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ALLCHIPS ELECTRONICS LIMITED

ISSI, Integrated Silicon Solution Inc IS61WV6416EEBLL-8TLI

IS61WV6416EEBLL-8TLI


  • Manufacturer: ISSI, Integrated Silicon Solution Inc
  • Origchip NO: IS61WV6416EEBLL-8TLI
  • Package: 44-TSOP (0.400", 10.16mm Width)
  • Datasheet: pdfPDF
  • Stock: 6863
  • Description: IS61WV6416EEBLL-8TLI(Kg)

Quantity:

Qty

Unit Price

Ext Price

  • 405

    $2.33

    $941.83

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In Stock

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Means of Payment

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RFQ (Request for Quotations)

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Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr ISSI, Integrated Silicon Solution Inc
Series -
Package Bulk
Product Status Active
Memory Type Volatile
Memory Format SRAM
Technology SRAM - Asynchronous
Memory Size 1Mbit
Memory Organization 64K x 16
Memory Interface Parallel
Write Cycle Time - Word, Page 8ns
Access Time 8 ns
Voltage - Supply 2.4V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 44-TSOP (0.400", 10.16mm Width)
Supplier Device Package 44-TSOP II
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Other Names 706-IS61WV6416EEBLL-8TLI
Standard Package 135
SRAM - Asynchronous Memory IC 1Mbit Parallel 8 ns 44-TSOP II

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