Samsung Announces Launch of First GAA Process Advanced Packaging in 2025

On July 6th, Samsung Electronics announced its plans to introduce the first Gate-All-Around (GAA) process advanced packaging technology in 2025. This breakthrough technology will further enhance Samsung's competitiveness in the semiconductor industry and pave the way for new possibilities in the development of high-performance electronic devices.

The GAA process is an emerging integrated circuit manufacturing technology that involves transitioning the gate of transistors from the traditional planar structure to a gate-all-around configuration. This design improvement significantly boosts chip performance, reduces power consumption, and enables a more compact chip design. By adopting the GAA process, Samsung will be able to produce higher-performance and higher-density semiconductor chips to meet the growing market demand.

Samsung's GAA process packaging technology introduces a full gate-all-around design during the packaging process, providing better heat dissipation and electrical characteristics for the chips. This technology will greatly enhance chip stability and reliability while reducing power consumption. Moreover, the full gate-all-around design allows Samsung to manufacture smaller-sized chips, offering greater space for innovative applications in mobile devices, IoT, and artificial intelligence.

"We are proud to announce that Samsung will be introducing advanced packaging technology based on the GAA process in 2025," said the Senior Vice President and Head of Samsung's Semiconductor Business. "This breakthrough will accelerate the development of the semiconductor industry and provide our customers with higher-performance and more reliable solutions. We remain committed to meeting evolving market demands through continuous innovation and contributing to the future of technology."

Samsung Electronics has invested significant resources and research efforts in the development of GAA process technology, collaborating closely with global partners to expedite the commercialization of the technology. The company plans to initially apply this technology to its range of semiconductor products in 2025 and gradually expand its presence in broader markets.

This announcement by Samsung Electronics has garnered widespread attention in the industry, with many experts regarding it as a significant milestone in the transition to the next generation of semiconductor technology. With the commercial launch of GAA process technology, Samsung is poised to further solidify its leading position in the global semiconductor market and pave the way for future technological advancements.