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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Mounting Type | Package / Case | Base Product Number | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Total RAM Bits | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Flash Size | Primary Attributes | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Microchip Technology PIC18F24Q10-E/STX | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 18F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-VFQFN Exposed Pad | PIC18F24 | 28-VQFN (4x4) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-PIC18F24Q10-E/STX | 3A991A2 | 8542.31.0001 | 91 | 25 | PIC | 8-Bit | 64MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 256 x 8 | 1K x 8 | 1.8V ~ 5.5V | A/D 24x10b SAR; D/A 1x5b | Internal | ||||||||||||||
| Microchip Technology PIC16F18025-I/P | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 16F | Tube | Active | -40°C ~ 85°C (TA) | Through Hole | 14-DIP (0.300", 7.62mm) | PIC16F18025 | 14-PDIP | ROHS3 Compliant | Not Applicable | REACH Unaffected | 150-PIC16F18025-I/P | 3A991A2 | 8542.31.0001 | 30 | 12 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (14K x 8) | FLASH | 128 x 8 | 1K x 8 | 1.8V ~ 5.5V | A/D 11x10b SAR; D/A 1x8b | External, Internal | ||||||||||||||
| Microchip Technology ATSAM4CMP16CC-AUTR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM4CM | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-TQFP | ATSAM4CM | 100-TQFP (14x14) | REACH Unaffected | 150-ATSAM4CMP16CC-AUTR | 1,000 | 52 | ARM® Cortex®-M4F | 32-Bit | 120MHz | EBI/EMI, I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.62V ~ 3.6V | A/D 6x10b SAR | Internal | ||||||||||||||||||
| Microchip Technology PIC16F18045-I/SS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | PIC16F18045 | 20-SSOP | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | 150-PIC16F18045-I/SS | 3A991A2 | 8542.31.0001 | 67 | 18 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (14K x 8) | FLASH | 128 x 8 | 1K x 8 | 1.8V ~ 5.5V | A/D 17x10b SAR; D/A 1x8b | External, Internal | ||||||||||||||
| Microchip Technology PIC16F18015-I/SN | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | PIC16F18015 | 8-SOIC | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-PIC16F18015-I/SN | 3A991A2 | 8542.31.0001 | 100 | 6 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (14K x 8) | FLASH | 128 x 8 | 1K x 8 | 1.8V ~ 5.5V | A/D 5x10b SAR; D/A 1x8b | External, Internal | ||||||||||||||
 |
Microchip Technology M2S025T-1FCSG158I | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tray | Active | -40°C ~ 100°C (TJ) | 158-BGA, FCBGA | 158-FCBGA | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-M2S025T-1FCSG158I | 260 | MCU, FPGA | - | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 25K Logic Modules | |||||||||||||||||||||
|
NXP USA Inc. S9S12KG25J2MPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | S9S12 | REACH Unaffected | OBSOLETE | 1 | ||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MAC7241VAF64R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | MAC72 | REACH Unaffected | OBSOLETE | 1 | ||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MAC7116VAG50R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | MAC71 | REACH Unaffected | OBSOLETE | 1 | ||||||||||||||||||||||||||||||||||
|
NXP USA Inc. S912D60AE0CPVE8R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | S912 | REACH Unaffected | OBSOLETE | 1 | ||||||||||||||||||||||||||||||||||
|
NXP USA Inc. S912D60AE0CPVE8 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | S912 | REACH Unaffected | OBSOLETE | 1 | ||||||||||||||||||||||||||||||||||
|
Renesas Electronics America Inc UPD70F3522GJA-GAE-G | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | V850E2/Dx4 | Bulk | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | UPD70F3522 | 144-LQFP (20x20) | download | REACH Unaffected | 559-UPD70F3522GJA-GAE-G | OBSOLETE | 1 | 105 | V850E2M | 32-Bit | 80MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB | DMA, I²S, LCD, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 32K x 8 | 24K x 8 | 2.7V ~ 5.5V | A/D 16x10/12b | Internal | |||||||||||||||
|
Renesas Electronics America Inc UPD70F3526GJA9-V01-GBG-Q-G | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | V850E2/Dx4 | Bulk | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | UPD70F3526 | 144-LQFP (20x20) | download | REACH Unaffected | 559-UPD70F3526GJA9-V01-GBG-Q-G | OBSOLETE | 1 | 105 | V850E2M | 32-Bit | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB | DMA, I²S, LCD, LVD, POR, PWM, WDT | 3MB (3M x 8) | FLASH | 32K x 8 | 256K x 8 | 2.7V ~ 5.5V | A/D 16x10/12b | Internal | |||||||||||||||
|
Renesas Electronics America Inc UPD70F3558M2GM-GBK-AX | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | V850E2/Fx4 | Bulk | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 176-LQFP Exposed Pad | UPD70F3558 | 176-HLQFP (24x24) | REACH Unaffected | 559-UPD70F3558M2GM-GBK-AX | OBSOLETE | 1 | 137 | V850E2M | 32-Bit | 80MHz | CANbus, CSI, I²C, LINbus, UART/USART | DMA, POR, PWM, WDT | 2MB (2M x 8) | FLASH | 64K x 8 | 144K x 8 | 3V ~ 5.5V | A/D 40x12b | Internal | ||||||||||||||||
|
Beacon EmbeddedWorks SOMIMX8MMQ-11-2AE4SMCR | Beacon EmbeddedWorks |
Min: 1 Mult: 1 |
/image/Beacon EmbeddedWorks | i.MX 8M | Bulk | Active | 0°C ~ 70°C | 1.100" L x 1.500" W (28.00mm x 38.00mm) | download | 460-SOMIMX8MMQ-11-2AE4SMCR | 1 | ARM® Cortex™-A53, ARM® Cortex™-M4 | 1.8GHz, 400MHz | 2GB | - | MCU Core | - | USB | ||||||||||||||||||||||||||
| Microchip Technology PIC16F18025-I/ST | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | PIC16F18025 | 14-TSSOP | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-PIC16F18025-I/ST | 3A991A2 | 8542.31.0001 | 96 | 12 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (14K x 8) | FLASH | 128 x 8 | 1K x 8 | 1.8V ~ 5.5V | A/D 11x10b SAR; D/A 1x8b | External, Internal | ||||||||||||||
| Microchip Technology PIC16F18025-I/SL | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | PIC16F18025 | 14-SOIC | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-PIC16F18025-I/SL | 3A991A2 | 8542.31.0001 | 57 | 12 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14KB (14K x 8) | FLASH | 128 x 8 | 1K x 8 | 1.8V ~ 5.5V | A/D 11x10b SAR; D/A 1x8b | External, Internal | ||||||||||||||
| AMD XCVM1302-1LLINSVF1369 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-1LLINSVF1369 | 1 | MPU, FPGA | 316 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | ||||||||||||||||||||||
| AMD XCAU10P-1UBVA368E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Artix® UltraScale+ | Tray | Active | 0°C ~ 100°C (TJ) | Surface Mount | 368-WFBGA, FCBGA | Not Verified | 0.825V ~ 0.876V | 368-FCBGA (10.5x10.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCAU10P-1UBVA368E | EAR99 | 8542.39.0001 | 1 | 3670016 | 128 | 5500 | 96250 | ||||||||||||||||||||||
| AMD XCVM1402-1MSINBVB1024 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1024-BFBGA | 1024-BGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-1MSINBVB1024 | 1 | MPU, FPGA | 424 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells | ||||||||||||||||||||||
| AMD XCVM1402-2HSINSVF1369 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-2HSINSVF1369 | 1 | MPU, FPGA | 424 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 800MHz, 1.65GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells | ||||||||||||||||||||||
| AMD XCVM1802-2HSIVSVA2197 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1802-2HSIVSVA2197 | 1 | MPU, FPGA | 770 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 800MHz, 1.65GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 1.9M Logic Cells | ||||||||||||||||||||||
| AMD XCVM1302-1MSIVSVD1760 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-1MSIVSVD1760 | 1 | MPU, FPGA | 402 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | ||||||||||||||||||||||
| AMD XCVE1752-1LLIVSVA1596 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | 1596-BFBGA | 1596-BGA (37.5x37.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVE1752-1LLIVSVA1596 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ AI Core FPGA, 1M Logic Cells | ||||||||||||||||||||
| AMD XCVM1402-1MLINSVF1369 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-1MLINSVF1369 | 1 | MPU, FPGA | 424 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells | ||||||||||||||||||||||
| AMD XCAU10P-L1UBVA368I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Artix® UltraScale+ | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 368-WFBGA, FCBGA | Not Verified | 0.698V ~ 0.742V | 368-FCBGA (10.5x10.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCAU10P-L1UBVA368I | EAR99 | 8542.39.0001 | 1 | 3670016 | 128 | 5500 | 96250 | ||||||||||||||||||||||
| AMD XCAU10P-2SBVB484E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Artix® UltraScale+ | Tray | Active | 0°C ~ 100°C (TJ) | Surface Mount | 484-WFBGA, FCBGA | Not Verified | 0.825V ~ 0.876V | 484-FCBGA (19x19) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCAU10P-2SBVB484E | EAR99 | 8542.39.0001 | 1 | 3670016 | 204 | 5500 | 96250 | ||||||||||||||||||||||
| AMD XCAU15P-1FFVB676I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Artix® UltraScale+ | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 676-BBGA, FCBGA | Not Verified | 0.698V ~ 0.742V | 676-FCBGA (27x27) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCAU15P-1FFVB676I | 3A991D | 8542.39.0001 | 1 | 5347738 | 228 | 9720 | 170100 | ||||||||||||||||||||||
| AMD XCVM1302-1MLIVSVD1760 | AMD |
Min: 1 Mult: 1 |
/image/AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-1MLIVSVD1760 | 1 | MPU, FPGA | 402 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | ||||||||||||||||||||||
|
AMD XA7K160T-1FFG676Q | AMD |
Min: 1 Mult: 1 |
/image/AMD | Kintex®-7 | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 676-BBGA, FCBGA | Not Verified | 0.97V ~ 1.03V | 676-FCBGA (27x27) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XA7K160T-1FFG676Q | 3A991D | 8542.39.0001 | 1 | 11980800 | 400 | 12675 | 162240 |
