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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Mounting Type | Package / Case | Type | Base Product Number | Digi-Key Programmable | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Flash Size | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Module/Board Type | Co-Processor | Connector Type | Clock Rate | Non-Volatile Memory | On-Chip RAM | Voltage - Core |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MIMXRT1062CVJ5AR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1060 | Tape & Reel (TR) | Discontinued at Digi-Key | -40°C ~ 105°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1062 | 196-LFBGA (12x12) | ROHS3 Compliant | REACH Unaffected | 1,000 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 528MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | - | External Program Memory | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | |||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT106LDVL6B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1060 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT106 | 196-MAPBGA (10x10) | ROHS3 Compliant | REACH Unaffected | 240 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 600MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | - | External Program Memory | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | |||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1064DVL6BR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1064 | Tape & Reel (TR) | Active | 0°C ~ 95°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1064 | 196-MAPBGA (10x10) | ROHS3 Compliant | REACH Unaffected | 5A992C | 8542.31.0001 | 1,500 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 600MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | 4MB (4M x 8) | FLASH | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | |||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1061DVL6B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1060 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1061 | 196-MAPBGA (10x10) | ROHS3 Compliant | REACH Unaffected | 240 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 600MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | External Program Memory | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | |||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1061CVJ5AR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1060 | Tape & Reel (TR) | Discontinued at Digi-Key | -40°C ~ 105°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1061 | 196-LFBGA (12x12) | ROHS3 Compliant | REACH Unaffected | 1,000 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 528MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | External Program Memory | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | |||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT106SDVL6B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1060 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT106 | 196-MAPBGA (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 240 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 600MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | - | External Program Memory | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | ||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT106ADVL6BR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1060 | Tape & Reel (TR) | Active | 0°C ~ 95°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT106 | 196-MAPBGA (10x10) | ROHS3 Compliant | REACH Unaffected | 1,500 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 600MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | - | External Program Memory | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | |||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1061CVJ5BR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1060 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1061 | 196-LFBGA (12x12) | ROHS3 Compliant | REACH Unaffected | 1,000 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 528MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | External Program Memory | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | |||||||||||||||||||||||||||||
| Trenz Electronic GmbH 0808-05-9BE21-AK | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-05-9BE21-AK | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 2GB | 128MB | MPU Core | - | B2B | ||||||||||||||||||||||||||||||||||
 |
Analog Devices Inc./Maxim Integrated MAXQ1850-LNS+ | Analog Devices Inc./Maxim Integrated |
Min: 1 Mult: 1 |
/image/Analog Devices Inc./Maxim Integrated | - | Tray | Obsolete | Not Verified | download | ROHS3 Compliant | 1 (Unlimited) | 175-MAXQ1850-LNS+ | OBSOLETE | 50 | ||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. S32G274AABK0CUCT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 420 | ARM® Cortex®-A53, ARM® Cortex®-M7 | 400MHz, 1GHz | 4 Core, 64-Bit/3 Core, 32-Bit | - | DDR3L SDRAM, LPDDR4 DRAM | - | - | MII, RGMII, RMII, SGMII | - | USB OTG (1) | HSE-H | CAN, FlexRay, I²C, SPI, UART | |||||||||||||||||||||||||||
| Renesas Electronics America Inc R8A774C0HA01BG#UA | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RZ/G2E | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 552-BGA | 552-FPBGA | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 559-R8A774C0HA01BG#UA | 60 | ARM® Cortex®-A53 | 1.2GHz | 2 Core, 64-Bit | Multimedia; NEON™ MPE | DDR3L | No | MIPI-CSI | 10/100Mbps (1), 100/1000Mbps (1) | - | USB 2.0 (1), USB 3.0 (1) | - | - | CAN, I²C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | |||||||||||||||||||||||||||
|
NXP USA Inc. MSC8156HAG1000B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | StarCore | Tray | Obsolete | 0°C ~ 105°C | Surface Mount | 783-BBGA, FCBGA | SC3850 Six Core | 783-FCPBGA (29x29) | REACH Unaffected | OBSOLETE | 36 | Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | 2.50V | 1GHz | ROM (96kB) | 576kB | 1.00V | |||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MSC8156AG1000B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | StarCore | Tray | Obsolete | 0°C ~ 105°C | Surface Mount | 783-BBGA, FCBGA | SC3850 Six Core | 783-FCPBGA (29x29) | REACH Unaffected | OBSOLETE | 36 | Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | 2.50V | 1GHz | ROM (96kB) | 576kB | 1.00V | |||||||||||||||||||||||||||||||||||
|
NXP USA Inc. P1020SSE2HFB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ P1 | Tray | Obsolete | 0°C ~ 125°C (TA) | Surface Mount | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | REACH Unaffected | OBSOLETE | 27 | PowerPC e500v2 | 800MHz | 2 Core, 32-Bit | Security; SEC 3.3 | DDR2, DDR3 | No | - | 10/100/1000Mbps (3) | - | USB 2.0 + PHY (2) | - | 3DES, AES, KASUMI, MD5, RNG, SHA, SNOW 3G | DMA, DUART, I²C, MMC/SD, PCIe, SPI | |||||||||||||||||||||||||||||
|
Analog Devices Inc. SP-21573KBCZ4D9 | Analog Devices Inc. |
Min: 1 Mult: 1 |
/image/Analog Devices Inc. | Automotive, SHARC® | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 400-LFBGA, CSPBGA | Fixed/Floating Point | 400-CSPBGA (17x17) | 3 (168 Hours) | 505-ADSP-21573KBCZ4D9 | OBSOLETE | 1 | CAN, EBI/EMI, Ethernet, DAI, I²C, MMC/SD/SDIO, SPI, SPORT, UART/USART, USB OTG | 3.30V | 450MHz | External | 1.768MB | 1.1V | ||||||||||||||||||||||||||||||||||
|
Analog Devices Inc. SP-SC573KBCZ4D1 | Analog Devices Inc. |
Min: 1 Mult: 1 |
/image/Analog Devices Inc. | Automotive, SHARC® | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 400-LFBGA, CSPBGA | Fixed/Floating Point | 400-CSPBGA (17x17) | 3 (168 Hours) | 505-ADSP-SC573KBCZ4D1 | OBSOLETE | 1 | CAN, EBI/EMI, Ethernet, DAI, I²C, MMC/SD/SDIO, SPI, SPORT, UART/USART, USB OTG | 3.30V | 450MHz, 450MHz | External | 1.768MB | 1.1V | ||||||||||||||||||||||||||||||||||
|
Analog Devices Inc. SP-21573KBCZ4D5 | Analog Devices Inc. |
Min: 1 Mult: 1 |
/image/Analog Devices Inc. | Automotive, SHARC® | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 400-LFBGA, CSPBGA | Fixed/Floating Point | 400-CSPBGA (17x17) | 3 (168 Hours) | 505-ADSP-21573KBCZ4D5 | OBSOLETE | 1 | CAN, EBI/EMI, Ethernet, DAI, I²C, MMC/SD/SDIO, SPI, SPORT, UART/USART, USB OTG | 3.30V | 450MHz | External | 1.768MB | 1.1V | ||||||||||||||||||||||||||||||||||
|
Analog Devices Inc. SP-21573KBCZ4D1 | Analog Devices Inc. |
Min: 1 Mult: 1 |
/image/Analog Devices Inc. | Automotive, SHARC® | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 400-LFBGA, CSPBGA | Fixed/Floating Point | 400-CSPBGA (17x17) | 3 (168 Hours) | 505-ADSP-21573KBCZ4D1 | OBSOLETE | 1 | CAN, EBI/EMI, Ethernet, DAI, I²C, MMC/SD/SDIO, SPI, SPORT, UART/USART, USB OTG | 3.30V | 450MHz | External | 1.768MB | 1.1V | ||||||||||||||||||||||||||||||||||
|
Trenz Electronic GmbH 0803-04-4BE11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-4BE11-A | 1 | Zynq UltraScale+ XCZU4EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||||||||||||||||||||||||||||||||
|
Trenz Electronic GmbH 0803-04-3BE11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-3BE11-A | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||||||||||||||||||||||||||||||||
|
Trenz Electronic GmbH 0803-04-5DE11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-5DE11-A | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||||||||||||||||||||||||||||||||
|
Trenz Electronic GmbH 0803-04-2BE11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-2BE11-A | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||||||||||||||||||||||||||||||||
|
Trenz Electronic GmbH 0803-04-2AE11-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-2AE11-A | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||||||||||||||||||||||||||||||||
|
Infineon Technologies CY91F223PFV-GS-UJE1 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | - | Tray | Obsolete | - | - | - | CY91F223 | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 600 | - | - | - | - | - | - | - | - | - | - | - | - | |||||||||||||||||||||||||||
| Himax HX6539-A04TLDG | Himax |
Min: 1 Mult: 1 |
/image/Himax | - | Tray | Active | - | Surface Mount | 128-LQFP | HX6539 | 128-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 3367-HX6539-A04TLDG | EAR99 | 900 | 15 | ARC EM9D | - | 400MHz | I²C, PDM, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, POR, PWM, Sensor I/F, WDT | 2MB (2M x 8) | FLASH | - | 2M x 8 | 1.8V | A/D 4x12b | Internal | |||||||||||||||||||||||||
| Renesas Electronics America Inc R7FA4M2AB3CFP#AA0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RA4M2 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | R7FA4M2 | 100-LFQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 90 | 78 | ARM® Cortex®-M33 | 32-Bit Single-Core | 100MHz | CANbus, I²C, QSPI, SCI, SPI, UART/USART, USB | AES, DMA, LVD, POR, PWM, Temp Sensor, WDT | 254KB (254K x 8) | FLASH | 8K x 8 | 128K x 8 | 2.7V ~ 3.6V | A/D 13x12b SAR; D/A 2x12b | Internal | |||||||||||||||||||||||||
| Renesas Electronics America Inc R7FA4M3AE3CFB#AA0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RA4M3 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | R7FA4M3 | 144-LFQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | 110 | ARM® Cortex®-M33 | 32-Bit Single-Core | 100MHz | CANbus, I²C, QSPI, SCI, SPI, UART/USART, USB | AES, DMA, LVD, POR, PWM, Temp Sensor, WDT | 768KB (768K x 8) | FLASH | 8K x 8 | 128K x 8 | 2.7V ~ 3.6V | A/D 22x12b SAR; D/A 2x12b | Internal | |||||||||||||||||||||||||
| Renesas Electronics America Inc R7FA2E1A53CFL#AA0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RA2E1 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | R7FA2E1 | 48-LFQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 250 | 40 | ARM® Cortex®-M23 | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.6V ~ 5.5V | A/D 13x12b SAR | External | |||||||||||||||||||||||||
| Renesas Electronics America Inc R7FA2E1A52DFJ#AA0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RA2E1 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | R7FA2E1 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 250 | 26 | ARM® Cortex®-M23 | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.6V ~ 5.5V | A/D 10x12b SAR | External |
