Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Total RAM Bits | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Flash Size | Primary Attributes | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics America Inc R8A77450HA02BG#UA | Renesas Electronics America Inc |
Min: 1 Mult: 1 |
/image/Renesas Electronics America Inc | RZ/G/G1E | Tray | Active | - | R8A77450 | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | -1161-R8A77450HA02BG#UA | 5A002A1 REN | 8542.31.0001 | 60 | 1GHz | |||||||||||||||||||||||||||||||||||
Advantech Corp 96MPXE-2-8M13T | Advantech Corp |
Min: 1 Mult: 1 |
/image/Advantech Corp | SkyLake-SP | Tray | Obsolete | - | Surface Mount | 1366-LGA Module | 1366-FCLGA | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 1 | Xeon E3-1275 | 2.0GHz | 2 Core, 64-Bit | - | - | - | - | - | - | - | - | - | - | |||||||||||||||||||||||||
AMD XAZU2EG-1SBVA484Q | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 125°C (TJ) | 484-BFBGA, FCBGA | XAZU2 | 484-FCBGA (19x19) | download | ROHS3 Compliant | 4 (72 Hours) | 5A002A4 | 8542.39.0001 | 1 | MPU, FPGA | 128 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 1.2GHz | CANbus, I²C, SPI, UART/USART, USB | DMA, WDT | 1.2MB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||||||||
AMD XAZU2EG-1SFVA625Q | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 125°C (TJ) | 625-BFBGA, FCBGA | XAZU2 | 625-FCBGA (21x21) | download | ROHS3 Compliant | 4 (72 Hours) | 5A002A4 XIL | 8542.39.0001 | 1 | MPU, FPGA | 128 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 1.2GHz | CANbus, I²C, SPI, UART/USART, USB | DMA, WDT | 1.2MB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||||||||
AMD XAZU3EG-1SFVA625Q | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 125°C (TJ) | 625-BFBGA, FCBGA | XAZU3 | 625-FCBGA (21x21) | download | ROHS3 Compliant | 4 (72 Hours) | 5A002A4 XIL | 8542.39.0001 | 1 | MPU, FPGA | 128 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 1.2GHz | CANbus, I²C, SPI, UART/USART, USB | DMA, WDT | 1.8MB | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | |||||||||||||||||||||||||||
AMD XAZU3EG-L1SFVA625I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 625-BFBGA, FCBGA | XAZU3 | 625-FCBGA (21x21) | download | ROHS3 Compliant | 4 (72 Hours) | 5A002A4 XIL | 8542.39.0001 | 1 | MPU, FPGA | 128 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 1.2GHz | CANbus, I²C, SPI, UART/USART, USB | DMA, WDT | 1.8MB | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | |||||||||||||||||||||||||||
AMD XAZU3EG-1SFVC784Q | AMD |
Min: 1 Mult: 1 |
/image/AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 125°C (TJ) | 784-BFBGA, FCBGA | XAZU3 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | 5A002A4 XIL | 8542.39.0001 | 1 | MPU, FPGA | 128 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 1.2GHz | CANbus, I²C, SPI, UART/USART, USB | DMA, WDT | 1.8MB | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | |||||||||||||||||||||||||||
AMD XCKU3P-L1SFVB784I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Kintex® UltraScale+™ | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 784-BFBGA, FCBGA | XCKU3 | Not Verified | 0.698V ~ 0.876V | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | 5A002A1 | 8542.39.0001 | 1 | 31641600 | 256 | 20340 | 355950 | |||||||||||||||||||||||||||||
AMD XCKU15P-L2FFVA1156E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Kintex® UltraScale+™ | Tray | Active | 0°C ~ 100°C (TJ) | Surface Mount | 1156-BBGA, FCBGA | XCKU15 | Not Verified | 0.698V ~ 0.876V | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 5A002A1 | 8542.39.0001 | 1 | 82329600 | 516 | 65340 | 1143450 | |||||||||||||||||||||||||||||
AMD XCKU15P-L2FFVE1517E | AMD |
Min: 1 Mult: 1 |
/image/AMD | Kintex® UltraScale+™ | Tray | Active | 0°C ~ 100°C (TJ) | Surface Mount | 1517-BBGA, FCBGA | XCKU15 | Not Verified | 0.698V ~ 0.876V | 1517-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 5A002A1 | 8542.39.0001 | 1 | 82329600 | 512 | 65340 | 1143450 | |||||||||||||||||||||||||||||
AMD XCVU11P-2FSGD2104I | AMD |
Min: 1 Mult: 1 |
/image/AMD | Virtex® UltraScale+™ | Tray | Active | -40°C ~ 100°C (TJ) | Surface Mount | 2104-BBGA, FCBGA | XCVU11 | Not Verified | 0.825V ~ 0.876V | 2104-FCBGA (47.5x47.5) | download | ROHS3 Compliant | 4 (72 Hours) | 5A002A1 | 8542.39.0001 | 1 | 396150400 | 572 | 162000 | 2835000 | |||||||||||||||||||||||||||||
Microchip Technology ATSAMD20E16B-AU | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM D20E | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-TQFP | ATSAMD20 | 32-TQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 26 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 1.62V ~ 3.6V | A/D 10x12b; D/A 1x10b | Internal | |||||||||||||||||||||
Microchip Technology ATSAMD20G15B-AU | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM D20G | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-TQFP | ATSAMD20 | 48-TQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 38 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 32KB (32K x 8) | FLASH | - | 4K x 8 | 1.62V ~ 3.6V | A/D 14x12b; D/A 1x10b | Internal | |||||||||||||||||||||
Microchip Technology ATSAMD20G16B-AN | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | SAM D20G | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-TQFP | ATSAMD20 | 48-TQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 38 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 1.62V ~ 3.6V | A/D 14x12b; D/A 1x10b | Internal | |||||||||||||||||||||
Microchip Technology PIC16F19156-I/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | PIC16F19156 | 28-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 27 | 24 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, LCD, POR, PWM, WDT | 28KB (16K x 14) | FLASH | 256 x 8 | 2K x 8 | 2.3V ~ 5.5V | A/D 20x12b; D/A 1x5b | Internal | |||||||||||||||||||||
Microchip Technology PIC16LF19156-E/SO | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | PIC16LF19156 | 28-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 27 | 24 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, LCD, POR, PWM, WDT | 28KB (16K x 14) | FLASH | 256 x 8 | 2K x 8 | 1.8V ~ 3.6V | A/D 20x12b; D/A 1x5b | Internal | |||||||||||||||||||||
Microchip Technology PIC16F19155-E/SP | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | PIC16F19155 | 28-SPDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 15 | 24 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, LCD, POR, PWM, WDT | 14KB (8K x 14) | FLASH | 256 x 8 | 1K x 8 | 2.3V ~ 5.5V | A/D 20x12b; D/A 1x5b | Internal | |||||||||||||||||||||
Microchip Technology PIC16LF19156-E/SP | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | PIC16LF19156 | 28-SPDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 15 | 24 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, LCD, POR, PWM, WDT | 28KB (16K x 14) | FLASH | 256 x 8 | 2K x 8 | 1.8V ~ 3.6V | A/D 20x12b; D/A 1x5b | Internal | |||||||||||||||||||||
Microchip Technology PIC16F19156-E/SS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | PIC16F19156 | 28-SSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 47 | 24 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, LCD, POR, PWM, WDT | 28KB (16K x 14) | FLASH | 256 x 8 | 2K x 8 | 2.3V ~ 5.5V | A/D 20x12b; D/A 1x5b | Internal | |||||||||||||||||||||
Microchip Technology PIC16LF19155-E/SS | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | PIC16LF19155 | 28-SSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 47 | 24 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, LCD, POR, PWM, WDT | 14KB (8K x 14) | FLASH | 256 x 8 | 1K x 8 | 1.8V ~ 3.6V | A/D 20x12b; D/A 1x5b | Internal | |||||||||||||||||||||
Microchip Technology PIC16LF19155-E/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 28-UFQFN Exposed Pad | PIC16LF19155 | 28-UQFN (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 91 | 24 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, LCD, POR, PWM, WDT | 14KB (8K x 14) | FLASH | 256 x 8 | 1K x 8 | 1.8V ~ 3.6V | A/D 20x12b; D/A 1x5b | Internal | |||||||||||||||||||||
Microchip Technology PIC16LF19156-I/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-UFQFN Exposed Pad | PIC16LF19156 | 28-UQFN (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 91 | 24 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, LCD, POR, PWM, WDT | 28KB (16K x 14) | FLASH | 256 x 8 | 2K x 8 | 1.8V ~ 3.6V | A/D 20x12b; D/A 1x5b | Internal | |||||||||||||||||||||
Microchip Technology PIC16F19175-I/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 40-UFQFN Exposed Pad | PIC16F19175 | 40-UQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 73 | 35 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, LCD, POR, PWM, WDT | 14KB (8K x 14) | FLASH | 256 x 8 | 1K x 8 | 2.3V ~ 5.5V | A/D 31x12b; D/A 1x5b | Internal | |||||||||||||||||||||
Microchip Technology PIC16F19185-E/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-UFQFN Exposed Pad | PIC16F19185 | 48-UQFN (6x6) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 61 | 43 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, LCD, POR, PWM, WDT | 14KB (8K x 14) | FLASH | 256 x 8 | 1K x 8 | 2.3V ~ 5.5V | A/D 39x12b; D/A 1x5b | Internal | |||||||||||||||||||||
Microchip Technology PIC16F19185-I/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-UFQFN Exposed Pad | PIC16F19185 | 48-UQFN (6x6) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 61 | 43 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, LCD, POR, PWM, WDT | 14KB (8K x 14) | FLASH | 256 x 8 | 1K x 8 | 2.3V ~ 5.5V | A/D 39x12b; D/A 1x5b | Internal | |||||||||||||||||||||
Microchip Technology PIC16LF19186-E/MV | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® XLP™ 16F | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-UFQFN Exposed Pad | PIC16LF19186 | 48-UQFN (6x6) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 61 | 43 | PIC | 8-Bit | 32MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, LCD, POR, PWM, WDT | 28KB (16K x 14) | FLASH | 256 x 8 | 2K x 8 | 1.8V ~ 3.6V | A/D 39x12b; D/A 1x5b | Internal | |||||||||||||||||||||
NXP USA Inc. LPC802M001JDH16FP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC80xM | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | LPC802 | 16-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.31.0001 | 960 | 13 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 15MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | |||||||||||||||||||||
NXP USA Inc. LPC802M011JDH20FP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC80xM | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | LPC802 | 20-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.31.0001 | 75 | 16 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 15MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | |||||||||||||||||||||
NXP USA Inc. MCIMX6D5EYM12CE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 624-LFBGA, FCBGA | MCIMX6 | 624-FCPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357868557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.2GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||
NXP USA Inc. MCIMX6Q4AVT08AER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357614518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 852MHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
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