Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. S908AB32AH3CFUER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 64-QFP | S908 | 64-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310168528 | EAR99 | 8542.31.0001 | 750 | 51 | HC08 | 8-Bit | 8MHz | SCI, SPI | POR, PWM | 32KB (32K x 8) | FLASH | 512 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | ||
NXP USA Inc. S908AB32AH3MFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Bulk | Not For New Designs | -40°C ~ 125°C (TA) | Surface Mount | 64-QFP | S908 | 64-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319768557 | EAR99 | 8542.31.0001 | 420 | 51 | HC08 | 8-Bit | 8MHz | SCI, SPI | POR, PWM | 32KB (32K x 8) | FLASH | 512 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | ||
NXP USA Inc. S912B32E4CFUE8 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Bulk | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935309891557 | EAR99 | 8542.31.0001 | 420 | 63 | CPU12 | 16-Bit | 8MHz | SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | 768 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x10b | External | ||
NXP USA Inc. S912B32E4MFUE8R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 125°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313938528 | EAR99 | 8542.31.0001 | 750 | 63 | CPU12 | 16-Bit | 8MHz | SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | 768 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x10b | External | ||
NXP USA Inc. S912B32E4VFUE8R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935309978528 | EAR99 | 8542.31.0001 | 750 | 63 | CPU12 | 16-Bit | 8MHz | SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | 768 x 8 | 1K x 8 | 4.5V ~ 5.5V | A/D 8x10b | External | ||
NXP USA Inc. S912DG12AH4CPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Bulk | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317811557 | EAR99 | 8542.31.0001 | 300 | 69 | CPU12 | 16-Bit | 8MHz | CANbus, I²C, SCI, SPI | POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5V ~ 5.5V | A/D 16x8/10b | Internal | ||
NXP USA Inc. S912DG12CE1VPVER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310718528 | EAR99 | 8542.31.0001 | 500 | 69 | CPU12 | 16-Bit | 8MHz | CANbus, I²C, SCI, SPI | POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5V ~ 5.5V | A/D 16x8/10b | Internal | ||
NXP USA Inc. S912ZVCA96F0VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316485557 | 3A991A2 | 8542.31.0001 | 1,250 | 28 | HCS12Z | 16-Bit | 32MHz | CANbus, I²C, SCI, SPI | DMA, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 2K x 8 | 8K x 8 | 3.5V ~ 40V | A/D 10x12b; D/A 1x8b | Internal | |
NXP USA Inc. S912ZVLA12F0MLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S912 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316407528 | 3A991A2 | 8542.31.0001 | 2,000 | 19 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 6x10b; D/A 1x8b | Internal | |
NXP USA Inc. S912ZVLA12F0MLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313301528 | 3A991A2 | 8542.31.0001 | 2,000 | 34 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 10x10b; D/A 1x8b | Internal | |
NXP USA Inc. S9S12DP51J4CPVER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | S9S12 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322788528 | 3A991A2 | 8542.31.0001 | 500 | 20 | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 14K x 8 | 2.35V ~ 5.25V | A/D 8x10b | External | ||
NXP USA Inc. S9S12G192F0VLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313357528 | 3A991A2 | 8542.31.0001 | 2,000 | 40 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 192KB (192K x 8) | FLASH | 4K x 8 | 11K x 8 | 3.13V ~ 5.5V | A/D 16x10b | Internal | ||
NXP USA Inc. SAC57D54HCVMO | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MAC57Dxxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 516-BGA | SAC57 | 516-MAPBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 200 | ARM® Cortex®-A5/M4/M0+ | 32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | 4MB (4M x 8) | FLASH | - | 2.3M x 8 | 3.15V ~ 5.5V | A/D 24x12b | Internal | |||
NXP USA Inc. SC439639VAB25R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Not For New Designs | - | - | SC439639 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310046528 | EAR99 | 8542.31.0001 | 200 | - | - | - | - | - | - | - | - | - | - | - | - | |||||
NXP USA Inc. SC705C8AE0VFBE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | - | - | SC705C8 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314598557 | EAR99 | 8542.31.0001 | 480 | - | - | - | - | - | - | - | - | - | - | - | - | |||||
NXP USA Inc. SCF5250CAG120R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | SCF52xx | Tape & Reel (TR) | Last Time Buy | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | SCF5250 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322799528 | 3A991A2 | 8542.31.0001 | 500 | 57 | Coldfire V2 | 32-Bit Single-Core | 120MHz | EBI/EMI, I²C, IDE, Memory Card, SPI, UART/USART | DMA, I²S, POR, Serial Audio, WDT | - | ROMless | - | 128K x 8 | 1.08V ~ 1.32V | A/D 6x12b | Internal | |
NXP USA Inc. SP5744PFK1AMLQ8R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | SP5744 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935326076528 | 3A991A2 | 8542.31.0001 | 500 | e200z4 | 32-Bit Dual-Core | 180MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | 2.5MB (2.5M x 8) | FLASH | - | 384K x 8 | 3.15V ~ 5.5V | A/D 64x12b | Internal | |||
NXP USA Inc. SP5746CHK0AMMH6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LFBGA | SP5746 | 100-MAPBGA (11x11) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316363518 | 5A002A1 | 8542.31.0001 | 1,500 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||
NXP USA Inc. SP5746CHK0AMMJ6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 256-LBGA | SP5746 | 256-MAPPBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313274518 | 5A002A1 | 8542.31.0001 | 1,000 | 178 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | ||
NXP USA Inc. SPC5745BK1MMH6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LFBGA | SPC5745 | 100-MAPBGA (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323883557 | 5A002A1 | 8542.31.0001 | 880 | e200z4 | 32-Bit Single-Core | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||
NXP USA Inc. SPC5745BK1MMH6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LFBGA | SPC5745 | 100-MAPBGA (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323883518 | 5A002A1 | 8542.31.0001 | 1,500 | e200z4 | 32-Bit Single-Core | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||
NXP USA Inc. SPC5746BSK1VKU2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5746 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323898557 | 5A002A1 | 8542.31.0001 | 200 | 129 | e200z4 | 32-Bit Single-Core | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | |
NXP USA Inc. SPC5746CK1MMJ6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 256-LBGA | SPC5746 | 256-MAPPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318931518 | 5A002A1 | 8542.31.0001 | 1,000 | 178 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |
NXP USA Inc. SPC5746CSK1MKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5746 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322183557 | 5A992C | 8542.31.0001 | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |
NXP USA Inc. SPC5746CSK1MMH6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LFBGA | SPC5746 | 100-MAPBGA (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316141557 | 5A992C | 8542.31.0001 | 176 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | ||
NXP USA Inc. SPC5746RK1MMT5R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 252-LFBGA | SPC5746 | 252-MAPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318627518 | 3A991A2 | 8542.31.0001 | 1,000 | e200z4 | 32-Bit Tri-Core | 200MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI, UART/USART | DMA, LVD, POR, Zipwire | 4MB (4M x 8) | FLASH | - | 256K x 8 | 3.5V ~ 5.5V | A/D 12b SAR, 16b Sigma-Delta | Internal | ||
NXP USA Inc. SPC5747CK1MMJ6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 125°C (TA) | Surface Mount | 256-LBGA | SPC5747 | 256-MAPPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318498557 | 5A002A1 | 8542.31.0001 | 450 | 178 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |
NXP USA Inc. SPC5747CK1MMJ6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 256-LBGA | SPC5747 | 256-MAPPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318498518 | 5A002A1 | 8542.31.0001 | 1,000 | 178 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |
NXP USA Inc. SPC5747CK1VKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5747 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320655557 | 5A002A1 | 8542.31.0001 | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |
NXP USA Inc. SPC5747CK1VMJ6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 256-LBGA | SPC5747 | 256-MAPPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315764557 | 5A002A1 | 8542.31.0001 | 450 | 178 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal |
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