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Microcontrollers(99682)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC9S08SH16MTJR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313992534 | 3A991A2 | 8542.31.0001 | 5,000 | 17 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | |
| NXP USA Inc. MC9S08SH8MWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MC9S08 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 38 | 17 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | ||
| NXP USA Inc. MC9S12DG256CFUER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 80-QFP | MC9S12 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318476528 | EAR99 | 8542.31.0001 | 750 | 59 | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 12K x 8 | 2.35V ~ 5.25V | A/D 16x10b | Internal | |
| NXP USA Inc. MC9S12E64VFUE16R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-QFP | MC9S12 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324012528 | EAR99 | 8542.31.0001 | 750 | 60 | HCS12 | 16-Bit | 25MHz | EBI/EMI, I²C, SCI, SPI | POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 4K x 8 | 2.35V ~ 2.75V | A/D 16x10b; D/A 2x8b | Internal | |
| NXP USA Inc. MCF5251CVM140R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF525x | Tape & Reel (TR) | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 225-LFBGA | MCF5251 | 225-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316686518 | 3A991A2 | 8542.31.0001 | 1,000 | Coldfire V2 | 32-Bit Single-Core | 140MHz | ATA, Audio, CANbus, EBI/EMI, I²C, IDE, SD, SPI, UART/USART, USB OTG | DMA | - | ROMless | - | 128K x 8 | 1.08V ~ 3.6V | A/D 6x12b | External | ||
| NXP USA Inc. MCF54450AVM240 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5445x | Tray | Active | 0°C ~ 70°C (TA) | Surface Mount | 256-LBGA | MCF54450 | 256-MAPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324373557 | 5A002A1 | 8542.31.0001 | 450 | 132 | Coldfire V4 | 32-Bit Single-Core | 240MHz | I²C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | - | ROMless | - | 32K x 8 | 1.35V ~ 3.6V | - | Internal | |
 |
NXP USA Inc. MCHSC705C8ACFNER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC05 | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 44-LCC (J-Lead) | MCHSC705 | 44-PLCC (16.59x16.59) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314637518 | EAR99 | 8542.31.0001 | 450 | 24 | HC05 | 8-Bit | 4MHz | SCI, SPI | POR, WDT | 8KB (8K x 8) | OTP | - | 304 x 8 | 3V ~ 5.5V | - | Internal | |
|
NXP USA Inc. MCW68332A | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Not For New Designs | MCW68332 | ROHS3 Compliant | REACH Unaffected | 935319459025 | 0000.00.0000 | 13 | ||||||||||||||||||||
| NXP USA Inc. MIMXRT1052CVL5A | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1050 | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1052 | 196-LFBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 240 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 528MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | - | External Program Memory | - | 512K x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | ||
| NXP USA Inc. MK02FN64VFM10R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K02 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MK02FN64 | 32-HVQFN (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323608528 | 3A991A2 | 8542.31.0001 | 5,000 | 26 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | I²C, SPI, UART/USART | DMA, LVD, POR, PWM | 64KB (64K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 12x16b; D/A 1x12b | Internal | ||
| NXP USA Inc. MK10DN512VLK10R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK10DN512 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,000 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 31x16b; D/A 1x12b | Internal | ||
| NXP USA Inc. MK10DX128VLH7R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK10DX128 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324888528 | 3A991A2 | 8542.31.0001 | 1,500 | 44 | ARM® Cortex®-M4 | 32-Bit Single-Core | 72MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 26x16b; D/A 1x12b | Internal | ||
| NXP USA Inc. MK22FX512AVLH12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK22FX512 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,500 | 40 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 22x16b; D/A 1x12b | Internal | |||
| NXP USA Inc. MK22FX512VLQ12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK22FX512 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312994528 | 3A991A2 | 8542.31.0001 | 500 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | ||
| NXP USA Inc. MK60DN512VMC10R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK60DN512 | 121-MAPBGA (8x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313053518 | 3A991A2 | 8542.31.0001 | 2,000 | 86 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 38x16b; D/A 2x12b | Internal | ||
| NXP USA Inc. MK63FN1M0VLQ12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK63FN1M0 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321973528 | 5A002A1 | 8542.31.0001 | 500 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | |
| NXP USA Inc. MK70FN1M0VMJ15R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K70 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 256-LBGA | MK70FN1M0 | 256-MAPPBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323155518 | 3A991A2 | 8542.31.0001 | 1,000 | 128 | ARM® Cortex®-M4 | 32-Bit Single-Core | 150MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LCD, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 71x16b; D/A 2x12b | Internal | ||
|
NXP USA Inc. MK81FN256VDC15R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K8x | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-XFBGA | MK81FN256 | 121-XFBGA (8x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313043518 | 5A992C | 8542.31.0001 | 2,000 | 85 | ARM® Cortex®-M4 | 32-Bit Single-Core | 150MHz | EBI/EMI, I²C, SPI, UART/USART, USB OTG | DMA, I²S, LVD, POR, PWM | 256KB (256K x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 17x16b; D/A 2x6b, 1x12b | Internal | |
| NXP USA Inc. MKE04Z128VLH4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE04 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKE04Z128 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320756528 | 3A991A2 | 8542.31.0001 | 1,500 | 58 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |
| NXP USA Inc. MKE04Z8VWJ4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE04 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MKE04Z8 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317919518 | 3A991A2 | 8542.31.0001 | 1,000 | 18 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 8KB (8K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 10x12b; D/A 2x6b | Internal | |
| NXP USA Inc. MKE14Z256VLL7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE1xZ | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MKE14Z256 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318532557 | 3A991A2 | 8542.31.0001 | 90 | 89 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 72MHz | FlexIO, I²C, SPI, UART/USART | DMA, LVD, PWM, WDT | 256KB (256K x 8) | FLASH | 34K x 8 | 32K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 1x8b | Internal | |
| NXP USA Inc. MKL03Z32VFK4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL03 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | MKL03Z32 | 24-QFN (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312952528 | 3A991A2 | 8542.31.0001 | 5,000 | 22 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 7x12b | Internal | |
| NXP USA Inc. MKL04Z8VLC4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL0 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MKL04Z8 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 1K x 8 | 1.71V ~ 3.6V | A/D 14x12b | Internal | ||
| NXP USA Inc. MKL13Z32VLK4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL13 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MKL13Z32 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312502557 | 3A991A2 | 8542.31.0001 | 96 | 70 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | FlexIO, I²C, IrDA, SPI, UART/USART | DMA, PWM, WDT | 32KB (32K x 8) | FLASH | - | 4K x 8 | 1.71V ~ 3.6V | A/D 20x16b; D/A 1x12b | Internal | |
| NXP USA Inc. MKL14Z32VFM4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL1 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MKL14Z32 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311277528 | 3A991A2 | 8542.31.0001 | 5,000 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 4K x 8 | 1.71V ~ 3.6V | A/D 9x12b | Internal | |
| NXP USA Inc. MKL16Z256VMP4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL1 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LFBGA | MKL16Z256 | 64-MAPBGA (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312291518 | 3A991A2 | 8542.31.0001 | 2,500 | 54 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, TSI, UART/USART | Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 3.6V | A/D - 16bit; D/A - 12bit | Internal | |
|
NXP USA Inc. MKL17Z128VFM4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL1 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-UFQFN Exposed Pad | MKL17Z128 | 32-QFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312801528 | 3A991A2 | 8542.31.0001 | 5,000 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 3.6V | A/D 11x16b; D/A 1x12b | Internal |
| NXP USA Inc. MKL17Z128VFT4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL1 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-UFQFN Exposed Pad | MKL17Z128 | 48-QFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 40 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 3.6V | A/D 18x16b; D/A 1x12b | Internal | ||
| NXP USA Inc. MKL17Z128VMP4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL1 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LFBGA | MKL17Z128 | 64-MAPBGA (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320724518 | 3A991A2 | 8542.31.0001 | 2,500 | 54 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 3.6V | A/D 20x16b; D/A 1x12b | Internal | |
| NXP USA Inc. MKL17Z32VDA4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL1 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 36-XFBGA | MKL17Z32 | 36-XFBGA (3.5x3.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 32 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, FlexIO, SPI, UART/USART | DMA, I²S, PWM, WDT | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.71V ~ 3.6V | A/D 15x16b | Internal |
