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System On Chip (SoC)(4272)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Microchip Technology MPFS250TS-FCV484M | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PolarFire™ | Tray | Active | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | download | REACH Unaffected | 150-MPFS250TS-FCV484M | 1 | MPU, FPGA | MCU - 136, FPGA - 372 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128kB | FPGA - 254K Logic Modules | ||||||
| Microchip Technology MPFS250TL-FCG1152E | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PolarFire™ | Tray | Active | 0°C ~ 100°C | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-MPFS250TL-FCG1152E | 1 | MPU, FPGA | MCU - 136, FPGA - 372 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128kB | FPGA - 254K Logic Modules | |||
| Microchip Technology MPFS460T-1FCG1152IPP | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PolarFire™ | Tray | Active | -40°C ~ 100°C | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | download | REACH Unaffected | 150-MPFS460T-1FCG1152IPP | 1 | MPU, FPGA | MCU - 136, FPGA - 468 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 3.95MB | 128kB | FPGA - 461K Logic Modules | |||||
| Microchip Technology MPFS250TLS-FCVG484I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PolarFire™ | Tray | Active | -40°C ~ 100°C | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-MPFS250TLS-FCVG484I | 1 | MPU, FPGA | MCU - 136, FPGA - 372 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128kB | FPGA - 254K Logic Modules | |||
| Microchip Technology MPFS160TLS-FCSG536I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PolarFire™ | Tray | Active | -40°C ~ 100°C | 536-LFBGA, CSPBGA | 536-LFBGA | download | REACH Unaffected | 150-MPFS160TLS-FCSG536I | 1 | MPU, FPGA | MCU - 136, FPGA - 312 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 1.4125MB | 128kB | FPGA - 161K Logic Modules | |||||
| Microchip Technology MPFS250T-FCVG484EES | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PolarFire™ | Tray | Active | 0°C ~ 100°C | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | download | REACH Unaffected | 150-MPFS250T-FCVG484EES | 5A992C | 8542.31.0001 | 1 | MPU, FPGA | MCU - 136, FPGA - 372 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128kB | FPGA - 254K Logic Modules | |||
| Microchip Technology MPFS160TL-FCVG484I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PolarFire™ | Tray | Active | -40°C ~ 100°C | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | download | REACH Unaffected | 150-MPFS160TL-FCVG484I | 1 | MPU, FPGA | MCU - 136, FPGA - 312 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 1.4125MB | 128kB | FPGA - 161K Logic Modules | |||||
| Triscend TA7S04-60QC | Triscend |
Min: 1 Mult: 1 |
/image/Triscend | * | Bulk | Active | download | Vendor Undefined | Vendor Undefined | 2156-TA7S04-60QC-600237 | 1 | ||||||||||||||||
| Triscend TA7S20-60GC | Triscend |
Min: 1 Mult: 1 |
/image/Triscend | * | Bulk | Active | download | Vendor Undefined | Vendor Undefined | 2156-TA7S20-60GC-600237 | 1 | ||||||||||||||||
 |
Renesas UPD63F810GM(A)-8EV-A | Renesas |
Min: 1 Mult: 1 |
/image/Renesas | * | Bulk | Active | Vendor Undefined | REACH Unaffected | 2156-UPD63F810GM(A)-8EV-A-1833 | 1 | ||||||||||||||||
|
Broadcom Limited BCM47622A1KFEBG | Broadcom Limited |
Min: 1 Mult: 1 |
/image/Broadcom Limited | - | Tray | Active | - | - | - | 516-BCM47622A1KFEBG | 588 | MPU | - | ARM® Cortex®-A7 | 1.5GHz | Ethernet, I²C, PCIe, SPI, UART/USART, USB, Wifi | DDR3, DDR4, LED | - | - | - | ||||||
|
Broadcom Limited BCM53575B0KFSBG | Broadcom Limited |
Min: 1 Mult: 1 |
/image/Broadcom Limited | - | Tray | Active | - | - | - | 516-BCM53575B0KFSBG | 189 | MPU | - | ARM® Cortex®-A9, ARM® Cortex®-R5 | 1.25GHz | ACL, MAC, QSGMII | SERDES | - | - | - | ||||||
| Texas Instruments DRA829JMTGBALFR | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TJ) | 827-BFBGA, FCBGA | 827-FCBGA (24x24) | download | Not applicable | 1 (Unlimited) | 296-DRA829JMTGBALFRTR | 5A992C | 8542.31.0001 | 250 | DSP, MCU, MPU | 226 | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | 2GHz, 1GHz, 1.35GHz, 1GHz | I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB | DMA, PWM, WDT | 1.5MB | - | - | ||
|
Microchip Technology MPFS095TL-FCSG325I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Bulk | Active | -40°C ~ 100°C | 325-LFBGA | 325-LFBGA (11x14.5) | download | REACH Unaffected | 150-MPFS095TL-FCSG325I | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6kB | 128KB | FPGA - 93K Logic Modules | ||||
|
Microchip Technology MPFS095T-1FCSG325E | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Bulk | Active | 0°C ~ 100°C | 325-LFBGA | 325-LFBGA (11x14.5) | download | REACH Unaffected | 150-MPFS095T-1FCSG325E | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6kB | 128KB | FPGA - 93K Logic Modules | ||||
|
Microchip Technology MPFS095T-FCSG325E | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Bulk | Active | 0°C ~ 100°C | 325-LFBGA | 325-LFBGA (11x14.5) | download | REACH Unaffected | 150-MPFS095T-FCSG325E | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6kB | 128KB | FPGA - 93K Logic Modules | ||||
|
Microchip Technology MPFS095TLS-FCSG325I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Bulk | Active | -40°C ~ 100°C | 325-LFBGA | 325-LFBGA (11x14.5) | download | REACH Unaffected | 150-MPFS095TLS-FCSG325I | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6kB | 128KB | FPGA - 93K Logic Modules | ||||
|
Microchip Technology MPFS095TS-FCSG325I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Bulk | Active | -40°C ~ 100°C | 325-LFBGA | 325-LFBGA (11x14.5) | download | REACH Unaffected | 150-MPFS095TS-FCSG325I | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6kB | 128KB | FPGA - 93K Logic Modules | ||||
|
Broadcom Limited BCM47622LA1KFEBG | Broadcom Limited |
Min: 1 Mult: 1 |
/image/Broadcom Limited | - | Tray | Active | - | - | - | 516-BCM47622LA1KFEBG | 588 | MPU | - | ARM® Cortex®-A7 | 1.5GHz | Ethernet, I²C, PCIe, SPI, UART/USART, USB, Wifi | DDR3, DDR4, LED | - | - | - | ||||||
| AMD XCZU46DR-2FSVH1760I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU46DR-2FSVH1760I | 1 | MCU, FPGA | 574 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.333GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | ||||
| AMD XCVC1802-1LSIVIVA1596 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1802-1LSIVIVA1596 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.5M Logic Cells | ||
| AMD XCVM1802-2MLIVFVC1760 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1802-2MLIVFVC1760 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 1.9M Logic Cells | ||||
| AMD XCVC1802-2MLIVSVA2197 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1802-2MLIVSVA2197 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 770 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.5M Logic Cells | ||
| AMD XCVC1902-1LSEVSVA2197 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1902-1LSEVSVA2197 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 770 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.9M Logic Cells | ||
| AMD XCVC1902-2LLEVSVA2197 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1902-2LLEVSVA2197 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 770 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.9M Logic Cells | ||
| AMD XCZU43DR-2FFVE1156E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | 0°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU43DR-2FFVE1156E | 1 | MCU, FPGA | 366 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.333GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | ||||
| AMD XCVC1902-1MSIVSVD1760 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1902-1MSIVSVD1760 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 692 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.9M Logic Cells | ||
| AMD XCZU48DR-1FSVG1517E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | 0°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU48DR-1FSVG1517E | 1 | MCU, FPGA | 561 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | ||||
| AMD XCZU48DR-L1FFVE1156I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU48DR-L1FFVE1156I | 1 | MCU, FPGA | 366 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | ||||
| AMD XCZU42DR-L1FSVE1156I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU42DR-L1FSVE1156I | 1 | MCU, FPGA | 366 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells |
