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Microcontrollers(99682)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC9S08PA16AVWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MC9S08 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 38 | 18 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | ||
| NXP USA Inc. MC9S08PA32AVLD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | MC9S08 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 160 | 37 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | ||
| NXP USA Inc. MC9S08PA32AVLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MC9S08 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318427557 | 3A991A2 | 8542.31.0001 | 160 | 57 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |
| NXP USA Inc. MC9S08PA4AVTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 14 | S08 | 8-Bit | 20MHz | LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | 128 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 8x12b | Internal | ||
| NXP USA Inc. MC9S08PA4MTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 14 | S08 | 8-Bit | 20MHz | LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | 128 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 8x12b | Internal | ||
| NXP USA Inc. MC9S08PA60AVLD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | MC9S08 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315519557 | 3A991A2 | 8542.31.0001 | 160 | 37 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |
| NXP USA Inc. MC9S08PA60AVLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MC9S08 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324873557 | 3A991A2 | 8542.31.0001 | 250 | 41 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |
| NXP USA Inc. MC9S08PA60AVLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MC9S08 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 57 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||
| NXP USA Inc. MC9S08PA60AVQH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-QFP | MC9S08 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320406557 | 3A991A2 | 8542.31.0001 | 84 | 57 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |
| NXP USA Inc. MC9S08PA8AVLD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | MC9S08 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312204557 | 3A991A2 | 8542.31.0001 | 800 | 37 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |
| NXP USA Inc. MC9S08PT16AVLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 28 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | ||
| NXP USA Inc. MC9S08PT32AVLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MC9S08 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 41 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||
| NXP USA Inc. MC9S08PT60AVLD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | MC9S08 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 160 | 37 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||
| NXP USA Inc. MC9S08PT8AVTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 14 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | ||
| NXP USA Inc. MC9S08PT8AVWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MC9S08 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 38 | 18 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | ||
| NXP USA Inc. MK22FN1M0VLK12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK22FN1M0 | 80-FQFP (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,000 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 27x16b; D/A 1x12b | Internal | |||
 |
NXP USA Inc. MK64FN1M0CAJ12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 142-UFBGA, WLCSP | MK64FN1M0 | 142-WLCSP (4.83x5.58) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935323594051 | 3A991A2 | 8542.31.0001 | 3,000 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal |
| NXP USA Inc. MK64FN1M0VLL12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK64FN1M0 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315207528 | 3A991A2 | 8542.31.0001 | 1,000 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 32x16b; D/A 1x12b | Internal | |
|
NXP USA Inc. MKL02Z32VFG4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL02 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-UFQFN Exposed Pad | MKL02Z32 | 16-QFN (3x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314869528 | 3A991A2 | 8542.31.0001 | 5,000 | 14 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 4K x 8 | 1.71V ~ 3.6V | A/D 6x12b | Internal |
|
NXP USA Inc. MKL15Z128CAD4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL1 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 35-UFBGA, WLCSP | MKL15Z128 | 35-WLCSP (2.53x2.99) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 5,000 | 31 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, TSI, UART/USART | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 9x16b; D/A 1x12b | Internal | |
| NXP USA Inc. MKM14Z64ACHH5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KM | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-VFLGA Exposed Pad | MKM14Z64 | 44-MAPLGA (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 20 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | DMA, WDT | 64KB (64K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 5x16b, 4x24b | Internal | ||
| NXP USA Inc. MKM33Z128ACLH5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KM | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | MKM33Z128 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 38 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | DMA, LCD, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 6x16b, 4x24b | Internal | ||
| NXP USA Inc. MKM33Z128ACLL5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KM | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | MKM33Z128 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 68 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | DMA, LCD, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 12x16b, 4x24b | Internal | ||
| NXP USA Inc. MKM33Z64ACLH5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KM | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | MKM33Z64 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315657557 | 3A991A2 | 8542.31.0001 | 160 | 38 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | DMA, LCD, WDT | 64KB (64K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 6x16b, 4x24b | Internal | |
| NXP USA Inc. S912XEP100BMAG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323479557 | 3A991A2 | 8542.31.0001 | 300 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 4K x 8 | 64K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | ||
| NXP USA Inc. S912XEP100BMAL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320425557 | 3A991A2 | 8542.31.0001 | 300 | 91 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 4K x 8 | 64K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | ||
| NXP USA Inc. S912XET256BMAAR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315433528 | 3A991A2 | 8542.31.0001 | 750 | 59 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.72V ~ 5.5V | A/D 8x12b | External | ||
| NXP USA Inc. S912XET256BMAL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320455557 | 3A991A2 | 8542.31.0001 | 300 | 91 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | ||
| NXP USA Inc. S9KEAZN64ACLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S9KEAZN64 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||
| NXP USA Inc. S9S08DV16F2MLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S9S08 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319968528 | 3A991A2 | 8542.31.0001 | 2,000 | 25 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 10x12b | External |
