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Microcontrollers(99682)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Silicon Labs C8051F508-IMR | Silicon Labs |
Min: 1 Mult: 1 |
/image/Silicon Labs | C8051F50x | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | C8051F508 | 40-QFN (6x6) | download | RoHS Compliant | 3 (168 Hours) | 3A991A2 | 8542.31.0001 | 1,500 | 33 | 8051 | 8-Bit | 50MHz | EBI/EMI, SMBus (2-Wire/I²C), CANbus, LINbus, SPI, UART/USART | POR, PWM, Temp Sensor, WDT | 64KB (64K x 8) | FLASH | - | 4.25K x 8 | 1.8V ~ 5.25V | A/D 32x12b | Internal | |||
| Silicon Labs C8051F510-IMR | Silicon Labs |
Min: 1 Mult: 1 |
/image/Silicon Labs | C8051F51x | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | C8051F510 | 40-QFN (6x6) | download | RoHS Compliant | 3 (168 Hours) | 3A991A2 | 8542.31.0001 | 1,500 | 33 | 8051 | 8-Bit | 50MHz | EBI/EMI, SMBus (2-Wire/I²C), CANbus, LINbus, SPI, UART/USART | POR, PWM, Temp Sensor, WDT | 32KB (32K x 8) | FLASH | - | 4.25K x 8 | 1.8V ~ 5.25V | A/D 32x12b | Internal | |||
| Silicon Labs C8051F524A-IMR | Silicon Labs |
Min: 1 Mult: 1 |
/image/Silicon Labs | C8051F52x | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 10-VFDFN Exposed Pad | C8051F524 | 10-DFN (3x3) | download | 1 (Unlimited) | EAR99 | 8542.31.0001 | 1,500 | 6 | 8051 | 8-Bit | 25MHz | SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 5.25V | A/D 6x12b | Internal | ||||
| Silicon Labs C8051F530A-ITR | Silicon Labs |
Min: 1 Mult: 1 |
/image/Silicon Labs | C8051F53x | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | C8051F530 | 20-TSSOP | download | 3 (168 Hours) | EAR99 | 8542.31.0001 | 2,500 | 16 | 8051 | 8-Bit | 25MHz | LINbus, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT | 8KB (8K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 5.25V | A/D 16x12b | Internal | ||||
| Infineon Technologies CY8C4125LQI-483 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | PSOC® 4 CY8C4100 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 40-UFQFN Exposed Pad | CY8C4125 | 40-QFN (6x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 490 | 34 | ARM® Cortex®-M0 | 32-Bit Single-Core | 24MHz | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 4K x 8 | 1.71V ~ 5.5V | A/D 8x12b SAR; D/A 2xIDAC | Internal | ||
| Infineon Technologies CY8C4125AXI-483 | Infineon Technologies |
Min: 1 Mult: 1 |
/image/Infineon Technologies | PSOC® 4 CY8C4100 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | CY8C4125 | 44-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 160 | 36 | ARM® Cortex®-M0 | 32-Bit Single-Core | 24MHz | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 4K x 8 | 1.71V ~ 5.5V | A/D 8x12b SAR; D/A 2xIDAC | Internal | ||
| NXP USA Inc. MKL02Z32VFM4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MKL02Z32 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321818557 | 3A991A2 | 8542.31.0001 | 490 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 4K x 8 | 1.71V ~ 3.6V | A/D 14x12b | Internal | |
| NXP USA Inc. MKL02Z16VFK4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | MKL02Z16 | 24-QFN (4x4) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 935317783557 | 3A991A2 | 8542.31.0001 | 490 | 22 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | |
| NXP USA Inc. SPC5602BF2CLQ4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | SPC5602 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323376557 | 3A991A2 | 8542.31.0001 | 300 | 123 | e200z0h | 32-Bit Single-Core | 48MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 64K x 8 | 24K x 8 | 3V ~ 5.5V | A/D 36x10b | Internal | |
| NXP USA Inc. SPC5602PEF0MLL6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tape & Reel (TR) | Active | -40°C ~ 125°C | Surface Mount | 100-LQFP | SPC5602 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323207528 | 3A991A2 | 8542.31.0001 | 1,000 | 79 | e200z0h | 32-Bit Single-Core | 64MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 64K x 8 | 20K x 8 | 3V ~ 5.5V | A/D 16x10b | Internal | |
| NXP USA Inc. SPC5646CCF0MMJ1 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 256-LBGA | SPC5646 | 256-MAPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313069557 | 5A002A1 | 8542.31.0001 | 450 | 199 | e200z4d, e200z0h | 32-Bit Dual-Core | 80MHz/120MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 3MB (3M x 8) | FLASH | 64K x 8 | 256K x 8 | 3V ~ 5.5V | A/D 33x10b, 10x12b | Internal | |
| NXP USA Inc. SPC5673FF3MVY2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 516-BBGA | SPC5673 | 516-PBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 40 | 32 | e200z7 | 32-Bit Single-Core | 200MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | 3MB (3M x 8) | FLASH | - | 192K x 8 | 1.08V ~ 5.25V | A/D 64x12b | External | ||
| NXP USA Inc. SPC5646BF0MLU1 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP | SPC5646 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 200 | 147 | e200z4d | 32-Bit Single-Core | 120MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 3MB (3M x 8) | FLASH | 64K x 8 | 192K x 8 | 3V ~ 5.5V | A/D 27x10b, 5x12b | Internal | ||
| NXP USA Inc. MC56F82313VLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MC56F82 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 26 | 56800EX | 32-Bit Single-Core | 50MHz | I²C, SCI, SPI | DMA, POR, PWM, WDT | 16KB (8K x 16) | FLASH | - | 2K x 16 | 2.7V ~ 3.6V | A/D 6x12b | Internal | ||
| NXP USA Inc. MC56F82316VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MC56F82 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314921557 | 3A991A2 | 8542.31.0001 | 250 | 39 | 56800EX | 32-Bit Single-Core | 50MHz | I²C, SCI, SPI | DMA, POR, PWM, WDT | 16KB (8K x 16) | FLASH | - | 2K x 16 | 2.7V ~ 3.6V | A/D 10x12b; D/A 2x12b | Internal | |
| NXP USA Inc. MC56F82723VFM | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MC56F82 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 26 | 56800EX | 32-Bit Single-Core | 100MHz | I²C, SCI, SPI | DMA, POR, PWM, WDT | 32KB (16K x 16) | FLASH | - | 3K x 16 | 2.7V ~ 3.6V | A/D 6x12b; D/A 2x12b | Internal | ||
| NXP USA Inc. MC56F84441VLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MC56F84 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324547528 | 3A991A2 | 8542.31.0001 | 2,000 | 39 | 56800EX | 32-Bit Single-Core | 60MHz | CANbus, I²C, LINbus, SCI, SPI | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 2K x 8 | 8K x 8 | 3V ~ 3.6V | A/D 10x10b | Internal | ||
| NXP USA Inc. MC9S08PA4VTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315162574 | 3A991A2 | 8542.31.0001 | 96 | 14 | S08 | 8-Bit | 20MHz | LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | 128 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 8x12b | Internal | |
| NXP USA Inc. MC9S08PT16VWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MC9S08 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323407574 | 3A991A2 | 8542.31.0001 | 38 | 18 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |
| NXP USA Inc. MC9S08PT32VLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320045528 | 3A991A2 | 8542.31.0001 | 2,000 | 28 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||
| NXP USA Inc. MC9S08PT8VTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317903574 | 3A991A2 | 8542.31.0001 | 96 | 14 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |
| NXP USA Inc. MCF51JG256CHS | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51Jx | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 44-VFLGA Exposed Pad | MCF51 | 44-MAPLGA (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 490 | 31 | Coldfire V1 | 32-Bit Single-Core | 50MHz | I²C, SCI, SPI, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 64K x 8 | 1.85V ~ 3.6V | - | External | ||
| NXP USA Inc. MCF54450VM240J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5445x | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 256-LBGA | MCF54450 | 256-MAPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 450 | 132 | Coldfire V4 | 32-Bit Single-Core | 240MHz | I²C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | - | ROMless | - | 32K x 8 | 1.35V ~ 3.6V | - | Internal | ||
| NXP USA Inc. MK10DX128VLQ10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK10DX128 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317671557 | 3A991A2 | 8542.31.0001 | 60 | 104 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 46x16b; D/A 2x12b | Internal | |
| NXP USA Inc. MK21FN1M0VMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK21FN1M0 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 160 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | ||
| NXP USA Inc. MK22FN1M0VLL12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK22FN1M0 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 33x16b; D/A 1x12b | Internal | ||
| NXP USA Inc. MK22FX512VLQ12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK22FX512 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312994557 | 3A991A2 | 8542.31.0001 | 60 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | |
| NXP USA Inc. MK22FX512VMC12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK22FX512 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311152557 | 3A991A2 | 8542.31.0001 | 348 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 38x16b; D/A 2x12b | Internal | |
| NXP USA Inc. MK40DX64VLK7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K40 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK40DX64 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 52 | ARM® Cortex®-M4 | 32-Bit Single-Core | 72MHz | CANbus, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LCD, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 2K x 8 | 16K x 8 | 1.71V ~ 3.6V | A/D 27x16b; D/A 1x12b | Internal | ||
| NXP USA Inc. MK50DN512CMD10R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LBGA | MK50DN512 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317965518 | 3A991A2 | 8542.31.0001 | 1,000 | 96 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal |
