon Labs | C8051F38x | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | C8051F389 | 32-LQFP (7x7) | download | RoHS Compliant | 3 (168 Hours) | EAR99 | 8542.31.0001 | 500 | 25 | 8051 | 8-Bit | 48 MIPS | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT | 64KB (64K x 8) | FLASH | - | 4.25K x 8 | 2.7V ~ 5.25V | A/D 21x10b | Internal | ||||||||||||||||||||
Silicon Labs C8051F38B-B-GMR | Silicon Labs |
Min: 1 Mult: 1 |
/image/Silicon Labs | C8051F38x | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | C8051F38 | 32-QFN (5x5) | download | RoHS Compliant | 2 (1 Year) | EAR99 | 8542.31.0001 | 1,500 | 25 | 8051 | 8-Bit | 48 MIPS | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT | 32KB (32K x 8) | FLASH | - | 2.25K x 8 | 2.7V ~ 5.25V | A/D 21x10b | Internal | ||||||||||||||||||||
Silicon Labs C8051F38A-B-GQ | Silicon Labs |
Min: 1 Mult: 1 |
/image/Silicon Labs | C8051F38x | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-TQFP | C8051F38 | 48-TQFP (7x7) | download | RoHS Compliant | 3 (168 Hours) | EAR99 | 8542.31.0001 | 250 | 40 | 8051 | 8-Bit | 48 MIPS | EBI/EMI, I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT | 32KB (32K x 8) | FLASH | - | 2.25K x 8 | 2.7V ~ 5.25V | A/D 32x10b | Internal | ||||||||||||||||||||
Trenz Electronic GmbH 0600-03B | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0600 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0600 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-100 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | |||||||||||||||||||||||||||
Trenz Electronic GmbH 0600-03IMVF | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0600 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0600 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-150 | 125MHz | 1GB | 16MB | FPGA Core | - | Samtec LSHM | |||||||||||||||||||||||||||
AMD XCKU5P-3FFVB676E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Kintex® UltraScale+™ | Tray | Active | 0°C ~ 100°C (TJ) | Surface Mount | 676-BBGA, FCBGA | XCKU5 | Not Verified | 0.825V ~ 0.876V | 676-FCBGA (27x27) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 3A001A7B | 8542.39.0001 | 1 | 41984000 | 280 | 27120 | 474600 | ||||||||||||||||||||||||||
AMD XCR3256XL-10TQ144C | AMD |
Min: 1 Mult: 1 |
/image/AMD | CoolRunner XPLA3 | Tray | Active | 0°C ~ 70°C (TA) | Surface Mount | 144-LQFP | XCR3256 | Not Verified | 144-TQFP (20x20) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 60 | 120 | 6000 | In System Programmable (min 1K program/erase cycles) | 256 | 9.1 ns | 3V ~ 3.6V | 16 | ||||||||||||||||||||||||
AMD XCZU2EG-2SFVC784I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | XCZU2 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 252 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||
AMD XCZU2EG-3SBVA484E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Obsolete | 0°C ~ 100°C (TJ) | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | download | 4 (72 Hours) | REACH Unaffected | OBSOLETE | 8542.39.0001 | 1 | MCU, FPGA | 82 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 600MHz, 667MHz, 1.5GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||
AMD XCZU2EG-3SFVA625E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Obsolete | 0°C ~ 100°C (TJ) | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | download | 4 (72 Hours) | REACH Unaffected | OBSOLETE | 8542.39.0001 | 1 | MCU, FPGA | 180 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 600MHz, 667MHz, 1.5GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||
AMD XCZU2EG-L1SBVA484I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 484-BFBGA, FCBGA | XCZU2 | 484-FCBGA (19x19) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 82 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||
AMD XCZU2EG-L1SFVA625I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 625-BFBGA, FCBGA | XCZU2 | 625-FCBGA (21x21) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 180 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||
AMD XCZU2EG-L1SFVC784I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | XCZU2 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 252 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||
AMD XCZU2EG-L2SFVC784E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 252 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||||||
AMD XCZU9EG-L1FFVB1156I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Bulk | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU9 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 328 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||
AMD XCZU9EG-L1FFVC900I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU9 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 204 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||
AMD XCZU9EG-L2FFVB1156E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Bulk | Active | 0°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU9 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 328 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||
AMD XCZU3CG-1SFVC784E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | 0°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | XCZU3 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 252 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ||||||||||||||||||||||||
AMD XCZU3CG-1SFVC784I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC CG | Bulk | Active | -40°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | XCZU3 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 252 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ||||||||||||||||||||||||
AMD XCZU3CG-2SFVC784I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC CG | Bulk | Active | -40°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | XCZU3 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 252 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ||||||||||||||||||||||||
AMD XCZU6CG-2FFVB1156I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC CG | Bulk | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU6 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 328 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ||||||||||||||||||||||||
Renesas Electronics America Inc R5F100MGGFA#V0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RL78/G13 | Tray | Discontinued at Digi-Key | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | R5F100 | 80-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 64 | RL78 | 16-Bit | 32MHz | CSI, I²C, LINbus, UART/USART | DMA, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 8K x 8 | 12K x 8 | 1.6V ~ 5.5V | A/D 17x8/10b | Internal | |||||||||||||||||||
Texas Instruments TMS320F28333PGFA | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | C2000™ C28x Delfino™ | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 176-LQFP | TMS320 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 40 | 88 | C28x | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, McBSP, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 512KB (256K x 16) | FLASH | - | 34K x 16 | 1.71V ~ 1.89V | A/D 16x12b | Internal |
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