Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Size / Dimension | Mounting Type | Package / Case | Base Product Number | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Total RAM Bits | Number of I/O | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Flash Size | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Module/Board Type | Co-Processor | Connector Type | Controller Series |
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Microchip Technology PIC16F15275-E/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 16F | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 44-TQFP | PIC16F15275 | 44-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-PIC16F15275-E/PT | 3A991A2 | 8542.31.0001 | 160 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (14K x 8) | FLASH | - | 1K x 8 | 1.8V ~ 5.5V | A/D 28/2x10b | Internal | ||||||||||||||||||||||||
Microchip Technology PIC16F15276-I/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 16F | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-TQFP | PIC16F15276 | 44-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-PIC16F15276-I/PT | 3A991A2 | 8542.31.0001 | 160 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (28K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 5.5V | A/D 28/2x10b | Internal | ||||||||||||||||||||||||
Microchip Technology M2GL150TS-1FCV484M | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | IGLOO2 | Tray | Active | -55°C ~ 125°C (TJ) | Surface Mount | 484-BFBGA | Not Verified | 1.14V ~ 2.625V | 484-FBGA (19x19) | download | ROHS3 Compliant | REACH Unaffected | 150-M2GL150TS-1FCV484M | 3A001A2C | 8542.39.0001 | 84 | 5120000 | 248 | 146124 | ||||||||||||||||||||||||||||||||||
Microchip Technology PIC16F15274-I/P | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 16F | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 40-DIP (0.600", 15.24mm) | PIC16F15274 | 40-PDIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 150-PIC16F15274-I/P | 3A991A2 | 8542.31.0001 | 10 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 7KB (7K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 5.5V | A/D 28/2x10b | Internal | ||||||||||||||||||||||||
Microchip Technology MPF300TS-FCG784NI | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PolarFire™ | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 784-BBGA, FCBGA | Not Verified | 0.97V ~ 1.08V | 784-FCBGA (29x29) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 150-MPF300TS-FCG784NI | 5A992C | 8542.31.0001 | 1 | 21600666 | 388 | 300000 | |||||||||||||||||||||||||||||||||
Microchip Technology PIC16F15256-I/SP | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 16F | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | PIC16F15256 | 28-SPDIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 150-PIC16F15256-I/SP | 3A991A2 | 8542.31.0001 | 15 | 24 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (28K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 5.5V | A/D 17/2x10b | Internal | ||||||||||||||||||||||||
Microchip Technology PIC16F15276-I/P | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 16F | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 40-DIP (0.600", 15.24mm) | PIC16F15276 | 40-PDIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 150-PIC16F15276-I/P | 3A991A2 | 8542.31.0001 | 10 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 28KB (28K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 5.5V | A/D 28/2x10b | Internal | ||||||||||||||||||||||||
Microchip Technology DSPIC33CDV64MC106-H/M8 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tube | Active | DSPIC33CDV64 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-DSPIC33CDV64MC106-H/M8 | 40 | ||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology DSPIC33CDVL64MC106T-I/M8 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | DSPIC33CDVL64 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-DSPIC33CDVL64MC106T-I/M8TR | 3,300 | ||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics STSPIN32F0601Q | STMicroelectronics |
Min: 1 Mult: 1 |
/image/STMicroelectronics | STSPIN32F060x | Tray | Active | -40°C ~ 125°C (TJ) | Home & Industrial | Surface Mount | 72-VFQFN Exposed Pad | Not Verified | 9V ~ 20V | 72-QFN (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 497-STSPIN32F0601Q | 3A991A2 | 8542.39.0001 | 168 | 21 | ARM® Cortex®-M0 | FLASH (32kB) | 4K x 8 | I²C, SPI, UART/USART | STM32F031x6x7 | |||||||||||||||||||||||||||||
NXP USA Inc. LPC1111FHN33/103K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC1100XL | Bulk | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VQFN Exposed Pad | LPC1111 | 32-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A | 8542.31.0001 | 1,300 | 28 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 8KB (8K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 8x10b SAR | Internal | |||||||||||||||||||||||||
NXP USA Inc. LX2162RC82029B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ LX | Tray | Active | 5°C ~ 105°C (TA) | Surface Mount | 1150-FBGA | 1150-FBGA (23x23) | ROHS3 Compliant | REACH Unaffected | 60 | ARM® Cortex®-A72 | 2GHz | 16 Core, 64-Bit | - | DDR4, SDRAM | No | - | - | SATA 6Gbps (4) | USB 3.0 (1) | - | - | CANbus, I²C, PCIe, SPI, UART | ||||||||||||||||||||||||||||||
NXP USA Inc. LX2082RE82029B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ LX | Tray | Active | 5°C ~ 105°C (TA) | Surface Mount | 1150-FBGA | 1150-FBGA (23x23) | ROHS3 Compliant | REACH Unaffected | 60 | ARM® Cortex®-A72 | 2GHz | 8 Core, 64-Bit | - | DDR4, SDRAM | No | - | - | SATA 6Gbps (4) | USB 3.0 (1) | - | - | CANbus, I²C, PCIe, SPI, UART | ||||||||||||||||||||||||||||||
NXP USA Inc. LX2122RC82029B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ LX | Tray | Active | 5°C ~ 105°C (TA) | Surface Mount | 1150-FBGA | 1150-FBGA (23x23) | ROHS3 Compliant | REACH Unaffected | 60 | ARM® Cortex®-A72 | 2GHz | 12 Core, 64-Bit | - | DDR4, SDRAM | No | - | - | SATA 6Gbps (4) | USB 3.0 (1) | - | - | CANbus, I²C, PCIe, SPI, UART | ||||||||||||||||||||||||||||||
NXP USA Inc. LX2122RN82029B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ LX | Tray | Active | 5°C ~ 105°C (TA) | Surface Mount | 1150-FBGA | 1150-FBGA (23x23) | ROHS3 Compliant | REACH Unaffected | 60 | ARM® Cortex®-A72 | 2GHz | 12 Core, 64-Bit | - | DDR4, SDRAM | No | - | - | SATA 6Gbps (4) | USB 3.0 (1) | - | - | CANbus, I²C, PCIe, SPI, UART | ||||||||||||||||||||||||||||||
NXP USA Inc. LX2122RE82029B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ LX | Tray | Active | 5°C ~ 105°C (TA) | Surface Mount | 1150-FBGA | 1150-FBGA (23x23) | ROHS3 Compliant | REACH Unaffected | 60 | ARM® Cortex®-A72 | 2GHz | 12 Core, 64-Bit | - | DDR4, SDRAM | No | - | - | SATA 6Gbps (4) | USB 3.0 (1) | - | - | CANbus, I²C, PCIe, SPI, UART | ||||||||||||||||||||||||||||||
MYIR Tech Limited MYC-C3354-256N256D-80-I-GW | MYIR Tech Limited |
Min: 1 Mult: 1 |
/image/MYIR Tech Limited | AM335x | Box | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Vendor Undefined | Vendor Undefined | 3309-MYC-C3354-256N256D-80-I-GW | EAR99 | 8543.70.9990 | 1 | ARM® Cortex®-A8, AM3354 | 600MHz, 800MHz, 1GHz | 256KB | 256KB EPROM | MPU | - | 80 Pin | |||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX536AVP8C2R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX53 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 529-FBGA | MCIMX536 | 529-FBGA (19x19) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 750 | ARM® Cortex®-A8 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | DDR2, DDR3, LPDDR2 | Yes | Keypad, LCD | 10/100Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | 1.3V, 1.8V, 2.775V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 1-Wire, AC'97, CAN, I²C, I²S, MMC/SD, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||
Intel BOXDX2ODPR66 | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Box | Obsolete | Not applicable | Vendor Undefined | Vendor Undefined | 3277-BOXDX2ODPR66 | 3A991 | 8542.31.0000 | 1 | |||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics America Inc R7F100GLG2DFB#AA0 | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | R7F100G | 64-LFQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 54 | RL78 | 8/16-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 8K x 8 | 16K x 8 | 1.6V ~ 5.5V | A/D 12x12b; D/A 2x8b | Internal | |||||||||||||||||||||||||
Infineon Technologies F010074233-5999 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | - | Tray | Obsolete | F010074233 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 40 | ||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies B000074233 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | - | Tray | Obsolete | B000074233 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 40 | ||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies CY9EF226PMC-GS-ERE2-A401 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | - | Tape & Reel (TR) | Obsolete | CY9EF226 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 1,500 | ||||||||||||||||||||||||||||||||||||||||||||
Trenz Electronic GmbH 0729-02-62I63FA | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Discontinued at Digi-Key | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0729-02-62I63FA | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | ||||||||||||||||||||||||||||||||||
Trenz Electronic GmbH 0729-02-62I65FM | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Discontinued at Digi-Key | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0729-02-62I65FM | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | |||||||||||||||||||||||||||||||||||||
AMD SM-K26-XCL2GC-ED | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ Kria™ | Box | Active | 0°C ~ 85°C (TJ) | 3.030" L x 2.360" W (77.00mm x 60.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 122-SM-K26-XCL2GC-ED | EAR99 | 8471.50.0150 | 1 | ARM® Cortex®-A53 | 533MHz, 1.333GHz | 4GB | 16GB eMMC, 64MB QSPI | FPGA Core | Arm® Cortex®-R5F | 2 x 240 Pin | ||||||||||||||||||||||||||||||||||
Microchip Technology PIC32CM5164LS60064-I/5LX | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | PIC32CM5164 | ROHS3 Compliant | REACH Unaffected | 150-PIC32CM5164LS60064-I/5LX | 260 | |||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology PIC32CM2532LS60064T-I/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | PIC32CM2532 | ROHS3 Compliant | REACH Unaffected | 150-PIC32CM2532LS60064T-I/PTTR | 1,200 | |||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology PIC32CM5164LS60064-I/PT | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | PIC32CM5164 | ROHS3 Compliant | REACH Unaffected | 150-PIC32CM5164LS60064-I/PT | 160 | |||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology PIC32CM5164LS60048-I/U5B | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | PIC32CM5164 | ROHS3 Compliant | REACH Unaffected | 150-PIC32CM5164LS60048-I/U5B | 416 |
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