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Microcontrollers(99682)
| Image | Name | Manufacturer | Quantity | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. FS32K144ULT0VLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | FS32K144 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 1,500 | 58 | ARM® Cortex®-M4F | 32-Bit Single-Core | 112MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 64K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A1x8b | Internal | |
| NXP USA Inc. MC9S08AW16CPUER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | MC9S08 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,500 | 54 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | |||
| NXP USA Inc. FS32K116BRT0MFMR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | FS32K116 | 32-HVQFN (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 5,000 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | DMA, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 17K x 8 | 2.7V ~ 5.5V | A/D 13x12b SAR; D/A 1x8b | Internal | ||
| NXP USA Inc. FS32K146HFT0MLQT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | FS32K146 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 300 | 128 | ARM® Cortex®-M4F | 32-Bit Single-Core | 80MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | 1MB (1M x 8) | FLASH | 4K x 8 | 128K x 8 | 2.7V ~ 5.5V | A/D 24x12b SAR; D/A1x8b | Internal | |
 |
NXP USA Inc. SP5744BBK1AVKU2R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SP5744 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 500 | 129 | e200z4 | 32-Bit Single-Core | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | |||
| NXP USA Inc. SP5746BHK1AMMH6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LFBGA | SP5746 | 100-MAPBGA (11x11) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,500 | 65 | e200z4 | 32-Bit Single-Core | 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||
| NXP USA Inc. SPC5748CSK0AMMJ6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 256-LBGA | SPC5748 | 256-MAPPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 450 | 178 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3.15V ~ 5.5V | A/D 48x10b, 16x12b | Internal | |||
| NXP USA Inc. SPC5602BK0MLH6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | SPC5602 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,500 | 45 | e200z0h | 32-Bit Single-Core | 64MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 64K x 8 | 24K x 8 | 3V ~ 5.5V | A/D 12x10b | Internal | |||
| NXP USA Inc. SPC5604BF2CLL4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | SPC5604 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 450 | 79 | e200z0h | 32-Bit Single-Core | 48MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 64K x 8 | 32K x 8 | 3V ~ 5.5V | A/D 28x10b | Internal | |||
| NXP USA Inc. S9S12G48AVLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,250 | 40 | CPU12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 1.5K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||
| NXP USA Inc. S9KEAZN64AVLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | S9KEAZN64 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 2,000 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||||
|
NXP USA Inc. SPC5745BK1AMKU6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5745 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 500 | 129 | e200z4 | 32-Bit Single-Core | 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | |||
|
NXP USA Inc. SPC5746BSK1AVKU2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5746 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 200 | 129 | e200z4 | 32-Bit Single-Core | 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | |||
| NXP USA Inc. SPC5744CFK1ACMH2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LFBGA | SPC5744 | 100-MAPBGA (11x11) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 880 | 65 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||
| NXP USA Inc. MKM33Z64ACLH5R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KM | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | MKM33Z64 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,500 | 38 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | DMA, LCD, WDT | 64KB (64K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 6x16b, 24b SAR, Sigma; D/A 4x6b | Internal | |||
| NXP USA Inc. FS32K146HRT0MLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | FS32K146 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 1,500 | 58 | ARM® Cortex®-M4F | 32-Bit Single-Core | 80MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | 1MB (1M x 8) | FLASH | 4K x 8 | 128K x 8 | 2.7V ~ 5.5V | A/D 24x12b SAR; D/A1x8b | Internal | |
| NXP USA Inc. S9S12GN16BMTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | S9S12 | 20-TSSOP | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 2,250 | 14 | CPU12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | ||||
| NXP USA Inc. MC9S08PL32CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 30 | S08 | 8-Bit | 20MHz | LINbus, SCI, UART/USART | LVD, POR, PWM | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | |
|
NXP USA Inc. SPC5741PK1AMMM5R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 257-LFBGA | SPC5741 | 257-LFBGA (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,000 | e200z4 | 32-Bit Dual-Core | 150MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3.15V ~ 5.5V | A/D 64x12b | Internal | ||||
| NXP USA Inc. SPC5744CFK1ACMH6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LFBGA | SPC5744 | 100-MAPBGA (11x11) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 880 | 65 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||
| NXP USA Inc. FS32K142HFT0VLLT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | FS32K142 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 450 | 89 | ARM® Cortex®-M4F | 32-Bit Single-Core | 80MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A1x8b | Internal | |
|
NXP USA Inc. S9S12P64J0MFTR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | S9S12 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 2,000 | 34 | CPU12V1 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 4K x 8 | 4K x 8 | 3.15V ~ 5.5V | A/D 10x12b | Internal | ||
|
NXP USA Inc. SPC5748CK0AMKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5748 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3.15V ~ 5.5V | A/D 48x10b, 16x12b | Internal | ||
|
NXP USA Inc. SPC5744CBK1ACKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5744 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | |||
| NXP USA Inc. S9KEAZ64AVLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | S9KEAZ64 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1,500 | 58 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR | Internal | |||
|
NXP USA Inc. SPC5748CSK0AMKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5748 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3.15V ~ 5.5V | A/D 48x10b, 16x12b | Internal | ||
|
NXP USA Inc. SPC5747CBK0ACKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5747 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3.15V ~ 5.5V | A/D 48x10b, 16x12b | Internal | ||
| NXP USA Inc. FS32K144HAT0VLLR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | FS32K144 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 1,000 | 89 | ARM® Cortex®-M4F | 32-Bit Single-Core | 80MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 64K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A1x8b | Internal | |
|
NXP USA Inc. SPC5745RK1MMT5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 252-LFBGA | SPC5745 | 252-MAPBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 450 | e200z424 | 32-Bit Tri-Core | 200MHz | CANbus, Ethernet, I²C, LINbus, SCI, SPI, UART/USART | DMA, LVD, POR, Zipwire | 3MB (3M x 8) | FLASH | - | 256K x 8 | 3.5V ~ 5.5V | - | Internal | ||||
| NXP USA Inc. FS32K116LFT0VLFT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | FS32K116 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 250 | 43 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | DMA, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 17K x 8 | 2.7V ~ 5.5V | A/D 13x12b SAR; D/A 1x8b | Internal |
