Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Type | Base Product Number | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Flash Size | Primary Attributes | Voltage - I/O | Clock Rate | Non-Volatile Memory | On-Chip RAM | Voltage - Core |
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Microchip Technology DSPIC33CK128MC105-I/M7 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-QFN | DSPIC33CK128MC105 | 48-VQFN (6x6) | REACH Unaffected | 150-DSPIC33CK128MC105-I/M7 | 3A991A2 | 8542.31.0001 | 61 | dsPIC | 16-Bit | - | - | - | 128KB (128K x 8) | FLASH | - | - | 3V ~ 3.6V | - | Internal | |||||||||||||||||||
Microchip Technology MPF050TL-FCSG325E | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | 0°C ~ 100°C (TJ) | Surface Mount | 325-TFBGA | Not Verified | 0.97V ~ 1.08V | 325-BGA (11x11) | REACH Unaffected | 150-MPF050TL-FCSG325E | 1 | 164 | 48000 | 3774874 | |||||||||||||||||||||||||||||
Microchip Technology DSPIC33CK128MC506-E/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-TQFP | DSPIC33CK128MC506 | 64-TQFP (10x10) | REACH Unaffected | 150-DSPIC33CK128MC506-E/PT | 3A991A2 | 8542.31.0001 | 160 | dsPIC | 16-Bit | - | - | - | 128KB (128K x 8) | FLASH | - | - | 3V ~ 3.6V | - | Internal | |||||||||||||||||||
Microchip Technology MPFS025T-FCVG484I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 100°C | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | REACH Unaffected | 150-MPFS025T-FCVG484I | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||||||||||||||||||||||
Microchip Technology MPF050T-1FCSG325I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 325-TFBGA | Not Verified | 0.97V ~ 1.08V | 325-BGA (11x11) | REACH Unaffected | 150-MPF050T-1FCSG325I | 1 | 164 | 48000 | 3774874 | |||||||||||||||||||||||||||||
Microchip Technology DSPIC33CK128MC503-E/M5 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 36-UFQFN Exposed Pad | DSPIC33CK128MC503 | 36-UQFN (5x5) | REACH Unaffected | 150-DSPIC33CK128MC503-E/M5 | 3A991A2 | 8542.31.0001 | 73 | dsPIC | 16-Bit | - | - | - | 128KB (128K x 8) | FLASH | - | - | 3V ~ 3.6V | - | Internal | |||||||||||||||||||
Microchip Technology DSPIC33EDV64MC205T-E/M7 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-QFN | DSPIC33EDV64MC205 | 48-VQFN (6x6) | REACH Unaffected | 150-DSPIC33EDV64MC205T-E/M7TR | 3A991A2 | 8542.31.0001 | 1,600 | dsPIC | 16-Bit | - | - | - | 64KB (22K x 24) | FLASH | - | 8K x 8 | 5.5V | - | Internal | |||||||||||||||||||
Microchip Technology ATSAMC20J17A-ANTS2 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM C20 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-TQFP | ATSAMC20 | 64-TQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,500 | 52 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |||||||||||||||||
Microchip Technology DSPIC33CK128MC502-I/M6 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-UFQFN Exposed Pad | DSPIC33CK128MC502 | 28-UQFN (4x4) | REACH Unaffected | 150-DSPIC33CK128MC502-I/M6 | 3A991A2 | 8542.31.0001 | 91 | dsPIC | 16-Bit | - | - | - | 128KB (128K x 8) | FLASH | - | - | 3V ~ 3.6V | - | Internal | |||||||||||||||||||
Microchip Technology MPFS025TL-FCVG484I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 100°C | 484-BFBGA | 484-FBGA (19x19) | REACH Unaffected | 150-MPFS025TL-FCVG484I | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||||||||||||||||||||||
Microchip Technology MPF050TL-FCSG325I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 325-TFBGA | Not Verified | 0.97V ~ 1.08V | 325-BGA (11x11) | REACH Unaffected | 150-MPF050TL-FCSG325I | 1 | 164 | 48000 | 3774874 | |||||||||||||||||||||||||||||
Microchip Technology MPF050T-FCVG484E | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | 0°C ~ 100°C (TJ) | Surface Mount | 484-BFBGA | Not Verified | 0.97V ~ 1.08V | 484-FBGA (19x19) | REACH Unaffected | 150-MPF050T-FCVG484E | 1 | 176 | 48000 | 3774874 | |||||||||||||||||||||||||||||
Microchip Technology DSPIC33CK128MC105T-I/M7 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-QFN | DSPIC33CK128MC105 | 48-VQFN (6x6) | REACH Unaffected | 150-DSPIC33CK128MC105T-I/M7TR | 3A991A2 | 8542.31.0001 | 3,300 | dsPIC | 16-Bit | - | - | - | 128KB (128K x 8) | FLASH | - | - | 3V ~ 3.6V | - | Internal | |||||||||||||||||||
Microchip Technology DSPIC33CK128MC103-I/M5 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 36-UFQFN Exposed Pad | DSPIC33CK128MC103 | 36-UQFN (5x5) | REACH Unaffected | 150-DSPIC33CK128MC103-I/M5 | 3A991A2 | 8542.31.0001 | 73 | dsPIC | 16-Bit | - | - | - | 128KB (128K x 8) | FLASH | - | - | 3V ~ 3.6V | - | Internal | |||||||||||||||||||
Microchip Technology DSPIC33CK128MC105-I/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-TQFP | DSPIC33CK128MC105 | 48-TQFP (7x7) | REACH Unaffected | 150-DSPIC33CK128MC105-I/PT | 3A991A2 | 8542.31.0001 | 250 | dsPIC | 16-Bit | - | - | - | 128KB (128K x 8) | FLASH | - | - | 3V ~ 3.6V | - | Internal | |||||||||||||||||||
Microchip Technology MPF050T-FCSG325I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 325-TFBGA | Not Verified | 0.97V ~ 1.08V | 325-BGA (11x11) | REACH Unaffected | 150-MPF050T-FCSG325I | 1 | 164 | 48000 | 3774874 | |||||||||||||||||||||||||||||
Microchip Technology DSPIC33CK128MC506-I/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-TQFP | DSPIC33CK128MC506 | 64-TQFP (10x10) | REACH Unaffected | 150-DSPIC33CK128MC506-I/PT | 3A991A2 | 8542.31.0001 | 160 | dsPIC | 16-Bit | - | - | - | 128KB (128K x 8) | FLASH | - | - | 3V ~ 3.6V | - | Internal | |||||||||||||||||||
Analog Devices Inc. SP-21593KBPZ10 | Analog Devices Inc. |
Min: 1 Mult: 1 |
/image/Analog Devices Inc. | - | Tray | Last Time Buy | 0°C ~ 110°C (TJ) | Surface Mount | 400-FBGA | Fixed/Floating Point | 400-BGA (17x17) | download | 3 (168 Hours) | 5A992C | 8542.31.0001 | 16 | CAN, DDR2, DDR3, EBI/EMI, Ethernet, DAI, I²C, SPI, SPORT, UART/USART, USB OTG | 3.30V | 1GHz | External | 2MB | 1V | |||||||||||||||||||||||||
Analog Devices Inc. SP-21591KBPZ8 | Analog Devices Inc. |
Min: 1 Mult: 1 |
/image/Analog Devices Inc. | - | Tray | Last Time Buy | 0°C ~ 110°C (TJ) | Surface Mount | 400-FBGA | Fixed/Floating Point | 400-BGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 1 | CAN, DDR2, DDR3, EBI/EMI, Ethernet, DAI, I²C, SPI, SPORT, UART/USART, USB OTG | 3.30V | 800MHz | External | 1MB | 1V | |||||||||||||||||||||||
Renesas Electronics America Inc R7FA6M3AF3CLK#AC0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | * | Tray | Active | R7FA6M3 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 416 | ||||||||||||||||||||||||||||||||||||
Renesas Electronics America Inc R7FA6M3AH3CLK#AC0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | * | Tray | Active | R7FA6M3 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 8542.31.0001 | 416 | |||||||||||||||||||||||||||||||||||
Renesas Electronics America Inc R7FA6E10D2CFM#AA0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | * | Tray | Active | R7FA6E10 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 160 | ||||||||||||||||||||||||||||||||||
Renesas Electronics America Inc R7FA6M2AD3CLK#AC0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | * | Tray | Active | R7FA6M2 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 416 | ||||||||||||||||||||||||||||||||||
Renesas Electronics America Inc R7FA4E10B2CFM#AA0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | * | Tray | Active | R7FA4E10 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 160 | ||||||||||||||||||||||||||||||||||
Renesas Electronics America Inc R7FA4E10B2CNE#AA0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | * | Tray | Active | R7FA4E10 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 25 | ||||||||||||||||||||||||||||||||||
NXP USA Inc. LPC2101FBD48,151 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC21xx | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | LPC2101 | 48-LQFP (7x7) | ROHS3 Compliant | 1 (Unlimited) | REACH info available upon request | 2832-LPC2101FBD48,151 | EAR99 | 8542.31.0000 | 250 | 32 | ARM7TDMI-S | 16/32-Bit | 70MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | PWM, WDT | 8KB (8K x 8) | FLASH | - | 2K x 8 | 1.65V ~ 1.95V, 2.6V ~ 3.6V | A/D 8x10b SAR | External, Internal | ||||||||||||||||
Renesas Electronics America Inc R5F212K2SNFP#V2 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | R8C | Tray | Not For New Designs | -20°C ~ 85°C (TA) | Surface Mount | 32-LQFP | R5F212K | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-R5F212K2SNFP#V2 | EAR99 | 8542.31.0000 | 38 | 25 | R8C | 16-Bit | 20MHz | LINbus, SIO, UART/USART | POR, PWM, Voltage Detect, WDT | 8KB (8K x 8) | FLASH | - | 1K x 8 | 2.2V ~ 5.5V | A/D 9x10b | Internal | ||||||||||||||||
NXP USA Inc. MC56F8014VFAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8014 | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MC56F80 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MC56F8014VFAE | 3A991A2 | 8542.31.0000 | 1 | 26 | 56800E | 16-Bit | 32MHz | I²C, SCI, SPI | POR, PWM, WDT | 16KB (8K x 16) | FLASH | - | 2K x 16 | 3V ~ 3.6V | A/D 8x12b | Internal | |||||||||||||||
NXP USA Inc. MCF52233CAL60 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF52235 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | MCF52233 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MCF52233CAL60 | 3A991A2 | 8542.31.0000 | 60 | 56 | ColdFire V2 | 32-Bit Single-Core | 60MHz | Ethernet, I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 3V ~ 3.6V | A/D 8x12b | Internal | ||||||||||||||||
NXP USA Inc. MCF52100CVM80 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF521xx | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 81-LBGA | MCF52100 | 81-MAPBGA (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MCF52100CVM80 | 3A991A2 | 8542.31.0000 | 21 | 55 | ColdFire V2 | 32-Bit Single-Core | 80MHz | I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 16K x 8 | 3V ~ 3.6V | A/D 8x12b | External, Internal |
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