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AMD XCVC1902-2HSIVSVA2197
XCVC1902-2HSIVSVA2197
- Manufacturer: AMD
- Origchip NO: XCVC1902-2HSIVSVA2197
- Package: 2197-BFBGA, FCBGA
- Datasheet:
PDF - Stock: 6036
- Description: XCVC1902-2HSIVSVA2197(Kg)
Quantity:
In Stock
Please send RFQ , we will respond immediately.
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Shipping Cost
Shipping starts at $40, but some countries will exceed $40. For
example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time
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Currently, our products are shipped through DHL, FedEx, SF, and UPS.
Delivery TimeOnce the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.| Parameters | |
|---|---|
| Mfr | AMD |
| Series | Versal™ AI Core |
| Package | Tray |
| Product Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz, 1.65GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1.9M Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 2197-BFBGA, FCBGA |
| Supplier Device Package | 2197-FCBGA (45x45) |
| Number of I/O | 770 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| ECCN | 3A001A7B |
| HTSUS | 8542.39.0001 |
| Other Names | 122-XCVC1902-2HSIVSVA2197 |
| Standard Package | 1 |
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1.9M Logic Cells 800MHz, 1.65GHz 2197-FCBGA (45x45)
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