Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Flash Size | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Module/Board Type | Co-Processor | Connector Type |
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Renesas Electronics America Inc R5F109GCCJFB#50 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RL78/F12 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | R5F109 | 48-LFQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R5F109GCCJFB#50TR | 3A991A2 | 8542.31.0001 | 1,000 | 34 | RL78 | 16-Bit | 32MHz | CSI, I²C, LINbus, UART/USART | DMA, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 4K x 8 | 2K x 8 | 1.6V ~ 5.5V | A/D 10x8/10b | Internal | |||||||||||||||||
Renesas Electronics America Inc R5F10ALGKFB#X5 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | - | Tape & Reel (TR) | Obsolete | R5F10 | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R5F10ALGKFB#X5TR | 3A991A2 | 8542.31.0001 | 1,000 | ||||||||||||||||||||||||||||||||||
Renesas Electronics America Inc R5F10BGGLFB#X5 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | - | Tape & Reel (TR) | Obsolete | R5F10 | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R5F10BGGLFB#X5TR | 3A991A2 | 8542.31.0001 | 1,000 | ||||||||||||||||||||||||||||||||||
Trenz Electronic GmbH 0715-04-15-1IC | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0715 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0715-04-15-1IC | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7015) | Samtec LSHM | |||||||||||||||||||||||||||||
Texas Instruments LM3S6915-IBZ50-A2 | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | Stellaris® ARM® Cortex®-M3S 6000 | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 108-LFBGA | LM3S6915 | 108-BGA (10x10) | ROHS3 Compliant | 3 (168 Hours) | 296-LM3S6915-IBZ50-A2 | 3A991A2 | 8542.31.0001 | 1,000 | ARM® Cortex®-M3 | 32-Bit Single-Core | 50MHz | |||||||||||||||||||||||||||||
Trenz Electronic GmbH 0726-03-41C74-R | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0726 | Bulk | Active | 0°C ~ 70°C | 1.180" L x 1.570" W (30.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0726-03-41C74-R | 3A991A2 | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 128MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | CSI, DSI | |||||||||||||||||||||||||||
Trenz Electronic GmbH 0600-03-52I11-M | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0600-03-52I11-M | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-45 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | |||||||||||||||||||||||||||
Trenz Electronic GmbH 0600-03-72C21-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0600-03-72C21-A | 1 | Spartan-6 LX-100 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | |||||||||||||||||||||||||||||
Trenz Electronic GmbH 0600-03IC4 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0600-03IC4 | OBSOLETE | 1 | Spartan-6 LX-45 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | |||||||||||||||||||||||||||||
NXP USA Inc. MIMX8ML3DVNLZAB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8ML | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 486-LFBGA | 486-LFBGA (14x14) | ROHS3 Compliant | REACH Unaffected | 5A992C | 8542.31.0001 | 126 | ARM® Cortex®-A53 | 1.8GHz | 2 Core, 64-Bit | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP | DDR4, LPDDR4 | Yes | HTML, LVDS, MIPI-CSI, MIPI-DSI | GbE (2) | - | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | - | ARM TZ, CAAM, RDC | CAN, I²C, I²S, PCIe, SD/SDIO, SPI, UART | |||||||||||||||||||||
NXP USA Inc. LPC5502JHI48QL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC550x | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | LPC5502 | 48-HVQFN (7x7) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 260 | 30 | ARM® Cortex®-M33 | 32-Bit Single-Core | 96MHz | CANBus, Flexcomm, I²C, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT | 64KB (64K x 8) | FLASH | - | 48K x 8 | 1.8V ~ 3.6V | A/D 7x16b SAR | Internal | ||||||||||||||||||||
NXP USA Inc. MIMX8ML8CVNKZAB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8ML | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 548-LFBGA | 548-LFBGA (15x15) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 126 | ARM® Cortex®-A53 | 1.6GHz | 4 Core, 64-Bit | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP | DDR4, LPDDR4 | Yes | MIPI-CSI, MIPI-DSI | GbE (2) | - | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | - | ARM TZ, CAAM, RDC | CAN, I²C, PCIe, SDHC, SPI, UART | ||||||||||||||||||||
NXP USA Inc. MIMX8ML8DVNLZAB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8ML | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 486-LFBGA | 486-LFBGA (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 126 | ARM® Cortex®-A53 | 1.8GHz | 4 Core, 64-Bit | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP | DDR4, LPDDR4 | Yes | MIPI-CSI, MIPI-DSI | GbE (2) | - | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | - | ARM TZ, CAAM, RDC | CAN, I²C, PCIe, SDHC, SPI, UART | ||||||||||||||||||||
NXP USA Inc. MIMX8ML4DVNLZAB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8ML | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 548-LFBGA | 548-LFBGA (15x15) | ROHS3 Compliant | REACH Unaffected | 5A992C | 8542.31.0001 | 126 | ARM® Cortex®-A53 | 1.8GHz | 4 Core, 64-Bit | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP | DDR4, LPDDR4 | Yes | HTML, LVDS, MIPI-CSI, MIPI-DSI | GbE (2) | - | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | - | ARM TZ, CAAM, RDC | CAN, I²C, I²S, PCIe, SD/SDIO, SPI, UART | |||||||||||||||||||||
NXP USA Inc. MIMX8ML4CVNKZAB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8ML | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 548-LFBGA | 548-LFBGA (15x15) | ROHS3 Compliant | REACH Unaffected | 5A992C | 8542.31.0001 | 126 | ARM® Cortex®-A53 | 1.8GHz | 4 Core, 64-Bit | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP | DDR4, LPDDR4 | Yes | HTML, LVDS, MIPI-CSI, MIPI-DSI | GbE (2) | - | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | - | ARM TZ, CAAM, RDC | CAN, I²C, I²S, PCIe, SD/SDIO, SPI, UART | |||||||||||||||||||||
NXP USA Inc. LPC5506JHI48QL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | LPC5506 | 48-HVQFN (7x7) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 30 | ARM® Cortex®-M33 | 32-Bit Single-Core | 96MHz | CANBus, Flexcomm, I²C, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT | 256KB (256K x 8) | FLASH | - | 96K x 8 | 1.8V ~ 3.6V | A/D 7x16b SAR | Internal | ||||||||||||||||||
Trenz Electronic GmbH 0720-03-62I33FL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-62I33FL | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||||||||||||||||||||||||
Trenz Electronic GmbH 0720-03-1QC11 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-1QC11 | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||||||||||||||||||||||||||
Trenz Electronic GmbH 0720-03-1QC12 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-1QC12 | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||||||||||||||||||||||||||
Trenz Electronic GmbH 0720-03-1QFL | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-1QFL | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | ||||||||||||||||||||||||||||
Trenz Electronic GmbH 0720-03-61Q33FAF | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-61Q33FAF | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||||||||||||||||||||||||||
Trenz Electronic GmbH 0720-03-61Q43FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-61Q43FA | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||||||||||||||||||||||||||
Trenz Electronic GmbH 0720-03-62I33GA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-62I33GA | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||||||||||||||||||||||||||
Trenz Electronic GmbH 0720-03-61C530A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at Digi-Key | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-61C530A | 1 | ARM Cortex-A9 | 125MHz | 256MB | - | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||||||||||||||||||||||||||
Trenz Electronic GmbH 0720-03-62I330M | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at Digi-Key | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-62I330M | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||||||||||||||||||||||||||||
Trenz Electronic GmbH 0720-03-2IFC1 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-2IFC1 | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||||||||||||||||||||||||||
Renesas Electronics America Inc R7F100GLG2DFB#AA0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | R7F100G | 64-LFQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 54 | RL78 | 8/16-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 8K x 8 | 16K x 8 | 1.6V ~ 5.5V | A/D 12x12b; D/A 2x8b | Internal | ||||||||||||||||||
Texas Instruments F28386SPTPS | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | C2000™ C28x Fixed-Point | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 176-LQFP Exposed Pad | F28386 | 176-HLQFP (24x24) | download | Not applicable | 3 (168 Hours) | 296-F28386SPTPS | 5A992C | 8542.31.0001 | 40 | 97 | C28x | 32-Bit Dual-Core | 200MHz | CANbus, Ethernet, I²C, McBSP, SCI, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 512KB (256K x 16) | FLASH | - | 172K x 8 | 1.14V ~ 1.26V | A/D 20x12b, 29x16b SAR; D/A 3x12b | Internal | ||||||||||||||||||
Texas Instruments F28384DPTPQR | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | Automotive, AEC-Q100, C2000™ C28x Fixed-Point | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | F28384 | 176-HLQFP (24x24) | download | Not applicable | 3 (168 Hours) | 296-F28384DPTPQRTR | EAR99 | 8542.31.0001 | 200 | 97 | C28x | 32-Bit Dual-Core | 200MHz | CANbus, Ethernet, I²C, McBSP, SCI, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 1MB (512K x 16) | FLASH | - | 216K x 8 | 1.14V ~ 1.26V | A/D 20x12b, 29x16b SAR; D/A 3x12b | Internal | ||||||||||||||||||
Microchip Technology PIC16F15275-E/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 16F | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 44-TQFP | PIC16F15275 | 44-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-PIC16F15275-E/PT | 3A991A2 | 8542.31.0001 | 160 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (14K x 8) | FLASH | - | 1K x 8 | 1.8V ~ 5.5V | A/D 28/2x10b | Internal |
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