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Embedded(154023)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
NXP USA Inc. MCIMX6Q4AVT10AER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357616518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||
|
NXP USA Inc. MCIMX6Q6AVT08AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357618557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 852MHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||
| NXP USA Inc. MCIMX6S1AVM08ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358563518 | 5A002A1 | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||
| NXP USA Inc. MCIMX6Y0CVM05AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357241557 | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (1) | - | USB 2.0 OTG + PHY (1) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | I²C, SPI, UART | ||||||||||||
| NXP USA Inc. MCIMX6Y1CVK05AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 272-LFBGA | MCIMX6 | 272-MAPBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357243557 | 5A992C | 8542.31.0001 | 260 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (1) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | CAN, I²C, SPI, UART | ||||||||||||
| NXP USA Inc. MCIMX6Y2CVM05AAR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318725518 | 5A992C | 8542.31.0001 | 1,000 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (1) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | CAN, I²C, SPI, UART | ||||||||||||
| NXP USA Inc. MCIMX6Y2CVM05AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (1) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | CAN, I²C, SPI, UART | |||||||||||||
| NXP USA Inc. MCIMX6Y2DVM05AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | CAN, I²C, SPI, UART | |||||||||||||
| NXP USA Inc. MCIMX6Y7DVM09AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357254557 | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7 | 900MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | CAN, I²C, SPI, UART | ||||||||||||
| NXP USA Inc. S912XDT512J1MAAR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Not For New Designs | -40°C ~ 125°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358582528 | 3A991A2 | 8542.31.0001 | 750 | 59 | HCS12X | 16-Bit | 80MHz | CANbus, I²C, SCI, SPI | LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 20K x 8 | 3.15V ~ 5.5V | A/D 8x12b | External | ||||||||||||
| NXP USA Inc. S912ZVLA96F0MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358142557 | 3A991A2 | 8542.31.0001 | 1,250 | 34 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 10x10b; D/A 1x8b | Internal | ||||||||||||
| NXP USA Inc. S9S12G48BCLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S9S12 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 26 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 1.5K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | |||||||||||||
| NXP USA Inc. SP5745BBK1AMMH6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LFBGA | SP5745 | 100-MAPBGA (11x11) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358561518 | 5A992C | 8542.31.0001 | 1,500 | e200z4 | 32-Bit Single-Core | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||||||||||||
| NXP USA Inc. SPC5602BACLQ4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | SPC5602 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358034557 | 3A991A2 | 8542.31.0001 | 60 | 123 | e200z0h | 32-Bit Single-Core | 48MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 64K x 8 | 24K x 8 | 3V ~ 5.5V | A/D 36x10b | Internal | |||||||||||||
| NXP USA Inc. SPC5604BAMLQ6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | SPC5604 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358035557 | 3A991A2 | 8542.31.0001 | 60 | 123 | e200z0h | 32-Bit Single-Core | 64MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 64K x 8 | 32K x 8 | 3V ~ 5.5V | A/D 36x10b | Internal | |||||||||||||
| NXP USA Inc. SPC5745BBK1ACMH2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LFBGA | SPC5745 | 100-MAPBGA (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358699557 | 5A992C | 8542.31.0001 | 880 | e200z4 | 32-Bit Single-Core | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | |||||||||||||
| NXP USA Inc. SPC5745BK1VMH2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LFBGA | SPC5745 | 100-MAPBGA (11x11) | download | ROHS3 Compliant | REACH Unaffected | 935353624557 | 5A992C | 8542.31.0001 | 880 | e200z4 | 32-Bit Single-Core | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||||||||||||
| NXP USA Inc. SPC5748CK0AMMJ6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 256-LBGA | SPC5748 | 256-MAPPBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358692518 | 5A992C | 8542.31.0001 | 1,000 | 178 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||
| Infineon Technologies CY8C4248LQI-BL483T | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | PSOC® 4 CY8C4xx8 BLE | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 56-UFQFN Exposed Pad | CY8C4248 | 56-QFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 2832-CY8C4248LQI-BL483TTR | 5A002A1 | 8542.31.0001 | 2,000 | 36 | ARM® Cortex®-M0 | 32-Bit Single-Core | 48MHz | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 5.5V | A/D 16x12b SAR; D/A 2xIDAC | Internal | ||||||||||||
| Microchip Technology ATTINY414-SSNR | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | tinyAVR™ 1, Functional Safety (FuSa) | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | ATTINY414 | 14-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 3,000 | 12 | AVR | 8-Bit | 20MHz | I²C, IrDA, LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 4KB (4K x 8) | FLASH | 128 x 8 | 256 x 8 | 1.8V ~ 5.5V | A/D 10x10b; D/A 1x8b | Internal | |||||||||||||
| Microchip Technology PIC32MZ0512EFE144T-E/JWX | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, PIC® 32MZ | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-TFBGA | PIC32MZ0512EFE144 | 144-TFBGA (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,200 | 120 | MIPS32® M-Class | 32-Bit Single-Core | 180MHz | EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 2.1V ~ 3.6V | A/D 48x12b | Internal | |||||||||||||
| Microchip Technology PIC32MZ0512EFF144T-E/JWX | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, PIC® 32MZ | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-TFBGA | PIC32MZ0512EFF144 | 144-TFBGA (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,200 | 120 | MIPS32® M-Class | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 2.1V ~ 3.6V | A/D 48x12b | Internal | ||||||||||||||
| Microchip Technology PIC32MZ0512EFF144T-I/JWX | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, PIC® 32MZ | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-TFBGA | PIC32MZ0512EFF144 | 144-TFBGA (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,200 | 120 | MIPS32® M-Class | 32-Bit Single-Core | 200MHz | CANbus, EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 2.1V ~ 3.6V | A/D 48x12b | Internal | ||||||||||||||
| Microchip Technology PIC32MZ0512EFK144T-I/JWX | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 32MZ | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-TFBGA | PIC32MZ0512EFK144 | 144-TFBGA (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 2,200 | 120 | MIPS32® M-Class | 32-Bit Single-Core | 200MHz | CANbus, EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 2.1V ~ 3.6V | A/D 48x12b | Internal | ||||||||||||||
| Microchip Technology PIC32MZ1024EFF144T-E/JWX | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, PIC® 32MZ | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-TFBGA | PIC32MZ1024EFF144 | 144-TFBGA (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,200 | 120 | MIPS32® M-Class | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 2.1V ~ 3.6V | A/D 48x12b | Internal | ||||||||||||||
| Microchip Technology PIC32MZ1024EFF144T-I/JWX | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 32MZ | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-TFBGA | PIC32MZ1024EFF144 | 144-TFBGA (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,200 | 120 | MIPS32® M-Class | 32-Bit Single-Core | 200MHz | CANbus, EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 2.1V ~ 3.6V | A/D 48x12b | Internal | ||||||||||||||
| Microchip Technology PIC32MZ1024EFH144T-E/JWX | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, PIC® 32MZ | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-TFBGA | PIC32MZ1024EFH144 | 144-TFBGA (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,200 | 120 | MIPS32® M-Class | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 512K x 8 | 2.1V ~ 3.6V | A/D 48x12b | Internal | ||||||||||||||
| Microchip Technology PIC32MZ2048EFG144T-I/JWX | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 32MZ | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-TFBGA | PIC32MZ2048EFG144 | 144-TFBGA (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,200 | 120 | MIPS32® M-Class | 32-Bit Single-Core | 200MHz | EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 2MB (2M x 8) | FLASH | - | 512K x 8 | 2.1V ~ 3.6V | A/D 48x12b | Internal | ||||||||||||||
| Microchip Technology PIC32MZ2048EFH144T-E/JWX | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | Automotive, AEC-Q100, PIC® 32MZ | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-TFBGA | PIC32MZ2048EFH144 | 144-TFBGA (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,200 | 120 | MIPS32® M-Class | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 2MB (2M x 8) | FLASH | - | 512K x 8 | 2.1V ~ 3.6V | A/D 48x12b | Internal | ||||||||||||||
| Microchip Technology PIC32MZ2048EFH144T-I/JWX | Microchip Technology |
Min: 1 Mult: 1 |
/image/Microchip Technology | PIC® 32MZ | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-TFBGA | PIC32MZ2048EFH144 | 144-TFBGA (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,200 | 120 | MIPS32® M-Class | 32-Bit Single-Core | 200MHz | CANbus, EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 2MB (2M x 8) | FLASH | - | 512K x 8 | 2.1V ~ 3.6V | A/D 48x12b | Internal |
