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ALLCHIPS ELECTRONICS LIMITED

Texas Instruments OMAPL137BZKB3

OMAPL137BZKB3


  • Manufacturer: Texas Instruments
  • Origchip NO: OMAPL137BZKB3
  • Package: 256-BGA
  • Datasheet: pdfPDF
  • Stock: 3567
  • Description: OMAPL137BZKB3(Kg)

Quantity:

In Stock

Please send RFQ , we will respond immediately.

Purchase & Inquiry

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Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr Texas Instruments
Series OMAP-L1x
Package Tray
Product Status Obsolete
Core Processor ARM926EJ-S
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 375MHz
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
RAM Controllers SDRAM
Graphics Acceleration No
Display & Interface Controllers LCD
Ethernet 10/100Mbps (1)
SATA -
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O 1.8V, 3.3V
Operating Temperature 0°C ~ 90°C (TJ)
Security Features -
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-BGA (17x17)
Additional Interfaces HPI, I²C, McASP, MMC/SD, SPI, UART
Base Product Number OMAPL137
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 90
ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 256-BGA (17x17)

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