Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Mounting Type | Package / Case | Base Product Number | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Total RAM Bits | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Flash Size | Primary Attributes | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Module/Board Type | Co-Processor | Connector Type |
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Texas Instruments AM5716AABCXA | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | Sitara™ | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 760-BFBGA, FCBGA | AM5716 | 760-FCBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A15 | 1.5GHz | 1 Core, 32-Bit | Multimedia; GPU, IPU, VFP | DDR3, SRAM | No | - | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 (1), USB 3.0 (1) | 1.8V, 3.3V | - | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | |||||||||||||||||||||||||
Texas Instruments AM5718AABCX | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | Sitara™ | Tray | Active | 0°C ~ 90°C (TJ) | Surface Mount | 760-BFBGA, FCBGA | AM5718 | 760-FCBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A15 | 1.5GHz | 1 Core, 32-Bit | Multimedia; GPU, IPU, VFP | DDR3, SRAM | Yes | HDMI | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 (1), USB 3.0 (1) | 1.8V, 3.3V | - | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | |||||||||||||||||||||||||
Texas Instruments AM5718AABCXEA | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | Sitara™ | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 760-BFBGA, FCBGA | AM5718 | 760-FCBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A15 | 1.5GHz | 1 Core, 32-Bit | Multimedia; GPU, IPU, VFP | DDR3, SRAM | Yes | HDMI | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 (1), USB 3.0 (1) | 1.8V, 3.3V | - | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | |||||||||||||||||||||||||
NXP USA Inc. S912ZVMC64F1WKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323664557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||||||||||||||||||||
NXP USA Inc. S912ZVML12F1VKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312588528 | OBSOLETE | 0000.00.0000 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | LINbus, SCI, SPI | DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||||||||||||||||||||
NXP USA Inc. S912ZVML12F2MKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316305557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | LINbus, SCI, SPI | DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||||||||||||||||||||
NXP USA Inc. S912ZVML12F2MKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316305528 | OBSOLETE | 0000.00.0000 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | LINbus, SCI, SPI | DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||||||||||||||||||||
NXP USA Inc. S912ZVML12F2WKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320718528 | OBSOLETE | 0000.00.0000 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | LINbus, SCI, SPI | DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||||||||||||||||||||
NXP USA Inc. S912ZVML32F1MKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323865528 | OBSOLETE | 0000.00.0000 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||||||||||||||||||||
NXP USA Inc. S912ZVML32F1WKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312636557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||||||||||||||||||||
NXP USA Inc. S912ZVML64F1MKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312248557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||||||||||||||||||||
NXP USA Inc. S912ZVML64F2MKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318489528 | OBSOLETE | 0000.00.0000 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||||||||||||||||||||
NXP USA Inc. S912ZVML64F2WKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320695528 | OBSOLETE | 0000.00.0000 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||||||||||||||||||||
NXP USA Inc. MC8640DHJ1250HE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Tray | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 1023-BCBGA, FCBGA | MC8640DHJ1250 | 1023-FCCBGA (33x33) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 24 | PowerPC e600 | 1.25GHz | 2 Core, 32-Bit | - | DDR, DDR2 | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | - | DUART, HSSI, I²C, RapidIO | ||||||||||||||||||||||||||
NXP USA Inc. MC8640DTHJ1067NE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 1023-BCBGA, FCBGA | MC8640DTHJ1067 | 1023-FCCBGA (33x33) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A1 | 8542.31.0001 | 24 | PowerPC e600 | 1.067GHz | 2 Core, 32-Bit | - | DDR, DDR2 | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | - | DUART, HSSI, I²C, RapidIO | |||||||||||||||||||||||||
NXP USA Inc. MC8640DTHJ1250HE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 1023-BCBGA, FCBGA | MC8640DTHJ1250 | 1023-FCCBGA (33x33) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935343657557 | OBSOLETE | 0000.00.0000 | 24 | PowerPC e600 | 1.25GHz | 2 Core, 32-Bit | - | DDR, DDR2 | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | - | DUART, HSSI, I²C, RapidIO | |||||||||||||||||||||||||
NXP USA Inc. MC8640THJ1250HE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 994-BCBGA, FCCBGA | MC8640THJ1250 | 994-FCCBGA (33x33) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935343662557 | OBSOLETE | 0000.00.0000 | 24 | PowerPC e600 | 1.25GHz | 1 Core, 32-Bit | - | DDR, DDR2 | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | - | DUART, HSSI, I²C, RapidIO | |||||||||||||||||||||||||
Nuvoton Technology Corporation W83667HG-A TR | Nuvoton Technology Corporation |
Min: 1 Mult: 1 |
/image/Nuvoton Technology Corporation | * | Tape & Reel (TR) | Obsolete | W83667 | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | ||||||||||||||||||||||||||||||||||||||||||||
Nuvoton Technology Corporation W83667HG-AC | Nuvoton Technology Corporation |
Min: 1 Mult: 1 |
/image/Nuvoton Technology Corporation | * | Bulk | Obsolete | W83667 | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | ||||||||||||||||||||||||||||||||||||||||||||
Trenz Electronic GmbH 0722-02 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0722 | Bulk | Active | 0°C ~ 70°C | 0.710" L x 2.010" W (18.00mm x 51.00mm) | TE0722 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 1686-1077 | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 33MHz | - | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | 40 Pin | ||||||||||||||||||||||||||||||||
AMD XCZU9CG-1FFVB1156I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU9 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 328 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||||||||
AMD XCZU9CG-1FFVC900I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU9 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 204 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||||||||
AMD XCZU9EG-2FFVB1156E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU9 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 328 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||||||||
AMD XCVU3P-1FFVC1517E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Virtex® UltraScale+™ | Tray | Active | 0°C ~ 100°C (TJ) | Surface Mount | 1517-BBGA, FCBGA | XCVU3 | Not Verified | 0.825V ~ 0.876V | 1517-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 3A001A7B | 8542.39.0001 | 1 | 130355200 | 520 | 49260 | 862050 | ||||||||||||||||||||||||||||||||
AMD XCZU9EG-1FFVB1156E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU9 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 328 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||||||||||||||||||||||||||||||
AMD XCZU9CG-2FFVC900I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU9 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 122-2032 | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 204 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | |||||||||||||||||||||||||||||
AMD XCZU2CG-1SFVA625E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | 0°C ~ 100°C (TJ) | 625-BFBGA, FCBGA | XCZU2 | 625-FCBGA (21x21) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 180 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||
AMD XCZU2CG-1SFVA625I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | -40°C ~ 100°C (TJ) | 625-BFBGA, FCBGA | XCZU2 | 625-FCBGA (21x21) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 180 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||
AMD XCZU2CG-2SBVA484I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | -40°C ~ 100°C (TJ) | 484-BFBGA, FCBGA | XCZU2 | 484-FCBGA (19x19) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 82 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||||||||||||||||||||||||||||
AMD XCZU2CG-2SFVC784I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | -40°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | XCZU2 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 252 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
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