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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Total RAM Bits | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Microchip Technology ATSAMD20E18A-MU | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM D20E | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | ATSAMD20 | 32-VQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 26 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.62V ~ 3.6V | A/D 10x12b; D/A 1x10b | Internal | |||||||
| Texas Instruments TMS5703137CGWTQEP | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | Hercules™ TMS570 ARM® Cortex®-R | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 337-LFBGA | TMS5703 | 337-NFBGA (16x16) | download | RoHS non-compliant | 3 (168 Hours) | REACH Affected | 3A991A2 | 8542.31.0001 | 90 | 120 | ARM® Cortex®-R4F | 16/32-Bit | 180MHz | CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 3MB (3M x 8) | FLASH | - | 256K x 8 | 1.14V ~ 1.32V | A/D 16x12b, 24x12b | External | |||||||
 |
Epson Electronics America Inc-Semiconductor Div S1C17564D111000 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-TQFP | S1C17564 | download | RoHS Compliant | 3 (168 Hours) | EAR99 | 8542.31.0001 | 210 | 40 | S1C17 | 16-Bit | 24MHz | I²C, IrDA, SPI, UART/USART | PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.65V ~ 1.95V | A/D 4x10b | Internal | ||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C17564F111100 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-TQFP | S1C17564 | download | RoHS Compliant | 3 (168 Hours) | EAR99 | 8542.31.0001 | 160 | 40 | S1C17 | 16-Bit | 24MHz | I²C, IrDA, SPI, UART/USART | PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.65V ~ 1.95V | A/D 4x10b | Internal | ||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C17611D101000 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -25°C ~ 70°C (TA) | Surface Mount | 48-TQFP | S1C17611 | download | RoHS Compliant | 3 (168 Hours) | EAR99 | 8542.31.0001 | 120 | 19 | S1C17 | 16-Bit | 8.2MHz | I²C, IrDA, SPI, UART/USART | LCD, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 4x10b | Internal | ||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C17704B102100 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Not For New Designs | -20°C ~ 70°C (TA) | Surface Mount | 161-VFBGA | S1C17704 | 161-VFBGA (7x7) | download | RoHS Compliant | 3 (168 Hours) | EAR99 | 8542.31.0001 | 416 | 28 | S1C17 | 16-Bit | 8.2MHz | I²C, IrDA, SPI, UART/USART | LCD, PWM, WDT | 64KB (64K x 8) | FLASH | - | 4K x 8 | 1.8V ~ 3.6V | - | Internal | |||||||
|
Epson Electronics America Inc-Semiconductor Div S1C17705F101100 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -25°C ~ 70°C (TA) | Surface Mount | 240-BFQFP | S1C17705 | download | RoHS Compliant | 3 (168 Hours) | EAR99 | 8542.31.0001 | 24 | 35 | S1C17 | 16-Bit | 8.2MHz | I²C, IrDA, SPI, UART/USART | LCD, PWM, WDT | 512KB (512K x 8) | FLASH | - | 12K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | ||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C17W22D00B000 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | Die | S1C17W22 | Die | download | 3 (168 Hours) | EAR99 | 8542.31.0001 | 1,200 | 41 | S1C17 | 16-Bit | 4.2MHz | I²C, IrDA, SPI, UART/USART | LCD, PWM, RFC, WDT | 64KB (64K x 8) | FLASH | - | 4K x 8 | 1.2V ~ 3.6V | - | Internal | ||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C6F016F401100 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Not For New Designs | -20°C ~ 70°C (TA) | Surface Mount | 100-BFQFP | S1C6F016 | 100-QFP15 (14x14) | RoHS Compliant | 3 (168 Hours) | EAR99 | 8542.31.0001 | 90 | 24 | S1C63000 | 4-Bit | 4MHz | SPI | LCD, PWM, RFC, WDT | 26KB (16K x 13) | FLASH | - | 2K x 4 | 1.8V ~ 3.6V | - | External | ||||||||
| Microchip Technology ATSAM4E16CA-ANR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM4E | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | ATSAM4E | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 1,000 | 79 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, Ethernet, IrDA, MMC/SD, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.62V ~ 3.6V | A/D 16x12b; D/A 2x12b | Internal | |||||||
| Microchip Technology ATSAM4E8CA-ANR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM4E | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | ATSAM4E | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 1,000 | 79 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, Ethernet, IrDA, MMC/SD, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.62V ~ 3.6V | A/D 16x12b; D/A 2x12b | Internal | |||||||
| Microchip Technology ATSAM4S16CA-ANR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM4S | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | ATSAM4S | 100-LQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,000 | 79 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | EBI/EMI, I²C, IrDA, Memory Card, SPI, SSC, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.62V ~ 3.6V | A/D 16x12b; D/A 2x12b | Internal | ||||||||
| Microchip Technology ATSAM4S16CA-CFNR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM4S | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-VFBGA | ATSAM4S | 100-VFBGA (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 4,000 | 79 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | EBI/EMI, I²C, IrDA, Memory Card, SPI, SSC, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.62V ~ 3.6V | A/D 16x12b; D/A 2x12b | Internal | ||||||||
| Microchip Technology ATSAM4S8CA-ANR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM4S | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | ATSAM4S | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,000 | 79 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | EBI/EMI, I²C, IrDA, Memory Card, SPI, SSC, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.62V ~ 3.6V | A/D 16x12b; D/A 2x12b | Internal | |||||||
| Microchip Technology ATSAM4S16CA-AN | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM4S | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | ATSAM4S | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1611-ATSAM4S16CA-AN | 3A991A2 | 8542.31.0001 | 90 | 79 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | EBI/EMI, I²C, IrDA, Memory Card, SPI, SSC, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.62V ~ 3.6V | A/D 16x12b; D/A 2x12b | Internal | ||||||
| NXP USA Inc. LPC11U68JBD64E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11Uxx | Tray | Discontinued at Digi-Key | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | LPC11 | 64-LQFP (10x10) | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 48 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 36K x 8 | 2.4V ~ 3.6V | A/D 10x12b | Internal | |||||||
| Lattice Semiconductor Corporation LCMXO3L-6900C-6BG256I | Lattice Semiconductor Corporation |
Min: 1 Mult: 1 |
/image/Lattice Semiconductor Corporation | MachXO3 | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 256-LFBGA | LCMXO3 | Not Verified | 2.375V ~ 3.465V | 256-CABGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 220-1889 | 3A991D | 8542.39.0001 | 119 | 245760 | 206 | 858 | 6864 | |||||||||||||
| Infineon Technologies SAK-TC1767-256F133HR AD | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | TC17xx | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP | SAK-TC1767 | PG-LQFP-176-5 | download | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 240 | 88 | TriCore™ | 32-Bit Single-Core | 133MHz | ASC, CANbus, MLI, MSC, SSC | DMA, POR, WDT | 2MB (2M x 8) | FLASH | - | 128K x 8 | 1.42V ~ 1.58V | A/D 4x10b, 32x12b | External | ||||||||
| Rohm Semiconductor ML610Q793-N01HBZ03B | Rohm Semiconductor |
Min: 1 Mult: 1 |
/image/Rohm Semiconductor | ML610790 | Tape & Reel (TR) | Not For New Designs | -30°C ~ 85°C (TA) | Surface Mount | 48-UFBGA, WLCSP | ML610Q793 | 48-WLCSP (3.06x2.96) | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | EAR99 | 8542.31.0001 | 2,000 | 21 | nX-U8/100 | 8-Bit | 4.096MHz | I²C, SPI, UART/USART | POR, WDT | 64KB (32K x 16) | FLASH | - | 4K x 8 | 1.7V ~ 1.9V | A/D 3x12b | External | |||||||
| Microchip Technology PIC12F1571-I/MF | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 12F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | PIC12F1571 | 8-DFN (3x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 120 | 6 | PIC | 8-Bit | 32MHz | - | Brown-out Detect/Reset, POR, PWM, WDT | 1.75KB (1K x 14) | FLASH | - | 128 x 8 | 2.3V ~ 5.5V | A/D 4x10b; D/A 1x5b | Internal | |||||||
| Microchip Technology PIC12F1612-I/SN | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 12F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | PIC12F1612 | 8-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 100 | 6 | PIC | 8-Bit | 32MHz | - | Brown-out Detect/Reset, POR, PWM, WDT | 3.5KB (2K x 14) | FLASH | - | 256 x 8 | 2.3V ~ 5.5V | A/D 4x10b | Internal | |||||||
| Microchip Technology PIC16F1613-I/ML | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-VQFN Exposed Pad | PIC16F1613 | 16-QFN (4x4) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 91 | 12 | PIC | 8-Bit | 32MHz | - | Brown-out Detect/Reset, POR, PWM, WDT | 3.5KB (2K x 14) | FLASH | - | 256 x 8 | 2.3V ~ 5.5V | A/D 8x10b | Internal | |||||||
| Microchip Technology PIC16F1613-I/P | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 14-DIP (0.300", 7.62mm) | PIC16F1613 | 14-PDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 30 | 12 | PIC | 8-Bit | 32MHz | - | Brown-out Detect/Reset, POR, PWM, WDT | 3.5KB (2K x 14) | FLASH | - | 256 x 8 | 2.3V ~ 5.5V | A/D 8x10b | Internal | |||||||
| Microchip Technology PIC16F1613-I/ST | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | PIC16F1613 | 14-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 12 | PIC | 8-Bit | 32MHz | - | Brown-out Detect/Reset, POR, PWM, WDT | 3.5KB (2K x 14) | FLASH | - | 256 x 8 | 2.3V ~ 5.5V | A/D 8x10b | Internal | |||||||
| Microchip Technology PIC12F1571T-I/MS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 12F | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | PIC12F1571 | 8-MSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,500 | 6 | PIC | 8-Bit | 32MHz | - | Brown-out Detect/Reset, POR, PWM, WDT | 1.75KB (1K x 14) | FLASH | - | 128 x 8 | 2.3V ~ 5.5V | A/D 4x10b; D/A 1x5b | Internal | |||||||
| Microchip Technology PIC12F1571T-I/SN | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 12F | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | PIC12F1571 | 8-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,300 | 6 | PIC | 8-Bit | 32MHz | - | Brown-out Detect/Reset, POR, PWM, WDT | 1.75KB (1K x 14) | FLASH | - | 128 x 8 | 2.3V ~ 5.5V | A/D 4x10b; D/A 1x5b | Internal | |||||||
| Microchip Technology PIC12F1572T-I/MF | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 12F | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | PIC12F1572 | 8-DFN (3x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,300 | 6 | PIC | 8-Bit | 32MHz | LINbus, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 3.5KB (2K x 14) | FLASH | - | 256 x 8 | 2.3V ~ 5.5V | A/D 4x10b; D/A 1x5b | Internal | |||||||
| Microchip Technology PIC12F1612T-I/SN | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 12F | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | PIC12F1612 | 8-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,300 | 6 | PIC | 8-Bit | 32MHz | - | Brown-out Detect/Reset, POR, PWM, WDT | 3.5KB (2K x 14) | FLASH | - | 256 x 8 | 2.3V ~ 5.5V | A/D 4x10b | Internal | |||||||
| Microchip Technology PIC12LF1571T-I/MS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 12F | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | PIC12LF1571 | 8-MSOP | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,500 | 6 | PIC | 8-Bit | 32MHz | - | Brown-out Detect/Reset, POR, PWM, WDT | 1.75KB (1K x 14) | FLASH | - | 128 x 8 | 1.8V ~ 3.6V | A/D 4x10b; D/A 1x5b | Internal | |||||||
| Microchip Technology PIC12LF1571T-I/SN | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 12F | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | PIC12LF1571 | 8-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 3,300 | 6 | PIC | 8-Bit | 32MHz | - | Brown-out Detect/Reset, POR, PWM, WDT | 1.75KB (1K x 14) | FLASH | - | 128 x 8 | 1.8V ~ 3.6V | A/D 4x10b; D/A 1x5b | Internal |
