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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Total RAM Bits | Number of I/O | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Controller Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
Trenz Electronic GmbH 0712-03-82C36-A | Trenz Electronic GmbH |
Min: 1 Mult: 1 |
/image/Trenz Electronic GmbH | - | Bulk | Active | download | 1686-TE0712-03-82C36-A | 1 | ||||||||||||||||||||||||||||||||||||||||
| Texas Instruments AM6421BSFGHAALV | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | Sitara™ | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 441-BFBGA, FCBGA | 441-FCBGA (17.2x17.2) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 296-AM6421BSFGHAALV | 5A992C | 8542.31.0001 | 84 | ARM® Cortex®-A53, ARM® Cortex®-M5F, ARM® Cortex®-R5F | 1GHz, 400MHz, 800MHz | 4 Core, 64-Bit | Multimedia; NEON™ SIMD | DDR4, LPDDR4 | No | - | 10/100 Mbps (2), 10/100/1000 Mbps (2) | - | USB 3.1 (1) | 1.1V, 1.2V, 1.8V, 3.3V | 3DES, AES, Cryptography, DES, MD5, SHA-1/2, Secure Boot | CANbus, GPIO, I²C, QSPI, PCI, SPI, UART | |||||||||||||||||||
| Texas Instruments AM6422BSDGHAALV | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | Sitara™ | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 441-BFBGA, FCBGA | 441-FCBGA (17.2x17.2) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 296-AM6422BSDGHAALV | 5A992C | 8542.31.0001 | 84 | ARM® Cortex®-A53, ARM® Cortex®-M5F, ARM® Cortex®-R5F | 1GHz, 400MHz, 800MHz | 5 Core, 64-Bit | Multimedia; NEON™ SIMD | DDR4, LPDDR4 | No | - | 10/100 Mbps (2), 10/100/1000 Mbps (2) | - | USB 3.1 (1) | 1.1V, 1.2V, 1.8V, 3.3V | 3DES, AES, Cryptography, DES, MD5, SHA-1/2, Secure Boot | CANbus, GPIO, I²C, QSPI, PCI, SPI, UART | |||||||||||||||||||
| Texas Instruments AM2432BSFFHIALV | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | Sitara™ | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 441-BFBGA, FCBGA | 441-FCBGA (17.2x17.2) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 296-AM2432BSFFHIALV | 5A992C | 8542.31.0001 | 84 | 198 | ARM® Cortex®-M4F, ARM® Cortex®-R5F | 32-Bit Quad-Core | 400MHz, 800MHz | CANbus, Ethernet, I²C, MMC/SDIO, QSPI, SPI, UART/USART, USB | AES, DMA, POR, PWM, SHA, WDT | 256KB (256K x 8) | Tightly Coupled Memory (TCM) | - | 256K x 8 | 1.71V ~ 1.89V, 3.135V ~ 3.465V | A/D 8x12b | External, Internal | |||||||||||||||||||
| Texas Instruments AM6442BSEFHAALV | Texas Instruments |
Min: 1 Mult: 1 |
/image/Texas Instruments | Sitara™ | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 441-BFBGA, FCBGA | 441-FCBGA (17.2x17.2) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 296-AM6442BSEFHAALV | 5A992C | 8542.31.0001 | 84 | ARM® Cortex®-A53, ARM® Cortex®-M5F, ARM® Cortex®-R5F | 1GHz, 400MHz, 800MHz | 7 Core, 64-Bit | Multimedia; NEON™ SIMD | DDR4, LPDDR4 | No | - | 10/100 Mbps (2), 10/100/1000 Mbps (2) | - | USB 3.1 (1) | 1.1V, 1.2V, 1.8V, 3.3V | 3DES, AES, Cryptography, DES, MD5, SHA-1/2, Secure Boot | CANbus, GPIO, I²C, QSPI, PCI, SPI, UART | |||||||||||||||||||
|
Microchip Technology PIC24EP256MC202T-H/SS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, PIC® 24EP | Bulk | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP | 150-PIC24EP256MC202T-H/SS | OBSOLETE | 1 | 21 | PIC | 16-Bit | 40 MIPs | I²C, IrDA, LINbus, QEI, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | 256KB (85.5K x 24) | FLASH | - | 32K x 8 | 3V ~ 3.6V | A/D 6x10/12b SAR | External, Internal | |||||||||||||||||||||||
|
Microchip Technology PIC24EP256MC202T-H/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, PIC® 24EP | Bulk | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC | 150-PIC24EP256MC202T-H/SO | OBSOLETE | 1 | 21 | PIC | 16-Bit | 40 MIPs | I²C, IrDA, LINbus, QEI, SPI, UART/USART | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | 256KB (85.5K x 24) | FLASH | - | 32K x 8 | 3V ~ 3.6V | A/D 6x10/12b SAR | External, Internal | |||||||||||||||||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C17M31F001100 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -40°C ~ 85°C | Surface Mount | 48-TQFP | 48-TQFP12 (7x7) | download | 502-S1C17M31F001100 | 250 | 37 | S1C17 | 16-Bit | 17.12MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT | 48KB (48K x 8) | FLASH | - | 4K x 8 | 1.8V ~ 5.5V | A/D 3x12b SAR | External, Internal | |||||||||||||||||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C17M23F001100-490 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-SQFN4 (4x4) | download | 502-S1C17M23F001100-490 | 490 | S1C17 | 16-Bit | 21MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 5.5V | A/D 12b SAR | External, Internal | ||||||||||||||||||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C17M33F001100-119 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -40°C ~ 85°C | Surface Mount | 80-TQFP | 80-TQFP14 (12x12) | download | 502-S1C17M33F001100-119 | 119 | 65 | S1C17 | 16-Bit | 17.12MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT | 96KB (96K x 8) | FLASH | - | 4K x 8 | 1.8V ~ 5.5V | A/D 6x12b SAR | External, Internal | |||||||||||||||||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C17M20F001100 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-SQFN4 (4x4) | download | 502-S1C17M20F001100 | 490 | S1C17 | 16-Bit | 21MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 5.5V | A/D 12b SAR | External, Internal | ||||||||||||||||||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C17M23F002100-490 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-SQFN5 (5x5) | download | 502-S1C17M23F002100-490 | 490 | S1C17 | 16-Bit | 21MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 5.5V | A/D 12b SAR | External, Internal | ||||||||||||||||||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C31D01F101000 -119 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -40°C ~ 85°C | Surface Mount | 80-TQFP | 80-TQFP14 (12x12) | download | 502-S1C31D01F101000-119 | 119 | 57 | ARM® Cortex®-M0+ | 32-Bit | 21MHz | I²C, IrDA, QSPI, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT | 256KB (256K x 8) | FLASH | - | 96K x 8 | 1.8V ~ 5.5V | A/D 8x12b SAR | External, Internal | |||||||||||||||||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C17M21F001100 -250 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP15 (7x7) | download | 502-S1C17M21F001100-250 | 250 | 23 | S1C17 | 16-Bit | 21MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 5.5V | A/D 6x12b SAR | External, Internal | |||||||||||||||||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C17M31F001100-250 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -40°C ~ 85°C | Surface Mount | 48-TQFP | 48-TQFP12 (7x7) | download | 502-S1C17M31F001100-250 | 250 | 37 | S1C17 | 16-Bit | 17.12MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT | 48KB (48K x 8) | FLASH | - | 4K x 8 | 1.8V ~ 5.5V | A/D 3x12b SAR | External, Internal | |||||||||||||||||||||||
|
Epson Electronics America Inc-Semiconductor Div S1C17M20F002100-490 | Epson Electronics America Inc-Semiconductor Div |
Min: 1 Mult: 1 |
/image/Epson Electronics America Inc-Semiconductor Div | - | Tray | Active | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-SQFN5 (5x5) | download | 502-S1C17M20F002100-490 | 490 | S1C17 | 16-Bit | 21MHz | I²C, IrDA, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 5.5V | A/D 12b SAR | External, Internal | ||||||||||||||||||||||||
|
Infineon Technologies CY8C4747LQS-S453 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | Automotive, AEC-Q100, PSOC® CY8C4700S | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | download | ROHS3 Compliant | 3 (168 Hours) | 490 | 34 | ARM® Cortex®-M0+ | 32-Bit | 48MHz | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, CapSense, DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 8K x 8 | 1.71V ~ 5.5V | A/D 16x10b, 16x12b SAR; D/A 2x7b | External, Internal | ||||||||||||||||||||||
|
Infineon Technologies CYT2CL7BAAQ0AZSGS | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | Traveo™ T2G | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | 60 | 96 | ARM® Cortex®-M0+, ARM® Cortex®-M4F | 32-Bit Dual-Core | 100MHz, 160MHz | CANbus, FIFO, I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, Crypto - AES, DMA, LCD, LVD, POR, PWM, SHA, TRNG, WDT | 4.063MB (4.063M x 8) | FLASH | 128K x 8 | 512K x 8 | 2.7V ~ 5.5V | A/D 48x12b SAR | External, Internal | ||||||||||||||||||||||
| Microchip Technology AVR64DD14-I/SL | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | AVR® DD | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-AVR64DD14-I/SL | 3A001A2A | 8542.31.0001 | 57 | 10 | AVR | 8-Bit | 24MHz | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 8K x 8 | 1.8V ~ 5.5V | A/D 7x12b SAR; D/A 1x10b | External, Internal | |||||||||||||||||||
|
Microchip Technology PIC32CX1025SG41100T-E/E5X | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | - | Tape & Reel (TR) | Active | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,000 | |||||||||||||||||||||||||||||||||||||||
| Microchip Technology CEC1736-S0-I/2ZW-PROTO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | CryptoController™ | Tray | Active | -40°C ~ 85°C (TA) | Real Time Platform Root | Surface Mount | 84-WFBGA | Not Verified | 3.135V ~ 3.465V | 84-WFBGA (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-CEC1736-S0-I/2ZW-PROTO | 5A992C | 8542.31.0001 | 260 | 71 | ARM® Cortex®-M4F | - | 384K x 8 | I²C, PWM, SMBus, SPI, UART | CEC173X | ||||||||||||||||||||||||
| Infineon Technologies CY8C4149AZI-S598 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | PSOC® 4 CY8C4100S | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 84 | ARM® Cortex®-M0+ | 32-Bit | 48MHz | CANbus, FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, LCD, POR, PWM, SHA, Temp Sensor, TRNG, WDT | 384KB (384K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 5.5V | A/D 16x12b SAR | External, Internal | ||||||||||||||||||||
|
NXP USA Inc. MIMXRT117HCVM8A | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1170 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 289-LFBGA | 289-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-MIMXRT117HCVM8A | 760 | 13 | ARM® Cortex®-M4, Cortex®-M7 | 32-Bit Dual-Core | 400MHz, 800MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT | 256KB (256K x 8) | ROM | - | 2M x 8 | 1.1V ~ 1.15V | A/D 20x12b SAR; D/A 1x12b | Internal | ||||||||||||||||||||
| Infineon Technologies XMC7200D-F176K8384AA | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | XMC7000 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | 176-TEQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C SC | 8542.31.0001 | 40 | 148 | ARM® Cortex®-M0+, ARM® Cortex®-M7 | 32-Bit Dual-Core | 100MHz, 350MHz | CANbus, Ethernet, FIFO, I²C, IrDA, MMC/SD/SDIO, SPI, UART/USART | Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT | 8.188MB (8.188M x 8) | FLASH | 256K x 8 | 1M x 8 | 2.7V ~ 5.5V | A/D 81x12b SAR | External, Internal | ||||||||||||||||||||
|
Infineon Technologies XMC7100D-F100K4160AA | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | XMC7000 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LQFP Exposed Pad | 100-TEQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 90 | 72 | ARM® Cortex®-M0+, ARM® Cortex®-M7 | 32-Bit Dual-Core | 100MHz, 250MHz | CANbus, Ethernet, FIFO, I²C, IrDA, MMC/SD/SDIO, SPI, UART/USART | Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT | 4.063MB (4.063M x 8) | FLASH | 256K x 8 | 768K x 8 | 2.7V ~ 5.5V | A/D 37x12b SAR | External, Internal | |||||||||||||||||||||
| Infineon Technologies XMC7100D-F144K4160AA | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | XMC7000 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP Exposed Pad | 144-TEQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 60 | 116 | ARM® Cortex®-M0+, ARM® Cortex®-M7 | 32-Bit Dual-Core | 100MHz, 250MHz | CANbus, Ethernet, FIFO, I²C, IrDA, MMC/SD/SDIO, SPI, UART/USART | Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT | 4.063MB (4.063M x 8) | FLASH | 256K x 8 | 768K x 8 | 2.7V ~ 5.5V | A/D 52x12b SAR | External, Internal | ||||||||||||||||||||||
|
Microchip Technology RT4G150-CGG1657PROTO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | RTG4™ | Bulk | Active | -55°C ~ 125°C (TJ) | Through Hole | 1657-BFCPGA | Not Verified | 1.14V ~ 1.26V | 1657-CCGA (42.5x42.5) | REACH Unaffected | 150-RT4G150-CGG1657PROTO | 1 | 5325 | 151824 | ||||||||||||||||||||||||||||||||
|
Microchip Technology RT4G150-CGG1657B | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | RTG4™ | Bulk | Active | -55°C ~ 125°C (TJ) | Through Hole | 1657-BFCPGA | Not Verified | 1.14V ~ 1.26V | 1657-CCGA (42.5x42.5) | REACH Unaffected | 150-RT4G150-CGG1657B | 1 | 5325 | 151824 | ||||||||||||||||||||||||||||||||
|
Microchip Technology RT4G150L-CGG1657R | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | RTG4™ | Bulk | Active | -55°C ~ 125°C (TJ) | Through Hole | 1657-BFCPGA | Not Verified | 1.14V ~ 1.26V | 1657-CCGA (42.5x42.5) | REACH Unaffected | 150-RT4G150L-CGG1657R | 1 | 5325 | 151824 | ||||||||||||||||||||||||||||||||
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Microchip Technology RT4G150L-LGG1657E | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | RTG4™ | Bulk | Active | -55°C ~ 125°C (TJ) | Surface Mount | 1657-BCLGA | Not Verified | 1.14V ~ 1.26V | 1657-CLGA (42.5x42.5) | REACH Unaffected | 150-RT4G150L-LGG1657E | 1 | 5325 | 151824 |
