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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC9S08QG84CDTER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316653534 | EAR99 | 8542.31.0001 | 5,000 | 12 | S08 | 8-Bit | 20MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | ||||||||||||
| NXP USA Inc. MC9S08SE8VTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321339534 | EAR99 | 8542.31.0001 | 5,000 | 14 | S08 | 8-Bit | 20MHz | LINbus, SCI | LVD, POR, PWM | 8KB (8K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 10x10b | Internal | ||||||||||||
| NXP USA Inc. MCF51QW256CHS | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51Qx | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 44-VFLGA Exposed Pad | MCF51 | 44-MAPLGA (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 490 | 26 | Coldfire V1 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 66K x 8 | 1.85V ~ 3.6V | - | External | ||||||||||||||
| NXP USA Inc. MCF54451VM240J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5445x | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 256-LBGA | MCF54451 | 256-MAPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 450 | 132 | Coldfire V4 | 32-Bit Single-Core | 240MHz | I²C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | - | ROMless | - | 32K x 8 | 1.35V ~ 3.6V | - | Internal | |||||||||||||
| NXP USA Inc. MCIMX507CVK8BR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX50 | Tape & Reel (TR) | Active | 0°C ~ 70°C (TA) | Surface Mount | 416-LFBGA | MCIMX507 | 416-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323331518 | 5A992C | 8542.31.0001 | 1,000 | ARM® Cortex®-A8 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR, LPDDR2, DDR2 | Yes | LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.2V, 1.875V, 2.775V, 3.0V | Boot Security, Cryptography, Secure JTAG | 1-Wire, AC'97, I²C, I²S, MMC/SD, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX507CVM1B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX50 | Tray | Active | 0°C ~ 70°C (TA) | Surface Mount | 400-LFBGA | MCIMX507 | 400-LFBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319936557 | 5A992C | 8542.31.0001 | 90 | ARM® Cortex®-A8 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR, LPDDR2, DDR2 | Yes | LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.2V, 1.875V, 2.775V, 3.0V | Boot Security, Cryptography, Secure JTAG | 1-Wire, AC'97, I²C, I²S, MMC/SD, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX6D6AVT08ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tape & Reel (TR) | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317648518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 852MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX6D6AVT10ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tape & Reel (TR) | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314739518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX6L2EVN10AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SL | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 432-TFBGA | MCIMX6 | 432-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315744557 | 5A992C | 8542.31.0001 | 160 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX6L3DVN10AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SL | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 432-TFBGA | MCIMX6 | 432-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323421557 | 5A992C | 8542.31.0001 | 160 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX6L8DVN10AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SL | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 432-TFBGA | MCIMX6 | 432-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 160 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | |||||||||||||
| NXP USA Inc. MCIMX6Q4AVT10ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tape & Reel (TR) | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320155518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX6U1AVM08ABR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tape & Reel (TR) | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317841518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX6U4AVM08ABR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tape & Reel (TR) | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323386518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX6U5DVM10ABR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tape & Reel (TR) | Not For New Designs | 0°C ~ 95°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317963518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MK10DN512VMC10R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK10DN512 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314793518 | 3A991A2 | 8542.31.0001 | 2,000 | 90 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | ||||||||||||
| NXP USA Inc. MK10DX128VLK7R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK10DX128 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314757528 | 3A991A2 | 8542.31.0001 | 1,000 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 72MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 31x16b; D/A 1x12b | Internal | ||||||||||||
| NXP USA Inc. MK20DX128VLQ10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK20DX128 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 60 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | |||||||||||||
| NXP USA Inc. MK21FN1M0VLQ12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK21FN1M0 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320049557 | 3A991A2 | 8542.31.0001 | 60 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | ||||||||||||
| NXP USA Inc. MK21FN1M0VMC12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK21FN1M0 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 348 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 40x16b; D/A 2x12b | Internal | |||||||||||||
| NXP USA Inc. MK22FN1M0VLH12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK22FN1M0 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325747557 | 3A991A2 | 8542.31.0001 | 160 | 40 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 22x16b; D/A 1x12b | Internal | ||||||||||||
| NXP USA Inc. MK22FN1M0VLK12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK22FN1M0 | 80-FQFP (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318176557 | 3A991A2 | 8542.31.0001 | 96 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 27x16b; D/A 1x12b | Internal | |||||||||||||
| NXP USA Inc. MK22FN1M0VLQ12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK22FN1M0 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 60 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | |||||||||||||
| NXP USA Inc. MK22FN1M0VMC12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK22FN1M0 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311877557 | 3A991A2 | 8542.31.0001 | 348 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 38x16b; D/A 2x12b | Internal | ||||||||||||
| NXP USA Inc. MK22FN1M0VMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK22FN1M0 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317791557 | 3A991A2 | 8542.31.0001 | 160 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | ||||||||||||
| NXP USA Inc. MK22FX512VLL12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK22FX512 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314914557 | 3A991A2 | 8542.31.0001 | 90 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 33x16b; D/A 1x12b | Internal | ||||||||||||
| NXP USA Inc. MK22FX512VMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK22FX512 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311205557 | 3A991A2 | 8542.31.0001 | 160 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | ||||||||||||
| NXP USA Inc. MK30DN512VLL10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K30 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK30DN512 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LCD, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 38x16b; D/A 1x12b | Internal | |||||||||||||
| NXP USA Inc. MK50DN512CMC10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 121-LFBGA | MK50DN512 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315045557 | 3A991A2 | 8542.31.0001 | 348 | 78 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 27x16b; D/A 2x12b | Internal | ||||||||||||
| NXP USA Inc. MK51DX256CLK10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 80-LQFP | MK51DX256 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311122557 | 3A991A2 | 8542.31.0001 | 96 | 39 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LCD, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 64K x 8 | 1.71V ~ 3.6V | A/D 30x16b; D/A 2x12b | Internal |
