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ALLCHIPS ELECTRONICS LIMITED

Image Name Manufacturer Quantity Mfr Series Package Product Status Operating Temperature Mounting Type Package / Case Supplier Device Package RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names HTSUS Standard Package Number of I/O Core Processor Core Size Speed Connectivity Peripherals Program Memory Size Program Memory Type EEPROM Size RAM Size Voltage - Supply (Vcc/Vdd) Data Converters Oscillator Type
Renesas Electronics America Inc R5F140GLAFB#30 Renesas Electronics America Inc R5F140GLAFB#30 Renesas Electronics America Inc
RFQ

Min: 1

Mult: 1

/image/Renesas Electronics America Inc RL78/G13A Tray Active -40°C ~ 85°C (TA) Surface Mount 48-LQFP 48-LFQFP (7x7) ROHS3 Compliant 3 (168 Hours) REACH Unaffected 559-R5F140GLAFB#30 250 34 RL78 16-Bit 32MHz CSI, I²C, LINbus, UART/USART DMA, LVD, POR, PWM, WDT 512KB (512K x 8) FLASH 8K x 8 32K x 8 1.6V ~ 5.5V A/D 10x8/10b Internal
Renesas Electronics America Inc R7FA4M3AE2CBM#BC0 Renesas Electronics America Inc R7FA4M3AE2CBM#BC0 Renesas Electronics America Inc
RFQ

Min: 1

Mult: 1

/image/Renesas Electronics America Inc RA4M3 Tray Active -40°C ~ 85°C (TA) Surface Mount 144-LFBGA 144-LFBGA (7x7) ROHS3 Compliant 3 (168 Hours) REACH Unaffected 559-R7FA4M3AE2CBM#BC0 2,080 109 ARM® Cortex®-M33 32-Bit 100MHz CANbus, EBI/EMI, I²C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB 768KB (768K x 8) FLASH 8K x 8 128K x 8 2.7V ~ 3.6V A/D 22x12b SAR; D/A 2x12b Internal
Renesas Electronics America Inc R7FA6M5BG2CBM#BC0 Renesas Electronics America Inc R7FA6M5BG2CBM#BC0 Renesas Electronics America Inc
RFQ

Min: 1

Mult: 1

/image/Renesas Electronics America Inc RA6M5 Tray Active -40°C ~ 85°C (TA) Surface Mount 144-LFBGA 144-LFBGA (7x7) ROHS3 Compliant 3 (168 Hours) REACH Unaffected 559-R7FA6M5BG2CBM#BC0 2,080 109 ARM® Cortex®-M33 32-Bit 200MHz 1.5MB (1.5M x 8) FLASH 8K x 8 512K x 8 2.7V ~ 3.6V A/D 25x12b SAR; D/A 2x12b Internal
Renesas Electronics America Inc R5F565NCHGFC#V0 Renesas Electronics America Inc R5F565NCHGFC#V0 Renesas Electronics America Inc
RFQ

Min: 1

Mult: 1

/image/Renesas Electronics America Inc RX65N Tray Active -40°C ~ 105°C (TA) Surface Mount 176-LQFP 176-LFQFP (24x24) ROHS3 Compliant 3 (168 Hours) REACH Unaffected 559-R5F565NCHGFC#V0 40 136 RXv2 32-Bit 120MHz CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB DMA, LVD, POR, PWM, WDT 1.5MB (1.5M x 8) FLASH 32K x 8 640K x 8 2.7V ~ 3.6V A/D 29x12b; D/A 2x12b External
Renesas Electronics America Inc R7FA4M3AE2CBQ#BC0 Renesas Electronics America Inc R7FA4M3AE2CBQ#BC0 Renesas Electronics America Inc
RFQ

Min: 1

Mult: 1

/image/Renesas Electronics America Inc RA4M3 Tray Active -40°C ~ 85°C (TA) Surface Mount 64-LFBGA 64-LFBGA (6x6) ROHS3 Compliant 3 (168 Hours) REACH Unaffected 559-R7FA4M3AE2CBQ#BC0 3,016 45 ARM® Cortex®-M33 32-Bit 100MHz 768KB (768K x 8) FLASH 8K x 8 128K x 8 2.7V ~ 3.6V A/D 11x12b SAR; D/A 2x12b Internal
Renesas Electronics America Inc R7F100GAF3CSP#BA0 Renesas Electronics America Inc R7F100GAF3CSP#BA0 Renesas Electronics America Inc
RFQ

Min: 1

Mult: 1

/image/Renesas Electronics America Inc RL78/G23 Tray Active -40°C ~ 105°C (TA) Surface Mount 30-LSSOP (0.240", 6.10mm Width) 30-LSSOP ROHS3 Compliant 3 (168 Hours) REACH Unaffected 559-R7F100GAF3CSP#BA0 1,680 25 RL78 16-Bit 32MHz CSI, I²C, LINbus, SPI, UART/USART LVD, POR, PWM, WDT 96KB (96K x 8) FLASH 8K x 8 12K x 8 1.8V ~ 5.5V A/D 8x8/10b/12b; D/A 2x8b Internal
Infineon Technologies S6J334DHEESE20000 Infineon Technologies S6J334DHEESE20000 Infineon Technologies
RFQ

Min: 1

Mult: 1

/image/Infineon Technologies Traveo™ T1G Tray Active -40°C ~ 105°C (TA) Surface Mount 144-LQFP Exposed Pad 144-TEQFP (20x20) ROHS3 Compliant REACH Unaffected 60 116 ARM® Cortex®-R5F 32-Bit 240MHz CANbus, CSIO, I²C, LINbus, UART/USART DMA, I²S, LVD, POR, PWM, WDT FLASH 112K x 8 544K x 8 3V ~ 3.6V Internal
Infineon Technologies S6J334DHFESE20000 Infineon Technologies S6J334DHFESE20000 Infineon Technologies
RFQ

Min: 1

Mult: 1

/image/Infineon Technologies Traveo™ T1G Tray Active -40°C ~ 105°C (TA) Surface Mount 144-LQFP Exposed Pad 144-TEQFP (20x20) ROHS3 Compliant REACH Unaffected 60 116 ARM® Cortex®-R5F 32-Bit 240MHz CANbus, CSIO, I²C, LINbus, UART/USART DMA, I²S, LVD, POR, PWM, WDT FLASH 112K x 8 544K x 8 3V ~ 3.6V Internal
Infineon Technologies S6J332DJEESE20000 Infineon Technologies S6J332DJEESE20000 Infineon Technologies
RFQ

Min: 1

Mult: 1

/image/Infineon Technologies Traveo™ T1G Tray Active -40°C ~ 105°C (TA) Surface Mount 176-LQFP Exposed Pad 176-TEQFP (24x24) ROHS3 Compliant REACH Unaffected 40 150 ARM® Cortex®-R5F 32-Bit 240MHz CANbus, CSIO, I²C, LINbus, UART/USART DMA, I²S, LVD, POR, PWM, WDT FLASH 112K x 8 544K x 8 3V ~ 3.6V A/D 48x12b Internal
Infineon Technologies CY9AF156NPMC-G-JNK1E2 Infineon Technologies CY9AF156NPMC-G-JNK1E2 Infineon Technologies
RFQ

Min: 1

Mult: 1

/image/Infineon Technologies FM3 MB9A150R Tray Active -40°C ~ 85°C (TA) Surface Mount 100-LQFP 100-LQFP (14x14) ROHS3 Compliant REACH Unaffected 90 83 ARM® Cortex®-M3 32-Bit 40MHz CSIO, EBI/EMI, I²C, SPI, UART/USART DMA, LVD, POR, PWM, WDT 544KB (544K x 8) FLASH - 64K x 8 1.65V ~ 3.6V A/D 24x12b Internal
Analog Devices Inc./Maxim Integrated MAX32570-MNJ+ Analog Devices Inc./Maxim Integrated MAX32570-MNJ+ Analog Devices Inc./Maxim Integrated
RFQ

Min: 1

Mult: 1

/image/Analog Devices Inc./Maxim Integrated DeepCover® Tray Active -40°C ~ 105°C Surface Mount 121-LFBGA 121-CTBGA (8x8) 8542.31.0001 1 ARM® Cortex®-M4F 32-Bit 150MHz 1MB (512K x 16) FLASH - - Internal
NXP USA Inc. S912ZVC96AMLFR NXP USA Inc. S912ZVC96AMLFR NXP USA Inc.
RFQ

Min: 1

Mult: 1

/image/NXP USA Inc. S12 MagniV Tape & Reel (TR) Active -40°C ~ 125°C (TA) Surface Mount 48-LQFP 48-LQFP (7x7) ROHS3 Compliant 568-S912ZVC96AMLFRTR 2,000 28 S12Z 16-Bit 32MHz CANbus, I²C, SCI, SPI DMA, LVD, POR, PWM, WDT 96KB (96K x 8) FLASH 2K x 8 8K x 8 5.5V ~ 18V A/D 10x10b SAR External, Internal
NXP USA Inc. S912ZVC64AVLF NXP USA Inc. S912ZVC64AVLF NXP USA Inc.
RFQ

Min: 1

Mult: 1

/image/NXP USA Inc. S12 MagniV Tray Active -40°C ~ 105°C (TA) Surface Mount 48-LQFP 48-LQFP (7x7) ROHS3 Compliant 568-S912ZVC64AVLF 1,250 28 S12Z 16-Bit 32MHz CANbus, I²C, SCI, SPI DMA, LVD, POR, PWM, WDT 64KB (64K x 8) FLASH 1K x 8 4K x 8 5.5V ~ 18V A/D 10x10b SAR External, Internal
NXP USA Inc. S912ZVC96AVLF NXP USA Inc. S912ZVC96AVLF NXP USA Inc.
RFQ

Min: 1

Mult: 1

/image/NXP USA Inc. S12 MagniV Tray Active -40°C ~ 105°C (TA) Surface Mount 48-LQFP 48-LQFP (7x7) ROHS3 Compliant 568-S912ZVC96AVLF 1,250 28 S12Z 16-Bit 32MHz CANbus, I²C, SCI, SPI DMA, LVD, POR, PWM, WDT 96KB (96K x 8) FLASH 2K x 8 8K x 8 5.5V ~ 18V A/D 10x10b SAR External, Internal
NXP USA Inc. S912ZVC64AMLFR NXP USA Inc. S912ZVC64AMLFR NXP USA Inc.
RFQ

Min: 1

Mult: 1

/image/NXP USA Inc. S12 MagniV Tape & Reel (TR) Active -40°C ~ 125°C (TA) Surface Mount 48-LQFP 48-LQFP (7x7) ROHS3 Compliant 568-S912ZVC64AMLFRTR 2,000 28 S12Z 16-Bit 32MHz CANbus, I²C, SCI, SPI DMA, LVD, POR, PWM, WDT 64KB (64K x 8) FLASH 1K x 8 4K x 8 5.5V ~ 18V A/D 10x10b SAR External, Internal
NXP USA Inc. S912ZVCA19AMKH NXP USA Inc. S912ZVCA19AMKH NXP USA Inc.
RFQ

Min: 1

Mult: 1

/image/NXP USA Inc. S12 MagniV Tray Active -40°C ~ 125°C (TA) Surface Mount 64-LQFP Exposed Pad 64-LQFP (10x10) ROHS3 Compliant 568-S912ZVCA19AMKH 800 42 S12Z 16-Bit 32MHz CANbus, I²C, SCI, SPI DMA, LVD, POR, PWM, WDT 192KB (192K x 8) FLASH 2K x 8 12K x 8 5.5V ~ 18V A/D 16x12b SAR; D/A 1x8b External, Internal
NXP USA Inc. S912ZVCA19AMLFR NXP USA Inc. S912ZVCA19AMLFR NXP USA Inc.
RFQ

Min: 1

Mult: 1

/image/NXP USA Inc. S12 MagniV Tape & Reel (TR) Active -40°C ~ 125°C (TA) Surface Mount 48-LQFP 48-LQFP (7x7) ROHS3 Compliant 568-S912ZVCA19AMLFRTR 2,000 28 S12Z 16-Bit 32MHz CANbus, I²C, SCI, SPI DMA, LVD, POR, PWM, WDT 192KB (192K x 8) FLASH 2K x 8 12K x 8 5.5V ~ 18V A/D 10x12b SAR; D/A 1x8b External, Internal
NXP USA Inc. FS32R294LAK0MJDT NXP USA Inc. FS32R294LAK0MJDT NXP USA Inc.
RFQ

Min: 1

Mult: 1

/image/NXP USA Inc. S32R Tray Active - Surface Mount 269-LFBGA 269-LFBGA (14x14) ROHS3 Compliant 568-FS32R294LAK0MJDT 760 32-Bit 5-Core - 3MB (3M x 8) SRAM - 2.5M x 8 - - Internal
NXP USA Inc. FH32K144UIT0VLHR NXP USA Inc. FH32K144UIT0VLHR NXP USA Inc.
RFQ

Min: 1

Mult: 1

/image/NXP USA Inc. - Tape & Reel (TR) Active ROHS3 Compliant 568-FH32K144UIT0VLHRTR 1,500
NXP USA Inc. SPC5746CHK1ACKU6 NXP USA Inc. SPC5746CHK1ACKU6 NXP USA Inc.
RFQ

Min: 1

Mult: 1

/image/NXP USA Inc. Automotive, AEC-Q100 MPC57xx Tray Active -40°C ~ 85°C (TA) Surface Mount 176-LQFP Exposed Pad 176-LQFP (24x24) ROHS3 Compliant 568-SPC5746CHK1ACKU6 200 129 e200z2, e200z4 32-Bit Dual-Core 80MHz, 160MHz CANbus, Ethernet, FlexRay, I²C, LINbus, SAI, SPI DMA, I²S, LVD/HVD, POR, WDT 3MB (3M x 8) FLASH 128K x 8 384K x 8 3.15V ~ 5.5V A/D 68x10b, 31x12b SAR Internal
Microchip Technology ATSAML11D14A-YUTKPH Microchip Technology ATSAML11D14A-YUTKPH Microchip Technology
RFQ

Min: 1

Mult: 1

/image/Microchip Technology * Tape & Reel (TR) Active ROHS3 Compliant 1
Microchip Technology ATSAML11E14A-AUKPH Microchip Technology ATSAML11E14A-AUKPH Microchip Technology
RFQ

Min: 1

Mult: 1

/image/Microchip Technology * Tray Active ROHS3 Compliant 150-ATSAML11E14A-AUKPH 1

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