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System On Chip (SoC)(4272)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Microsemi Corporation A2F060M3E-TQ144I | Microsemi Corporation |
Min: 1 Mult: 1 |
/image/Microsemi Corporation | SmartFusion® | Tray | Obsolete | -40°C ~ 100°C (TJ) | 144-LQFP | A2F060M3E | 144-TQFP (20x20) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 21, FPGA - 33 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, I²C, SPI, UART/USART | DMA, POR, WDT | 16KB | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | ||
| Microchip Technology A2F500M3G-1FG484 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 484-BGA | A2F500 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 41, FPGA - 128 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||
| Microsemi Corporation A2F060M3E-1TQG144I | Microsemi Corporation |
Min: 1 Mult: 1 |
/image/Microsemi Corporation | SmartFusion® | Tray | Obsolete | -40°C ~ 100°C (TJ) | 144-LQFP | A2F060M3E | 144-TQFP (20x20) | download | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 21, FPGA - 33 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, I²C, SPI, UART/USART | DMA, POR, WDT | 16KB | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | |||
| Microchip Technology A2F200M3F-1FGG484I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | A2F200 | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 41, FPGA - 94 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 256KB | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | ||
| Microchip Technology A2F200M3F-FG484I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | A2F200 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | A2F200M3F-FG484IX23 | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 41, FPGA - 94 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 256KB | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | |
| Microchip Technology A2F200M3F-1FG484I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | A2F200 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 41, FPGA - 94 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 256KB | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | ||
| Microsemi Corporation A2F060M3E-TQG144 | Microsemi Corporation |
Min: 1 Mult: 1 |
/image/Microsemi Corporation | SmartFusion® | Tray | Obsolete | 0°C ~ 85°C (TJ) | 144-LQFP | A2F060M3E | 144-TQFP (20x20) | download | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 21, FPGA - 33 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, I²C, SPI, UART/USART | DMA, POR, WDT | 16KB | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | |||
| Microchip Technology A2F200M3F-PQ208 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Obsolete | 0°C ~ 85°C (TJ) | 208-BFQFP | A2F200 | 208-PQFP (28x28) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 24 | MCU, FPGA | MCU - 22, FPGA - 66 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 256KB | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | ||
| Microchip Technology A2F500M3G-PQ208I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Obsolete | -40°C ~ 100°C (TJ) | 208-BFQFP | A2F500M3G | 208-PQFP (28x28) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 2266-A2F500M3G-PQ208I | 3A991D | 8542.39.0001 | 24 | MCU, FPGA | MCU - 22, FPGA - 66 | ARM® Cortex®-M3 | 80MHz | Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | |
| Microchip Technology A2F500M3G-1PQG208I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | -40°C ~ 100°C (TJ) | 208-BFQFP | A2F500 | 208-PQFP (28x28) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 24 | MCU, FPGA | MCU - 22, FPGA - 66 | ARM® Cortex®-M3 | 100MHz | Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||
| Microchip Technology A2F200M3F-1PQG208I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | -40°C ~ 100°C (TJ) | 208-BFQFP | A2F200 | 208-PQFP (28x28) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 24 | MCU, FPGA | MCU - 22, FPGA - 66 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 256KB | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | ||
| Microchip Technology A2F200M3F-FGG256I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | -40°C ~ 100°C (TJ) | 256-LBGA | A2F200 | 256-FPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | MCU - 25, FPGA - 66 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 256KB | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | ||
| Microchip Technology A2F500M3G-FG256 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 256-LBGA | A2F500 | 256-FPBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | MCU - 25, FPGA - 66 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||
| Microsemi Corporation A2F060M3E-FG256 | Microsemi Corporation |
Min: 1 Mult: 1 |
/image/Microsemi Corporation | SmartFusion® | Tray | Obsolete | 0°C ~ 85°C (TJ) | 256-LBGA | A2F060M3E | 256-FPBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | MCU - 26, FPGA - 66 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, I²C, SPI, UART/USART | DMA, POR, WDT | 16KB | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | ||
| Microchip Technology A2F500M3G-1FG256I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | -40°C ~ 100°C (TJ) | 256-LBGA | A2F500M3G | 256-FPBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | MCU - 25, FPGA - 66 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||
| Microchip Technology A2F500M3G-1FG256 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 256-LBGA | A2F500 | 256-FPBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | MCU - 25, FPGA - 66 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||
| Microchip Technology A2F200M3F-1FG256I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | -40°C ~ 100°C (TJ) | 256-LBGA | A2F200 | 256-FPBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | MCU - 25, FPGA - 66 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 256KB | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | ||
 |
Microchip Technology A2F200M3F-CS288 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 288-TFBGA, CSPBGA | A2F200 | 288-CSP (11x11) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | MCU - 31, FPGA - 78 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 256KB | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | |
|
Microsemi Corporation A2F060M3E-1CS288 | Microsemi Corporation |
Min: 1 Mult: 1 |
/image/Microsemi Corporation | SmartFusion® | Tray | Obsolete | 0°C ~ 85°C (TJ) | 288-TFBGA, CSPBGA | A2F060M3E | 288-CSP (11x11) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | MCU - 28, FPGA - 68 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, I²C, SPI, UART/USART | DMA, POR, WDT | 16KB | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | |
|
Microchip Technology A2F500M3G-CSG288 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 288-TFBGA, CSPBGA | A2F500 | 288-CSP (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | MCU - 31, FPGA - 78 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | |
|
Microchip Technology A2F200M3F-CSG288I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | -40°C ~ 100°C (TJ) | 288-TFBGA, CSPBGA | A2F200 | 288-CSP (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 176 | MCU, FPGA | MCU - 31, FPGA - 78 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 256KB | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | |
| Microsemi Corporation A2F060M3E-1FG256 | Microsemi Corporation |
Min: 1 Mult: 1 |
/image/Microsemi Corporation | SmartFusion® | Tray | Obsolete | 0°C ~ 85°C (TJ) | 256-LBGA | A2F060M3E | 256-FPBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | MCU - 26, FPGA - 66 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, I²C, SPI, UART/USART | DMA, POR, WDT | 16KB | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | ||
| AMD XC7Z045-1FBG676CES | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq®-7000 | Tray | Obsolete | 0°C ~ 85°C (TJ) | 676-BBGA, FCBGA | XC7Z045 | 676-FCBGA (27x27) | download | 4 (72 Hours) | 122-1822 | 3A991D | 8542.39.0001 | 1 | MCU, FPGA | 130 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 667MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Kintex™-7 FPGA, 350K Logic Cells | |||
| Intel 5ASXMB5E4F31I3N | Intel |
Min: 1 Mult: 1 |
/image/Intel | Arria V SX | Tray | Obsolete | -40°C ~ 100°C (TJ) | 896-BBGA, FCBGA | 5ASXMB5 | 896-FBGA, FC (31x31) | download | RoHS Compliant | 3 (168 Hours) | 968333 | 3A001A7A | 8542.39.0001 | 27 | MCU, FPGA | MCU - 208, FPGA - 250 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 800MHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 462K Logic Elements | ||
| Intel 5CSEBA2U23I7 | Intel |
Min: 1 Mult: 1 |
/image/Intel | Cyclone® V SE | Tray | Active | -40°C ~ 100°C (TJ) | 672-FBGA | 5CSEBA2 | 672-UBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 965986 | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 181, FPGA - 145 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 800MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 25K Logic Elements | |
| Microchip Technology M2S050T-FGG896 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 896-BGA | M2S050 | 896-FBGA (31x31) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1100-1168 | 3A991D | 8542.39.0001 | 27 | MCU, FPGA | 377 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | |
| Microchip Technology M2S050-FGG896 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 896-BGA | M2S050 | 896-FBGA (31x31) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1100-1169 | 3A991D | 8542.39.0001 | 27 | MCU, FPGA | 377 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | |
| Microsemi Corporation M2S100T-1FC1152I | Microsemi Corporation |
Min: 1 Mult: 1 |
/image/Microsemi Corporation | SmartFusion®2 | Tray | Obsolete | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | M2S100T | 1152-FCBGA (35x35) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A7A | 8542.39.0001 | 24 | MCU, FPGA | 574 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 100K Logic Modules | ||
| Microsemi Corporation M2S100T-FC1152 | Microsemi Corporation |
Min: 1 Mult: 1 |
/image/Microsemi Corporation | SmartFusion®2 | Tray | Obsolete | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | M2S100T | 1152-FCBGA (35x35) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A7A | 8542.39.0001 | 24 | MCU, FPGA | 574 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 100K Logic Modules | ||
| Microchip Technology M2S150-1FC1152I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | M2S150 | 1152-FCBGA (35x35) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A7A | 8542.39.0001 | 24 | MCU, FPGA | 574 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules |
