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ALLCHIPS ELECTRONICS LIMITED

AMD XCVC1902-2HSIVSVD1760

XCVC1902-2HSIVSVD1760


  • Manufacturer: AMD
  • Origchip NO: XCVC1902-2HSIVSVD1760
  • Package: 1760-BFBGA, FCBGA
  • Datasheet: pdfPDF
  • Stock: 3222
  • Description: XCVC1902-2HSIVSVD1760(Kg)

Quantity:

In Stock

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr AMD
Series Versal™ AI Core
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz, 1.65GHz
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)
Number of I/O 726
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN 3A001A7B
HTSUS 8542.39.0001
Other Names 122-XCVC1902-2HSIVSVD1760
Standard Package 1
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1.9M Logic Cells 800MHz, 1.65GHz 1760-FCBGA (40x40)

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