Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Size / Dimension | Mounting Type | Package / Case | Base Product Number | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Total RAM Bits | Number of I/O | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Flash Size | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Module/Board Type | Co-Processor | Connector Type | Controller Series |
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Microchip Technology PIC16F15276-I/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 16F | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-TQFP | PIC16F15276 | 44-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-PIC16F15276-I/PT | 3A991A2 | 8542.31.0001 | 160 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (28K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 5.5V | A/D 28/2x10b | Internal | ||||||||||||||||||||||||
Microchip Technology M2GL150TS-1FCV484M | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | IGLOO2 | Tray | Active | -55°C ~ 125°C (TJ) | Surface Mount | 484-BFBGA | Not Verified | 1.14V ~ 2.625V | 484-FBGA (19x19) | download | ROHS3 Compliant | REACH Unaffected | 150-M2GL150TS-1FCV484M | 3A001A2C | 8542.39.0001 | 84 | 5120000 | 248 | 146124 | ||||||||||||||||||||||||||||||||||
Microchip Technology PIC16F15274-I/P | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 16F | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 40-DIP (0.600", 15.24mm) | PIC16F15274 | 40-PDIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 150-PIC16F15274-I/P | 3A991A2 | 8542.31.0001 | 10 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 7KB (7K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 5.5V | A/D 28/2x10b | Internal | ||||||||||||||||||||||||
Microchip Technology MPF300TS-FCG784NI | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PolarFire™ | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 784-BBGA, FCBGA | Not Verified | 0.97V ~ 1.08V | 784-FCBGA (29x29) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 150-MPF300TS-FCG784NI | 5A992C | 8542.31.0001 | 1 | 21600666 | 388 | 300000 | |||||||||||||||||||||||||||||||||
Microchip Technology PIC16F15256-I/SP | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 16F | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | PIC16F15256 | 28-SPDIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 150-PIC16F15256-I/SP | 3A991A2 | 8542.31.0001 | 15 | 24 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (28K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 5.5V | A/D 17/2x10b | Internal | ||||||||||||||||||||||||
Microchip Technology PIC16F15276-I/P | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 16F | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 40-DIP (0.600", 15.24mm) | PIC16F15276 | 40-PDIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 150-PIC16F15276-I/P | 3A991A2 | 8542.31.0001 | 10 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (28K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 5.5V | A/D 28/2x10b | Internal | ||||||||||||||||||||||||
STMicroelectronics STSPIN32F0601Q | STMicroelectronics |
Min: 1 Mult: 1 |
/image/STMicroelectronics | STSPIN32F060x | Tray | Active | -40°C ~ 125°C (TJ) | Home & Industrial | Surface Mount | 72-VFQFN Exposed Pad | Not Verified | 9V ~ 20V | 72-QFN (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 497-STSPIN32F0601Q | 3A991A2 | 8542.39.0001 | 168 | 21 | ARM® Cortex®-M0 | FLASH (32kB) | 4K x 8 | I²C, SPI, UART/USART | STM32F031x6x7 | |||||||||||||||||||||||||||||
Microchip Technology DSPIC33CDV64MC106-H/M8 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tube | Active | DSPIC33CDV64 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-DSPIC33CDV64MC106-H/M8 | 40 | ||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology DSPIC33CDVL64MC106T-I/M8 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | DSPIC33CDVL64 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-DSPIC33CDVL64MC106T-I/M8TR | 3,300 | ||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology DSPIC33CDV64MC106-I/M8 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tube | Active | DSPIC33CDV64 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-DSPIC33CDV64MC106-I/M8 | 40 | ||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX535DVP2C2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX53 | Tray | Active | -20°C ~ 85°C (TC) | Surface Mount | 529-FBGA | MCIMX535 | 529-FBGA (19x19) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 84 | ARM® Cortex®-A8 | 1.2GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR2, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | 1.3V, 1.8V, 2.775V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 1-Wire, AC'97, I²C, I²S, MMC/SD, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||
Trenz Electronic GmbH 0712-02-82C36-L | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Discontinued at Digi-Key | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-82C36-L | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||||||||||||||||||||||||||||||||||
Trenz Electronic GmbH 0712-02-81I36-AC | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-81I36-AC | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||||||||||||||||||||||||||||||||||
Trenz Electronic GmbH 0712-02-100-2CA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-100-2CA | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||||||||||||||||||||||||||||||||||
Trenz Electronic GmbH 0712-02-200-1I3 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-200-1I3 | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||||||||||||||||||||||||||||||||||
Trenz Electronic GmbH 0712-02-72C03-M | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-72C03-M | 3A991D | 8471.50.0150 | 1 | - | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||||||||||||||||||||||||||||||||||
Trenz Electronic GmbH 0712-02-82C36-AW | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Discontinued at Digi-Key | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-82C36-AW | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||||||||||||||||||||||||||||||||||
Trenz Electronic GmbH 0712-02-71I06-M | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-71I06-M | 3A991D | 8471.50.0150 | 1 | - | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||||||||||||||||||||||||||||||||||
Trenz Electronic GmbH 0712-02-200-2C10 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-200-2C10 | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||||||||||||||||||||||||||||||||||
Trenz Electronic GmbH 0712-02-200-1IC1 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-200-1IC1 | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||||||||||||||||||||||||||||||||||
Trenz Electronic GmbH 0712-02-71I01-M | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-71I01-M | 3A991D | 8471.50.0150 | 1 | - | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||||||||||||||||||||||||||||||||||
Trenz Electronic GmbH 0712-02-72C36-C | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-72C36-C | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||||||||||||||||||||||||||||||||||
Trenz Electronic GmbH 0712-02-100-2C2 | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-100-2C2 | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||||||||||||||||||||||||||||||||||
Infineon Technologies F010074233-5999 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | - | Tray | Obsolete | F010074233 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 40 | ||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies B000074233 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | - | Tray | Obsolete | B000074233 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 40 | ||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies CY9EF226PMC-GS-ERE2-A401 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | - | Tape & Reel (TR) | Obsolete | CY9EF226 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 1,500 | ||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. LPC1111FHN33/103K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC1100XL | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VQFN Exposed Pad | LPC1111 | 32-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A | 8542.31.0001 | 1,300 | 28 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 8KB (8K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 8x10b SAR | Internal | |||||||||||||||||||||||||
NXP USA Inc. LX2162RC82029B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ LX | Tray | Active | 5°C ~ 105°C (TA) | Surface Mount | 1150-FBGA | 1150-FBGA (23x23) | ROHS3 Compliant | REACH Unaffected | 60 | ARM® Cortex®-A72 | 2GHz | 16 Core, 64-Bit | - | DDR4, SDRAM | No | - | - | SATA 6Gbps (4) | USB 3.0 (1) | - | - | CANbus, I²C, PCIe, SPI, UART | ||||||||||||||||||||||||||||||
NXP USA Inc. LX2082RE82029B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ LX | Tray | Active | 5°C ~ 105°C (TA) | Surface Mount | 1150-FBGA | 1150-FBGA (23x23) | ROHS3 Compliant | REACH Unaffected | 60 | ARM® Cortex®-A72 | 2GHz | 8 Core, 64-Bit | - | DDR4, SDRAM | No | - | - | SATA 6Gbps (4) | USB 3.0 (1) | - | - | CANbus, I²C, PCIe, SPI, UART | ||||||||||||||||||||||||||||||
NXP USA Inc. LX2122RC82029B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ LX | Tray | Active | 5°C ~ 105°C (TA) | Surface Mount | 1150-FBGA | 1150-FBGA (23x23) | ROHS3 Compliant | REACH Unaffected | 60 | ARM® Cortex®-A72 | 2GHz | 12 Core, 64-Bit | - | DDR4, SDRAM | No | - | - | SATA 6Gbps (4) | USB 3.0 (1) | - | - | CANbus, I²C, PCIe, SPI, UART |
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