Infineon Technologies S25HL512TDPBHV010

S25HL512TDPBHV010

Manufacturer: Infineon Technologies
Origchip NO: S25HL512TDPBHV010
Package: 24-TBGA
Datasheet: PDF
Stock: 9046
Description: S25HL512TDPBHV010(Kg)

Quantity:

Qty
Unit Price
Ext Price

338

$9.80

$3,312.40

Not the price you want? Send RFQ Now and we'll contact you ASAP.

In Stock

Please send RFQ , we will respond immediately.

Purchase & Inquiry

Transport

Purchase

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Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr	Infineon Technologies
Series	Semper™
Package	Tray
Product Status	Active
Memory Type	Non-Volatile
Memory Format	FLASH
Technology	FLASH - NOR (SLC)
Memory Size	512Mbit
Memory Organization	64M x 8
Memory Interface	SPI - Quad I/O, QPI
Clock Frequency	133 MHz
Write Cycle Time - Word, Page	-
Voltage - Supply	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 105°C (TA)
Mounting Type	Surface Mount
Package / Case	24-TBGA
Supplier Device Package	24-BGA (8x6)
ECCN	3A991B1A
HTSUS	8542.32.0071
Standard Package	338