Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces |
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NXP USA Inc. MCIMX6Q6AVT10ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313319518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
NXP USA Inc. MCIMX6S4AVM08ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311642518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
NXP USA Inc. MCIMX6S5EVM10ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tape & Reel (TR) | Active | -20°C ~ 105°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||
NXP USA Inc. MCIMX6U4AVM08ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315166518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
NXP USA Inc. MCIMX6U6AVM08ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318787518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
NXP USA Inc. MK20DX256VLK7R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK20DX256 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324551528 | 3A991A2 | 8542.31.0001 | 1,000 | 52 | ARM® Cortex®-M4 | 32-Bit Single-Core | 72MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 2K x 8 | 64K x 8 | 1.71V ~ 3.6V | A/D 29x16b; D/A 1x12b | Internal | ||||||||||||
NXP USA Inc. MKL15Z128VLH4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL1 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKL15Z128 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321764528 | 3A991A2 | 8542.31.0001 | 1,500 | 54 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, TSI, UART/USART | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 16x16b; D/A 1x12b | Internal | ||||||||||||
NXP USA Inc. MKL15Z64VFM4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL1 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MKL15Z64 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320017528 | 3A991A2 | 8542.31.0001 | 5,000 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, TSI, UART/USART | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 1.71V ~ 3.6V | A/D 9x16b; D/A 1x12b | Internal | ||||||||||||
NXP USA Inc. MPC5125YVN400R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC51xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 324-BBGA | MPC5125 | 324-PBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322285518 | 3A991A2 | 8542.31.0001 | 500 | 64 | e300 | 32-Bit Single-Core | 400MHz | CANbus, EBI/EMI, Ethernet, I²C, USB OTG | DMA, WDT | - | ROMless | - | 32K x 8 | 1.08V ~ 3.6V | - | External | ||||||||||||
NXP USA Inc. S9S08AW16AE0VFTR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | S9S08 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318571528 | 3A991A2 | 8542.31.0001 | 2,000 | 38 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | ||||||||||||
NXP USA Inc. S9S08DZ60F2MLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S9S08 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 39 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | 2K x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | External | ||||||||||||||
NXP USA Inc. S9S08SG8E2CTJR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | S9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,500 | 16 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | |||||||||||||
NXP USA Inc. S9S08SL8F1MTJR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | S9S08 | 20-TSSOP | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324212518 | 3A991A2 | 8542.31.0001 | 2,500 | 16 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | 256 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 12x10b | External | |||||||||||||
NXP USA Inc. S9S12G128F0CLLR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | S9S12 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322126528 | EAR99 | 8542.31.0001 | 1,000 | 86 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||
NXP USA Inc. S9S12GN16F1VLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | S9S12 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 26 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||
NXP USA Inc. S9S12GN32F0CLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 40 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 2K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||
NXP USA Inc. S912XHY256F0CLM | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 300 | 88 | HCS12X | 16-Bit | 40MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LCD, Motor control PWM, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 8K x 8 | 12K x 8 | 4.5V ~ 5.5V | A/D 12x10b | External | ||||||||||||||
NXP USA Inc. MCIMX6D4AVT10AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318005557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
NXP USA Inc. MCIMX6Q4AVT08AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317979557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 852MHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
NXP USA Inc. MCIMX6Q5EYM10AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 624-LFBGA, FCBGA | MCIMX6 | 624-FCPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||
NXP USA Inc. MCIMX6Q6AVT08AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 852MHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||
NXP USA Inc. MCIMX6S1AVM08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||
NXP USA Inc. MCIMX6S4AVM08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||
NXP USA Inc. MCIMX6S5DVM10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320221557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
NXP USA Inc. MCIMX6S5EVM10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311756557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
NXP USA Inc. MCIMX6S6AVM08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311372557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
NXP USA Inc. MK20DX256VLL10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK20DX256 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311568557 | 3A991A2 | 8542.31.0001 | 90 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 64K x 8 | 1.71V ~ 3.6V | A/D 33x16b; D/A 1x12b | Internal | ||||||||||||
NXP USA Inc. MK52DN512CMD10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LBGA | MK52DN512 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 96 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | |||||||||||||
NXP USA Inc. MK63FN1M0VLQ12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK63FN1M0 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 60 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | |||||||||||||
NXP USA Inc. MK64FN1M0VDC12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-XFBGA | MK64FN1M0 | 121-XFBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318682557 | 3A991A2 | 8542.31.0001 | 348 | 83 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 37x16b; D/A 2x12b | Internal |
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