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Circuit Protection
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Connectors, Interconnects
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RF/IF and RFID
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Sensors, Transducers
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Switches
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System On Chip (SoC)(4272)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
Intel AGFA019R31C3E4X | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGFA019R31C3E4X | 3 | |||||||||||||||||||
|
Intel AGFA023R31C3I3E | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGFA023R31C3I3E | 3 | |||||||||||||||||||
|
Intel AGFA023R31C2E2V | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGFA023R31C2E2V | 3 | |||||||||||||||||||
|
Intel AGIC035R39A2I3V | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGIC035R39A2I3V | 3 | |||||||||||||||||||
|
Intel AGFC019R31C2I2V | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGFC019R31C2I2V | 3 | |||||||||||||||||||
|
Intel AGFD023R31C3E4X | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGFD023R31C3E4X | 3 | |||||||||||||||||||
|
Intel AGFA023R31C3E3V | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGFA023R31C3E3V | 3 | |||||||||||||||||||
|
Intel AGFC019R31C2E3V | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGFC019R31C2E3V | 3 | |||||||||||||||||||
|
Intel AGFA023R31C2I2V | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGFA023R31C2I2V | 3 | |||||||||||||||||||
|
Intel AGFD019R31C2I3E | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGFD019R31C2I3E | 3 | |||||||||||||||||||
|
Intel AGIB019R31B2E3E | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGIB019R31B2E3E | 3 | |||||||||||||||||||
|
Intel AGID019R31B2E2V | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGID019R31B2E2V | 3 | |||||||||||||||||||
|
Intel AGFA019R31C2E4X | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGFA019R31C2E4X | 3 | |||||||||||||||||||
|
Intel AGIB027R31A1E2VB | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGIB027R31A1E2VB | 3 | |||||||||||||||||||
|
Intel AGIB019R31B2E3V | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGIB019R31B2E3V | 3 | |||||||||||||||||||
|
Intel AGFC019R31C2E3E | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGFC019R31C2E3E | 3 | |||||||||||||||||||
|
Intel AGIC035R39A2E3V | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGIC035R39A2E3V | 3 | |||||||||||||||||||
|
Intel AGIC040R39A1I2VB | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGIC040R39A1I2VB | 3 | |||||||||||||||||||
|
Intel AGID023R31B1E2V | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGID023R31B1E2V | 3 | |||||||||||||||||||
|
Intel AGID019R31B1E2V | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGID019R31B1E2V | 3 | |||||||||||||||||||
|
Intel AGIB019R18A1I2V | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGIB019R18A1I2V | 3 | |||||||||||||||||||
|
Intel AGFB014R24D2E3V | Intel |
Min: 1 Mult: 1 |
/image/Intel | * | Tray | Active | 544-AGFB014R24D2E3V | 3 | |||||||||||||||||||
| Microchip Technology A2F200M3F-1FGG256 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 256-LBGA | A2F200 | 256-FPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | MCU, FPGA | MCU - 25, FPGA - 66 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 256KB | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | ||
| Microchip Technology A2F200M3F-1PQG208 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 208-BFQFP | A2F200 | 208-PQFP (28x28) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | MCU, FPGA | MCU - 22, FPGA - 66 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 256KB | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | ||
| Microchip Technology A2F200M3F-FGG256 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 256-LBGA | A2F200 | 256-FPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | MCU, FPGA | MCU - 25, FPGA - 66 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 256KB | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | ||
| Microchip Technology A2F200M3F-PQG208 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 208-BFQFP | A2F200 | 208-PQFP (28x28) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | MCU, FPGA | MCU - 22, FPGA - 66 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 256KB | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | ||
| Microchip Technology A2F500M3G-1FGG256 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 256-LBGA | A2F500 | 256-FPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | MCU, FPGA | MCU - 25, FPGA - 66 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||
| Microchip Technology A2F500M3G-1FGG484 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 484-BGA | A2F500 | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 41, FPGA - 128 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||
| Microchip Technology A2F500M3G-FGG484 | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 484-BGA | A2F500 | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 41, FPGA - 128 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||
| Microchip Technology A2F500M3G-FG484I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SmartFusion® | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | A2F500 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 41, FPGA - 128 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
