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ALLCHIPS ELECTRONICS LIMITED

AMD XCVM1302-2MLINSVF1369

XCVM1302-2MLINSVF1369


  • Manufacturer: AMD
  • Origchip NO: XCVM1302-2MLINSVF1369
  • Package: 1369-BFBGA
  • Datasheet: pdfPDF
  • Stock: 8243
  • Description: XCVM1302-2MLINSVF1369(Kg)

Quantity:

In Stock

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr AMD
Series Versal™ Prime
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.4GHz
Primary Attributes Versal™ Prime FPGA, 70k Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1369-BFBGA
Supplier Device Package 1369-BGA (35x35)
Number of I/O 316
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Other Names 122-XCVM1302-2MLINSVF1369
Standard Package 1
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA, 70k Logic Cells 600MHz, 1.4GHz 1369-BGA (35x35)

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