Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics America Inc R5F140GLAFB#30 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RL78/G13A | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | 48-LFQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R5F140GLAFB#30 | 250 | 34 | RL78 | 16-Bit | 32MHz | CSI, I²C, LINbus, UART/USART | DMA, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 8K x 8 | 32K x 8 | 1.6V ~ 5.5V | A/D 10x8/10b | Internal | ||
Renesas Electronics America Inc R7FA4M3AE2CBM#BC0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RA4M3 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LFBGA | 144-LFBGA (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R7FA4M3AE2CBM#BC0 | 2,080 | 109 | ARM® Cortex®-M33 | 32-Bit | 100MHz | CANbus, EBI/EMI, I²C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB | 768KB (768K x 8) | FLASH | 8K x 8 | 128K x 8 | 2.7V ~ 3.6V | A/D 22x12b SAR; D/A 2x12b | Internal | |||
Renesas Electronics America Inc R7FA6M5BG2CBM#BC0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RA6M5 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LFBGA | 144-LFBGA (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R7FA6M5BG2CBM#BC0 | 2,080 | 109 | ARM® Cortex®-M33 | 32-Bit | 200MHz | 1.5MB (1.5M x 8) | FLASH | 8K x 8 | 512K x 8 | 2.7V ~ 3.6V | A/D 25x12b SAR; D/A 2x12b | Internal | ||||
Renesas Electronics America Inc R5F565NCHGFC#V0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RX65N | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP | 176-LFQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R5F565NCHGFC#V0 | 40 | 136 | RXv2 | 32-Bit | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB | DMA, LVD, POR, PWM, WDT | 1.5MB (1.5M x 8) | FLASH | 32K x 8 | 640K x 8 | 2.7V ~ 3.6V | A/D 29x12b; D/A 2x12b | External | ||
Renesas Electronics America Inc R7FA4M3AE2CBQ#BC0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RA4M3 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LFBGA | 64-LFBGA (6x6) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R7FA4M3AE2CBQ#BC0 | 3,016 | 45 | ARM® Cortex®-M33 | 32-Bit | 100MHz | 768KB (768K x 8) | FLASH | 8K x 8 | 128K x 8 | 2.7V ~ 3.6V | A/D 11x12b SAR; D/A 2x12b | Internal | ||||
Renesas Electronics America Inc R7F100GAF3CSP#BA0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RL78/G23 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 30-LSSOP (0.240", 6.10mm Width) | 30-LSSOP | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R7F100GAF3CSP#BA0 | 1,680 | 25 | RL78 | 16-Bit | 32MHz | CSI, I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 8K x 8 | 12K x 8 | 1.8V ~ 5.5V | A/D 8x8/10b/12b; D/A 2x8b | Internal | ||
Infineon Technologies S6J334DHEESE20000 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | Traveo™ T1G | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP Exposed Pad | 144-TEQFP (20x20) | ROHS3 Compliant | REACH Unaffected | 60 | 116 | ARM® Cortex®-R5F | 32-Bit | 240MHz | CANbus, CSIO, I²C, LINbus, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | FLASH | 112K x 8 | 544K x 8 | 3V ~ 3.6V | Internal | ||||||
Infineon Technologies S6J334DHFESE20000 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | Traveo™ T1G | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP Exposed Pad | 144-TEQFP (20x20) | ROHS3 Compliant | REACH Unaffected | 60 | 116 | ARM® Cortex®-R5F | 32-Bit | 240MHz | CANbus, CSIO, I²C, LINbus, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | FLASH | 112K x 8 | 544K x 8 | 3V ~ 3.6V | Internal | ||||||
Infineon Technologies S6J332DJEESE20000 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | Traveo™ T1G | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP Exposed Pad | 176-TEQFP (24x24) | ROHS3 Compliant | REACH Unaffected | 40 | 150 | ARM® Cortex®-R5F | 32-Bit | 240MHz | CANbus, CSIO, I²C, LINbus, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | FLASH | 112K x 8 | 544K x 8 | 3V ~ 3.6V | A/D 48x12b | Internal | |||||
Infineon Technologies CY9AF156NPMC-G-JNK1E2 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | FM3 MB9A150R | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-LQFP (14x14) | ROHS3 Compliant | REACH Unaffected | 90 | 83 | ARM® Cortex®-M3 | 32-Bit | 40MHz | CSIO, EBI/EMI, I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 544KB (544K x 8) | FLASH | - | 64K x 8 | 1.65V ~ 3.6V | A/D 24x12b | Internal | ||||
Analog Devices Inc./Maxim Integrated MAX32570-MNJ+ | Analog Devices Inc./Maxim Integrated |
Min: 1 Mult: 1 |
/image/Analog Devices Inc./Maxim Integrated | DeepCover® | Tray | Active | -40°C ~ 105°C | Surface Mount | 121-LFBGA | 121-CTBGA (8x8) | 8542.31.0001 | 1 | ARM® Cortex®-M4F | 32-Bit | 150MHz | 1MB (512K x 16) | FLASH | - | - | Internal | ||||||||||
NXP USA Inc. S912ZVC96AMLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | ROHS3 Compliant | 568-S912ZVC96AMLFRTR | 2,000 | 28 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 2K x 8 | 8K x 8 | 5.5V ~ 18V | A/D 10x10b SAR | External, Internal | ||||
NXP USA Inc. S912ZVC64AVLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | ROHS3 Compliant | 568-S912ZVC64AVLF | 1,250 | 28 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 1K x 8 | 4K x 8 | 5.5V ~ 18V | A/D 10x10b SAR | External, Internal | ||||
NXP USA Inc. S912ZVC96AVLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | ROHS3 Compliant | 568-S912ZVC96AVLF | 1,250 | 28 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 2K x 8 | 8K x 8 | 5.5V ~ 18V | A/D 10x10b SAR | External, Internal | ||||
NXP USA Inc. S912ZVC64AMLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | ROHS3 Compliant | 568-S912ZVC64AMLFRTR | 2,000 | 28 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 1K x 8 | 4K x 8 | 5.5V ~ 18V | A/D 10x10b SAR | External, Internal | ||||
NXP USA Inc. S912ZVCA19AMKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | 64-LQFP (10x10) | ROHS3 Compliant | 568-S912ZVCA19AMKH | 800 | 42 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 192KB (192K x 8) | FLASH | 2K x 8 | 12K x 8 | 5.5V ~ 18V | A/D 16x12b SAR; D/A 1x8b | External, Internal | ||||
NXP USA Inc. S912ZVCA19AMLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | ROHS3 Compliant | 568-S912ZVCA19AMLFRTR | 2,000 | 28 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 192KB (192K x 8) | FLASH | 2K x 8 | 12K x 8 | 5.5V ~ 18V | A/D 10x12b SAR; D/A 1x8b | External, Internal | ||||
NXP USA Inc. FS32R294LAK0MJDT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32R | Tray | Active | - | Surface Mount | 269-LFBGA | 269-LFBGA (14x14) | ROHS3 Compliant | 568-FS32R294LAK0MJDT | 760 | 32-Bit 5-Core | - | 3MB (3M x 8) | SRAM | - | 2.5M x 8 | - | - | Internal | ||||||||
NXP USA Inc. FH32K144UIT0VLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | ROHS3 Compliant | 568-FH32K144UIT0VLHRTR | 1,500 | |||||||||||||||||||||
NXP USA Inc. SPC5746CHK1ACKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 MPC57xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 176-LQFP Exposed Pad | 176-LQFP (24x24) | ROHS3 Compliant | 568-SPC5746CHK1ACKU6 | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SAI, SPI | DMA, I²S, LVD/HVD, POR, WDT | 3MB (3M x 8) | FLASH | 128K x 8 | 384K x 8 | 3.15V ~ 5.5V | A/D 68x10b, 31x12b SAR | Internal | ||||
Microchip Technology ATSAML11D14A-YUTKPH | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | * | Tape & Reel (TR) | Active | ROHS3 Compliant | 1 | ||||||||||||||||||||||
Microchip Technology ATSAML11E14A-AUKPH | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | * | Tray | Active | ROHS3 Compliant | 150-ATSAML11E14A-AUKPH | 1 |
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