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Switches
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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Mounting Type | Package / Case | Base Product Number | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Total RAM Bits | Number of I/O | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Flash Size | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Microchip Technology M2GL060TS-VFG784 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | IGLOO2 | Tray | Active | 0°C ~ 85°C (TJ) | Surface Mount | 784-FBGA | 1.14V ~ 1.26V | 784-VFBGA (23x23) | ROHS3 Compliant | 3 (168 Hours) | 150-M2GL060TS-VFG784 | 60 | 1869824 | 395 | 56520 | |||||||||||||||||||||||||||||||||
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Renesas R7FS124763A01CFL#AA1 | Renesas |
Min: 1 Mult: 1 |
/image/Renesas | Synergy MCU | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | 48-LFQFP (7x7) | 2156-R7FS124763A01CFL#AA1 | 1 | 35 | ARM® Cortex®-M0+ | 32-Bit | 32MHz | CANbus, I²C, SCI, SPI, UART/USART, USB | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.6V ~ 5.5V | A/D 14x12b SAR; D/A 1x12b | Internal | ||||||||||||||||||||||||||
|
Renesas R5F565NEDDLC#20 | Renesas |
Min: 1 Mult: 1 |
/image/Renesas | RX65N | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 177-TFLGA | 177-TFLGA (8x8) | 2156-R5F565NEDDLC#20 | 1 | 136 | RXv2 | 32-Bit | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB | DMA, LVD, POR, PWM, WDT | 2MB (2M x 8) | FLASH | 32K x 8 | 640K x 8 | 2.7V ~ 3.6V | A/D 29x12b; D/A 2x12b | External | ||||||||||||||||||||||||||
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Analog Devices Inc. SPC5644BK0MLU8 | Analog Devices Inc. |
Min: 1 Mult: 1 |
/image/Analog Devices Inc. | - | Bulk | Active | 2156-SPC5644BK0MLU8 | 1 | |||||||||||||||||||||||||||||||||||||||||||
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NXP Semiconductors SPC5646CCF0VLU1R | NXP Semiconductors |
Min: 1 Mult: 1 |
/image/NXP Semiconductors | MPC56xx Qorivva | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP | 176-LQFP (24x24) | 2156-SPC5646CCF0VLU1R | 1 | 147 | e200z4d, e200z0h | 32-Bit Dual-Core | 80MHz, 120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 3MB (3M x 8) | FLASH | 4K x 16 | 256K x 8 | 3V ~ 5.5V | A/D 46x10b, 24x12b | Internal | ||||||||||||||||||||||||||
|
Ampleon USA Inc. TP8044AH | Ampleon USA Inc. |
Min: 1 Mult: 1 |
/image/Ampleon USA Inc. | - | Bulk | Active | 2156-TP8044AH | 1 | |||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors LS1028ACE7NQA | NXP Semiconductors |
Min: 1 Mult: 1 |
/image/NXP Semiconductors | QorIQ® Layerscape | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 448-BFBGA | 448-FBGA (17x17) | 2156-LS1028ACE7NQA | 4 | ARM® Cortex®-A72 | 1.3GHz | 2 Core, 64-Bit | - | DDR3L, DDR4 | Yes | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | USB 3.0 (2) | - | Secure Boot, TrustZone® | CANbus, I²C, SPI, UART | ||||||||||||||||||||||||||
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NXP Semiconductors MCIMX6X3EVK10AB | NXP Semiconductors |
Min: 1 Mult: 1 |
/image/NXP Semiconductors | i.MX6SX | Bulk | Active | -20°C ~ 105°C (TJ) | Surface Mount | 400-LFBGA | 400-MAPBGA (14x14) | 2156-MCIMX6X3EVK10AB | 11 | ARM® Cortex®-A9, ARM® Cortex®-M4 | 2 Core, 32-Bit | Multimedia; NEON™ MPE | DDR3, DDR3L, LPDDR2 | Yes | Keypad, LCD | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | CANbus, I²C, I²S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | |||||||||||||||||||||||||||
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Analog Devices Inc. S9S12VR48AF0MLC | Analog Devices Inc. |
Min: 1 Mult: 1 |
/image/Analog Devices Inc. | - | Bulk | Active | 2156-S9S12VR48AF0MLC | 1 | |||||||||||||||||||||||||||||||||||||||||||
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Allegro MicroSystems S912XD64F2VAAR | Allegro MicroSystems |
Min: 1 Mult: 1 |
/image/Allegro MicroSystems | - | Bulk | Active | 2156-S912XD64F2VAAR | 1 | |||||||||||||||||||||||||||||||||||||||||||
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Renesas Electronics America Inc R7FS5D97E3A01CFC#BA1 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | * | Tray | Active | 559-R7FS5D97E3A01CFC#BA1 | 1 | |||||||||||||||||||||||||||||||||||||||||||
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Renesas Electronics America Inc R7FA6M3AH3CFC#BA1 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | * | Tray | Active | 559-R7FA6M3AH3CFC#BA1 | 1 | |||||||||||||||||||||||||||||||||||||||||||
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Geehy Semiconductor USA APM32F107VCT6 | Geehy Semiconductor USA |
Min: 1 Mult: 1 |
/image/Geehy Semiconductor USA | * | Tray | Active | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 4659-APM32F107VCT6 | EAR99 | 8542.31.0001 | 90 | ||||||||||||||||||||||||||||||||||||||
|
Geehy Semiconductor USA APM32F103RBT6 | Geehy Semiconductor USA |
Min: 1 Mult: 1 |
/image/Geehy Semiconductor USA | * | Tray | Active | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 4659-APM32F103RBT6 | EAR99 | 8542.31.0001 | 160 | ||||||||||||||||||||||||||||||||||||||
|
Geehy Semiconductor USA APM32F107RCT6 | Geehy Semiconductor USA |
Min: 1 Mult: 1 |
/image/Geehy Semiconductor USA | * | Tray | Active | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 4659-APM32F107RCT6 | EAR99 | 8542.31.0001 | 160 | ||||||||||||||||||||||||||||||||||||||
|
Microchip Technology DSPIC33FJ06GS101T-E/SOD21 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100 | Bulk | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | DSPIC33FJ06GS101 | 18-SOIC | download | 150-DSPIC33FJ06GS101T-E/SOD21 | OBSOLETE | 1 | 13 | dsPIC | 16-Bit | 40 MIPs | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 6KB (2K x 24) | FLASH | - | 256 x 8 | 3V ~ 3.6V | A/D 6x10b SAR | External, Internal | |||||||||||||||||||||||
|
Infineon Technologies CY95F108AHSPMC1-G-UJE1 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | CY95F108 | 64-LQFP (10x10) | ROHS3 Compliant | REACH Unaffected | 1,600 | 54 | F²MC-8FX | 8-Bit | 16.25MHz | I²C, LINbus, SIO, UART/USART | POR, PWM, WDT | 60KB (60K x 8) | FLASH | - | 2K x 8 | 2.42V ~ 5.5V | A/D 12x8/10b | External | ||||||||||||||||||||||||
| Renesas Electronics America Inc R5F56609HDFB#10 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RX600 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | R5F56609 | 144-LFQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 480 | 130 | RXv3 | 32-Bit | 120MHz | CANbus, EBI/EMI, I²C, LINbus, SCI, SPI | DMA, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 32K x 8 | 128K x 8 | 2.7V ~ 5.5V | A/D 24x12b; D/A 2x12b | External, Internal | |||||||||||||||||||||||
| Renesas Electronics America Inc R5F56609BDFP#30 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RX600 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | R5F56609 | 100-LFQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 800-R5F56609BDFP#30 | 90 | 91 | RXv3 | 32-Bit | 120MHz | CANbus, EBI/EMI, I²C, LINbus, SCI, SPI | DMA, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 32K x 8 | 128K x 8 | 2.7V ~ 5.5V | A/D 24x12b; D/A 2x12b | External, Internal | ||||||||||||||||||||||
|
NXP USA Inc. LPC1820FBD144K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC18xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | LPC1820 | 144-LQFP (20x20) | download | REACH Unaffected | 568-LPC1820FBD144K | 1 | 83 | ARM® Cortex®-M3 | 32-Bit | 180MHz | CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | - | ROMless | - | 168K x 8 | 2.2V ~ 3.6V | A/D 8x10b SAR; D/A 1x10b | Internal | |||||||||||||||||||||||
|
NXP USA Inc. LPC11U36FBD64/40EL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11Uxx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | LPC11 | 64-LQFP (10x10) | download | REACH Unaffected | 568-LPC11U36FBD64/40EL | 1 | 54 | ARM® Cortex®-M0 | 32-Bit Dual-Core | 50MHz | I²C, Microwire, SmartCard, SPI, SSP, UART/USART, USB | Brown-out Detect/Reset, POR, WDT | 96KB (96K x 8) | FLASH | 4K x 8 | 10K x 8 | 1.8V ~ 3.6V | A/D 8x10b SAR | External, Internal | |||||||||||||||||||||||
|
NXP USA Inc. LPC11E68JBD64K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11Exx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | LPC11 | 64-LQFP (10x10) | download | REACH Unaffected | 568-LPC11E68JBD64K | 1 | 50 | ARM® Cortex®-M0+ | 32-Bit | 50MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 36K x 8 | 2.4V ~ 3.6V | A/D 10x12b SAR | Internal | |||||||||||||||||||||||
|
NXP USA Inc. LPC1111FHN33/103 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VQFN Exposed Pad | LPC1111 | 32-HVQFN (7x7) | download | REACH Unaffected | 568-LPC1111FHN33/103 | 1 | 28 | ARM® Cortex®-M0 | 32-Bit | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 8KB (8K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 8x10b SAR | Internal | |||||||||||||||||||||||
|
Trenz Electronic GmbH 0820-05-2BI21MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-2BI21MA | 1 | ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I | Pin(s) | |||||||||||||||||||||||||||||||||
|
Trenz Electronic GmbH 0820-05-4AE21MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-4AE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E | Pin(s) | |||||||||||||||||||||||||||||||||
|
Trenz Electronic GmbH 0820-05-3BE21MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-3BE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E | Pin(s) | |||||||||||||||||||||||||||||||||
|
Trenz Electronic GmbH 0820-05-3AE21MA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-3AE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E | Pin(s) | |||||||||||||||||||||||||||||||||
|
Trenz Electronic GmbH 0820-05-S002C1 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Active | download | 1686-TE0820-05-S002C1 | 1 | ||||||||||||||||||||||||||||||||||||||||||
| MYIR Tech Limited MYC-C8MMQ6-V2-8E2D-180-C | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | - | Book | Active | 0°C ~ 70°C | 2.360" L x 1.930" W (60.00mm x 49.00mm) | Vendor Undefined | 3309-MYC-C8MMQ6-V2-8E2D-180-C | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A53, ARM® Cortex®-M4 | 400MHz, 1.8GHz | 3GB | 8GB | MPU Core | ARM® Cortex®-M4F | Board-to-Board (BTB) Socket | ||||||||||||||||||||||||||||||||
| MYIR Tech Limited MYC-JX8MPQ-8E3D-160-I | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | - | Book | Active | -40°C ~ 85°C | 3.230" L x 1.770" W (82.00mm x 45.00mm) | Vendor Undefined | 3309-MYC-JX8MPQ-8E3D-160-I | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A53, ARM® Cortex®-M7 | 800MHz, 1.6GHz | 3GB | 8GB | MPU Core | - | Card Edge |
