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ALLCHIPS ELECTRONICS LIMITED

AMD XCVC1702-1MLINSVG1369

XCVC1702-1MLINSVG1369


  • Manufacturer: AMD
  • Origchip NO: XCVC1702-1MLINSVG1369
  • Package: 1369-BFBGA, FCBGA
  • Datasheet: -
  • Stock: 7086
  • Description: XCVC1702-1MLINSVG1369(Kg)

Quantity:

In Stock

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr AMD
Series Versal™ AI Core
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.3GHz
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature -40°C ~ 110°C (TJ)
Package / Case 1369-BFBGA, FCBGA
Supplier Device Package 1369-FCBGA (35x35)
Number of I/O 500
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Other Names 122-XCVC1702-1MLINSVG1369
Standard Package 1
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1M Logic Cells 600MHz, 1.3GHz 1369-FCBGA (35x35)

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