Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Frequency | Technology | Current - Supply | Voltage - Input (Max) | Output Type | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | Other Names | ECCN | HTSUS | Standard Package | Function | Current - Output / Channel | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Clock Frequency | Number of Outputs | Memory Type | Memory Size | Access Time | Memory Format | Memory Organization | Memory Interface | Write Cycle Time - Word, Page | Internal Switch(s) | Topology | Frequency - Switching | Control Features | Output Configuration | Output Phases | Duty Cycle (Max) | Synchronous Rectifier | Clock Sync | Serial Interfaces | Current - Output | Dimming | Voltage - Output | Voltage - Output (Min/Fixed) | Voltage - Output (Max) | Voltage - Input (Min) |
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NXP USA Inc. S912ZVC96AVLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | ROHS3 Compliant | 568-S912ZVC96AVLF | 1,250 | 28 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 2K x 8 | 8K x 8 | 5.5V ~ 18V | A/D 10x10b SAR | External, Internal | ||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. S912ZVC64AMLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | ROHS3 Compliant | 568-S912ZVC64AMLFRTR | 2,000 | 28 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 1K x 8 | 4K x 8 | 5.5V ~ 18V | A/D 10x10b SAR | External, Internal | ||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. S912ZVCA19AMKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | 64-LQFP (10x10) | ROHS3 Compliant | 568-S912ZVCA19AMKH | 800 | 42 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 192KB (192K x 8) | FLASH | 2K x 8 | 12K x 8 | 5.5V ~ 18V | A/D 16x12b SAR; D/A 1x8b | External, Internal | ||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. S912ZVCA19AMLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | ROHS3 Compliant | 568-S912ZVCA19AMLFRTR | 2,000 | 28 | S12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, LVD, POR, PWM, WDT | 192KB (192K x 8) | FLASH | 2K x 8 | 12K x 8 | 5.5V ~ 18V | A/D 10x12b SAR; D/A 1x8b | External, Internal | ||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. FS32R294LAK0MJDT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32R | Tray | Active | - | Surface Mount | 269-LFBGA | 269-LFBGA (14x14) | ROHS3 Compliant | 568-FS32R294LAK0MJDT | 760 | 32-Bit 5-Core | - | 3MB (3M x 8) | SRAM | - | 2.5M x 8 | - | - | Internal | ||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC33FS6526CAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Automotive, System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | - | 48-HLQFP (7x7) | ROHS3 Compliant | 568-MC33FS6526CAER2TR | 2,000 | |||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. FH32K144UIT0VLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | ROHS3 Compliant | 568-FH32K144UIT0VLHRTR | 1,500 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5746CHK1ACKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 MPC57xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 176-LQFP Exposed Pad | 176-LQFP (24x24) | ROHS3 Compliant | 568-SPC5746CHK1ACKU6 | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SAI, SPI | DMA, I²S, LVD/HVD, POR, WDT | 3MB (3M x 8) | FLASH | 128K x 8 | 384K x 8 | 3.15V ~ 5.5V | A/D 68x10b, 31x12b SAR | Internal | ||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC35FS6516CAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | Automotive, System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | - | 48-HLQFP (7x7) | ROHS3 Compliant | 568-MC35FS6516CAE | 250 | |||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC33FS6526NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Automotive, System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | - | 48-HLQFP (7x7) | ROHS3 Compliant | 568-MC33FS6526NAER2TR | 2,000 | |||||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology Inc. M29F400FT5AN6E2 | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | Automotive, AEC-Q100 | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 48-TSOP | FLASH - NOR | 4.5V ~ 5.5V | 48-TSOP (12x20) | RoHS Compliant | 3277-M29F400FT5AN6E2 | 576 | Non-Volatile | 4Mbit | 55 ns | FLASH | 512K x 8, 256K x 16 | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||
Micron Technology Inc. JS28F128J3F75A | Micron Technology Inc. |
Min: 1 Mult: 1 |
/image/Micron Technology Inc. | StrataFlash™ | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 56-TSOP | FLASH - NOR | 2.7V ~ 3.6V | 56-TFSOP (0.724", 18.40mm Width) | RoHS Compliant | 3277-JS28F128J3F75A | 576 | Non-Volatile | 128Mbit | 75 ns | FLASH | 16M x 8, 8M x 16 | Parallel | 75ns | ||||||||||||||||||||||||||||||||||||||||||||
Rohm Semiconductor BR25H128FVT-5ACE2 | Rohm Semiconductor |
Min: 1 Mult: 1 |
/image/Rohm Semiconductor | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | EEPROM | 1.7V ~ 5.5V | 8-TSSOP-B | download | 3 (168 Hours) | 3,000 | 20 MHz | Non-Volatile | 128Kbit | EEPROM | 16K x 8 | SPI | 3.5ms | ||||||||||||||||||||||||||||||||||||||||||||
Rohm Semiconductor BD9E303UEFJ-LBE2 | Rohm Semiconductor |
Min: 1 Mult: 1 |
/image/Rohm Semiconductor | - | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) Exposed Pad | 36V | Adjustable | 8-HTSOP-J | 3 (168 Hours) | 2,500 | Step-Down | 1 | Buck | 300kHz | Positive | Yes | 3A | 1V | 28.8V | 7V | ||||||||||||||||||||||||||||||||||||||||||
Rohm Semiconductor BD2801MUV-E2 | Rohm Semiconductor |
Min: 1 Mult: 1 |
/image/Rohm Semiconductor | - | Tape & Reel (TR) | Active | 0°C ~ 70°C | General Purpose | Surface Mount | 16-VFQFN Exposed Pad | DC DC Controller | - | VQFN016V3030 | download | 3 (168 Hours) | 3,000 | 100mA | 3 | No | Switched Capacitor (Charge Pump) | - | 20V | ||||||||||||||||||||||||||||||||||||||||||||
Rohm Semiconductor BR25H640NUX-5ACTR | Rohm Semiconductor |
Min: 1 Mult: 1 |
/image/Rohm Semiconductor | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | EEPROM | 1.7V ~ 5.5V | VSON008X2030 | download | 3 (168 Hours) | 4,000 | 20 MHz | Non-Volatile | 64Kbit | EEPROM | 8K x 8 | SPI | 3.5ms | ||||||||||||||||||||||||||||||||||||||||||||
Rohm Semiconductor BD9036EFV-CE2 | Rohm Semiconductor |
Min: 1 Mult: 1 |
/image/Rohm Semiconductor | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | Transistor Driver | download | 3 (168 Hours) | EAR99 | 8542.39.0001 | 2,000 | Step-Up/Step-Down | 1 | Buck-Boost | 100kHz ~ 600kHz | Frequency Control, Power Good, Soft Start | Positive | 1 | 92% | Yes | Yes | - | |||||||||||||||||||||||||||||||||||||||||
Analog Devices Inc./Maxim Integrated MAX15106AGWP+ | Analog Devices Inc./Maxim Integrated |
Min: 1 Mult: 1 |
/image/Analog Devices Inc./Maxim Integrated | * | Tube | Active | Surface Mount | 20-WFBGA, WLCSP | 20-WLP | ROHS3 Compliant | 1 (Unlimited) | 175-MAX15106AGWP+ | 10 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba Semiconductor and Storage TCR1HF50B,LM(CT | Toshiba Semiconductor and Storage |
Min: 1 Mult: 1 |
/image/Toshiba Semiconductor and Storage | * | Tape & Reel (TR) | Active | 3,000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology ATSAML11D14A-YUTKPH | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | * | Tape & Reel (TR) | Active | ROHS3 Compliant | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology ATSAML11E14A-AUKPH | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | * | Tray | Active | ROHS3 Compliant | 150-ATSAML11E14A-AUKPH | 1 |
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