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ALLCHIPS ELECTRONICS LIMITED

AMD XCVM1302-1LSINBVB1024

XCVM1302-1LSINBVB1024


  • Manufacturer: AMD
  • Origchip NO: XCVM1302-1LSINBVB1024
  • Package: 1024-BFBGA
  • Datasheet: pdfPDF
  • Stock: 4749
  • Description: XCVM1302-1LSINBVB1024(Kg)

Quantity:

In Stock

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr AMD
Series Versal™ Prime
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ Prime FPGA, 70k Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1024-BFBGA
Supplier Device Package 1024-BGA (31x31)
Number of I/O 316
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Other Names 122-XCVM1302-1LSINBVB1024
Standard Package 1
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA, 70k Logic Cells 400MHz, 1GHz 1024-BGA (31x31)

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