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ALLCHIPS ELECTRONICS LIMITED

Micron Technology Inc. 53E1G64D4HJ-046 WT:C

MT53E1G64D4HJ-046 WT:C


  • Manufacturer: Micron Technology Inc.
  • Origchip NO: 53E1G64D4HJ-046 WT:C
  • Package: 556-TFBGA
  • Datasheet: pdfPDF
  • Stock: 3134
  • Description: MT53E1G64D4HJ-046 WT:C(Kg)

Quantity:

Qty

Unit Price

Ext Price

  • 1360

    $42.45

    $57,732.00

Not the price you want? Send RFQ Now and we'll contact you ASAP.

In Stock

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Purchase & Inquiry

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Means of Payment

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RFQ (Request for Quotations)

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Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.

SPECIFICATIONS

Parameters
Mfr Micron Technology Inc.
Series -
Package Box
Product Status Active
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4X
Memory Size 64Gbit
Memory Organization 1G x 64
Memory Interface Parallel
Clock Frequency 2.133 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.5 ns
Voltage - Supply 1.06V ~ 1.17V
Operating Temperature -30°C ~ 85°C (TC)
Mounting Type Surface Mount
Package / Case 556-TFBGA
Supplier Device Package 556-WFBGA (12.4x12.4)
Other Names 557-MT53E1G64D4HJ-046WT:C
Standard Package 1
SDRAM - Mobile LPDDR4X Memory IC 64Gbit Parallel 2.133 GHz 3.5 ns 556-WFBGA (12.4x12.4)

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