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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Base Product Number | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Controller Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Infineon Technologies CY8C4013LQI-411T | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | PSOC® 4 CY8C4000 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-UFQFN Exposed Pad | CY8C4013 | 16-QFN (3x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,500 | 12 | ARM® Cortex®-M0 | 32-Bit Single-Core | 16MHz | I²C | Brown-out Detect/Reset, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 5.5V | D/A 1x7b, 1x8b | Internal | ||||||||||||||||||
| Infineon Technologies CY8C4013SXI-410T | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | PSOC® 4 CY8C4000 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | CY8C4013 | 8-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,500 | 5 | ARM® Cortex®-M0 | 32-Bit Single-Core | 16MHz | I²C | Brown-out Detect/Reset, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 5.5V | D/A 1x7b, 1x8b | Internal | ||||||||||||||||||
| Infineon Technologies CY8C4014LQI-421T | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | PSOC® 4 CY8C4000 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-UFQFN Exposed Pad | CY8C4014 | 16-QFN (3x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,500 | 12 | ARM® Cortex®-M0 | 32-Bit Single-Core | 16MHz | I²C | Brown-out Detect/Reset, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 5.5V | D/A 1x7b, 1x8b | Internal | ||||||||||||||||||
| NXP USA Inc. MCIMX6X3CVO08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SX | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 400-LFBGA | MCIMX6 | 400-MAPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318479557 | 5A992C | 8542.31.0001 | 90 | ARM® Cortex®-A9, ARM® Cortex®-M4 | 200MHz, 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | AC'97, CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | |||||||||||||||||
| NXP USA Inc. MCIMX6X3EVK10AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SX | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 400-LFBGA | MCIMX6 | 400-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A9, ARM® Cortex®-M4 | 227MHz, 1GHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD, LVDS | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | AC'97, CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | ||||||||||||||||||
| NXP USA Inc. MCIMX6X3EVO10AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SX | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 400-LFBGA | MCIMX6 | 400-MAPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323679557 | 5A992C | 8542.31.0001 | 90 | ARM® Cortex®-A9, ARM® Cortex®-M4 | 227MHz, 1GHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | AC'97, CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | |||||||||||||||||
| NXP USA Inc. MCIMX6X4AVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SX | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 529-LFBGA | MCIMX6 | 529-MAPBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311956557 | 5A992C | 8542.31.0001 | 84 | ARM® Cortex®-A9, ARM® Cortex®-M4 | 200MHz, 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD, LVDS | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | AC'97, CAN, I²C, I²S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | |||||||||||||||||
| NXP USA Inc. MCIMX6X4EVM10AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SX | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 529-LFBGA | MCIMX6 | 529-MAPBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318213557 | 5A992C | 8542.31.0001 | 84 | ARM® Cortex®-A9, ARM® Cortex®-M4 | 227MHz, 1GHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD, LVDS | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | AC'97, CAN, I²C, I²S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC | |||||||||||||||||
| Microchip Technology DSPIC33EP16GS202-E/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP, Functional Safety (FuSa) | Tube | Active | -40°C ~ 125°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | DSPIC33EP16GS202 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 27 | 21 | dsPIC | 16-Bit | 60 MIPs | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 3V ~ 3.6V | A/D 12x12b; D/A 2x12b | Internal | ||||||||||||||||||
| Microchip Technology DSPIC33EP32GS202-E/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP, Functional Safety (FuSa) | Tube | Active | -40°C ~ 125°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | DSPIC33EP32GS202 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 27 | 21 | dsPIC | 16-Bit | 60 MIPs | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 3V ~ 3.6V | A/D 12x12b; D/A 2x12b | Internal | ||||||||||||||||||
| Microchip Technology DSPIC33EP16GS202-E/SS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, dsPIC™ 33EP, Functional Safety (FuSa) | Tube | Active | -40°C ~ 125°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | DSPIC33EP16GS202 | 28-SSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 47 | 21 | dsPIC | 16-Bit | 60 MIPs | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 3V ~ 3.6V | A/D 12x12b; D/A 2x12b | Internal | ||||||||||||||||||
| Microchip Technology PIC32MX350F128HT-V/RG | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, PIC® 32MX | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | PIC32MX350 | 64-QFN (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,300 | 53 | MIPS32® M4K™ | 32-Bit Single-Core | 80MHz | I²C, IrDA, LINbus, PMP, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 32K x 8 | 2.3V ~ 3.6V | A/D 28x10b | Internal | ||||||||||||||||||
| NXP USA Inc. LPC18S37JET100E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC18xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-TFBGA | LPC18S37 | 100-TFBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 260 | 49 | ARM® Cortex®-M3 | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, WDT | 1MB (1M x 8) | FLASH | - | 136K x 8 | 2.2V ~ 3.6V | A/D 4x10b; D/A 1x10b | Internal | ||||||||||||||||||
| NXP USA Inc. LPC43S57JET256E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC43xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 256-LBGA | LPC43S57 | 256-LBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 90 | 164 | ARM® Cortex®-M4/M0 | 32-Bit Dual-Core | 204MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, WDT | 1MB (1M x 8) | FLASH | - | 136K x 8 | 2.2V ~ 3.6V | A/D 8x10b; D/A 1x10b | Internal | ||||||||||||||||||
| NXP USA Inc. LPC1124JBD48/303QL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC1100 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | LPC1124 | 48-LQFP (7x7) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 38 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | ||||||||||||||||||
| Microchip Technology ATSAMG54N19B-AU | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM G54 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | ATSAMG54 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 38 | ARM® Cortex®-M4 | 32-Bit Single-Core | 96MHz | I²C, SPI, UART/USART | DMA, I²S, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 96K x 8 | 1.62V ~ 3.45V | A/D 8x12b | Internal | ||||||||||||||||||
| NXP USA Inc. MM912KS812AMAF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 125°C | Engine Control | Surface Mount | 100-LQFP Exposed Pad | MM912 | Not Verified | 4.7V ~ 36V | 100-LQFP-EP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 6 | S12XS | FLASH (256kB) | 12K x 8 | CAN, SCI, SPI | HCS12 | ||||||||||||||||||||||
| Microchip Technology PIC16F1615-I/P | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F, Functional Safety (FuSa) | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 14-DIP (0.300", 7.62mm) | PIC16F1615 | 14-PDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 30 | 12 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | - | 1K x 8 | 2.3V ~ 5.5V | A/D 8x10b; D/A 1x8b | Internal | ||||||||||||||||||
| Microchip Technology PIC16LF1615-I/SL | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | PIC16LF1615 | 14-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 57 | 12 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | - | 1K x 8 | 1.8V ~ 3.6V | A/D 8x10b; D/A 1x8b | Internal | ||||||||||||||||||
| Microchip Technology PIC16F1619-I/P | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F, Functional Safety (FuSa) | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | PIC16F1619 | 20-PDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 22 | 18 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | - | 1K x 8 | 2.3V ~ 5.5V | A/D 12x10b; D/A 1x8b | Internal | ||||||||||||||||||
| Microchip Technology PIC16LF1619T-I/ML | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | PIC16LF1619 | 20-QFN (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,300 | 18 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | - | 1K x 8 | 1.8V ~ 3.6V | A/D 12x10b; D/A 1x8b | Internal | ||||||||||||||||||
| Microchip Technology PIC16LF1619-I/ML | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | PIC16LF1619 | 20-QFN (4x4) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 91 | 18 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | - | 1K x 8 | 1.8V ~ 3.6V | A/D 12x10b; D/A 1x8b | Internal | ||||||||||||||||||
| Microchip Technology PIC16LF1619T-I/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | PIC16LF1619 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,600 | 18 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | - | 1K x 8 | 1.8V ~ 3.6V | A/D 12x10b; D/A 1x8b | Internal | ||||||||||||||||||
| Microchip Technology PIC16F1619-E/SS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F, Functional Safety (FuSa) | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | PIC16F1619 | 20-SSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 67 | 18 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | - | 1K x 8 | 2.3V ~ 5.5V | A/D 12x10b; D/A 1x8b | Internal | ||||||||||||||||||
| Microchip Technology PIC16LF1619-I/SS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | PIC16LF1619 | 20-SSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 67 | 18 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (8K x 14) | FLASH | - | 1K x 8 | 1.8V ~ 3.6V | A/D 12x10b; D/A 1x8b | Internal | ||||||||||||||||||
| XMOS XE216-256-TQ128-C20 | XMOS |
Min: 1 Mult: 1 |
/image/XMOS | XE | Tray | Discontinued at Digi-Key | 0°C ~ 70°C (TA) | Surface Mount | 128-TQFP Exposed Pad | XE216 | 128-TQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 67 | XCore | 32-Bit 16-Core | 2000MIPS | RGMII, USB | - | - | ROMless | - | 256K x 8 | 0.95V ~ 3.6V | - | External | ||||||||||||||||||
| XMOS XE216-512-FB236-C20 | XMOS |
Min: 1 Mult: 1 |
/image/XMOS | XE | Tray | Active | 0°C ~ 70°C (TA) | Surface Mount | 236-LFBGA | XE216 | 236-FBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 168 | 73 | XCore | 32-Bit 16-Core | 2000MIPS | RGMII, USB | - | - | ROMless | - | 512K x 8 | 0.95V ~ 3.6V | - | External | ||||||||||||||||||
| XMOS XL208-128-FB236-I10 | XMOS |
Min: 1 Mult: 1 |
/image/XMOS | XL | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 236-LFBGA | XL208 | 236-FBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 168 | 128 | XCore | 32-Bit 8-Core | 1000MIPS | - | - | - | ROMless | - | 128K x 8 | 0.95V ~ 3.6V | - | External | ||||||||||||||||||
| XMOS XL208-256-TQ128-I10 | XMOS |
Min: 1 Mult: 1 |
/image/XMOS | XL | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 128-TQFP Exposed Pad | XL208 | 128-TQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 88 | XCore | 32-Bit 8-Core | 1000MIPS | - | - | - | ROMless | - | 256K x 8 | 0.95V ~ 3.6V | - | External | ||||||||||||||||||
| XMOS XL210-256-FB236-I20 | XMOS |
Min: 1 Mult: 1 |
/image/XMOS | XL | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 236-LFBGA | XL210 | 236-FBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 168 | 128 | XCore | 32-Bit 10-Core | 2000MIPS | - | - | - | ROMless | - | 256K x 8 | 0.95V ~ 3.6V | - | External |
